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1. 发明授权

US08015690B2 Shield method for electronic component enclosure and shield material 有权
标题翻译：电子元件外壳和屏蔽材料的屏蔽方法
公开(公告)号：US08015690B2
公开(公告)日：2011-09-13
申请号：US12283711
申请日：2008-09-15
申请人： Yoshikazu Ueno , Haruhiko Kondo , Harumi Kano , Mitsuru Obo , Akito Yoshii , Masahiro Kitamura , Hidenori Iida , Shin Teraki
发明人： Yoshikazu Ueno , Haruhiko Kondo , Harumi Kano , Mitsuru Obo , Akito Yoshii , Masahiro Kitamura , Hidenori Iida , Shin Teraki
IPC分类号： H05K9/00 , H01S4/00
CPC分类号： H05K9/0086 , H04N5/2252 , H04N5/2257 , Y10T29/49002
摘要： The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.
摘要翻译：本发明的目的是提供一种屏蔽方法和屏蔽材料，其能够保持具有外壳形状的柔性程度并使电子部件外壳成为小型和薄型。本发明的电子部件外壳的屏蔽方法包括其中在基片上形成导电层的工艺，并且在与基层相对的面上形成非硬化粘合剂层的屏蔽片被冲压成适合用于形成屏蔽材料的单个电子部件外壳，其中屏蔽材料附接到所述电子部件外壳的工艺，以及其中在所述电子部件外壳的接地电极和导电层之间形成导电粘合剂的工艺，电连接。

2. 发明申请

US20090223711A1 Shield method for electronic component enclosure and shield material 有权
标题翻译：电子元件外壳和屏蔽材料的屏蔽方法
公开(公告)号：US20090223711A1
公开(公告)日：2009-09-10
申请号：US12283711
申请日：2008-09-15
申请人： Yoshikazu Ueno , Haruhiko Kondo , Harumi Kano , Misuru Obo , Akito Yoshii , Mashiro Kitamura , Hidenori Iida , Shin Teraki
发明人： Yoshikazu Ueno , Haruhiko Kondo , Harumi Kano , Misuru Obo , Akito Yoshii , Mashiro Kitamura , Hidenori Iida , Shin Teraki
IPC分类号： H05K9/00
CPC分类号： H05K9/0086 , H04N5/2252 , H04N5/2257 , Y10T29/49002
摘要： The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.
摘要翻译：本发明的目的是提供一种屏蔽方法和屏蔽材料，其能够保持具有外壳形状的柔性程度并使电子部件外壳成为小型和薄型。本发明的电子部件外壳的屏蔽方法包括其中在基片上形成导电层的工艺，并且在与基层相对的面上形成非硬化粘合剂层的屏蔽片被冲压成适合用于形成屏蔽材料的单个电子部件外壳，其中屏蔽材料附接到所述电子部件外壳的工艺，以及其中在所述电子部件外壳的接地电极和导电层之间形成导电粘合剂的工艺，电连接。

3. 发明授权

US09186727B2 Metal particle 有权
标题翻译：金属颗粒
公开(公告)号：US09186727B2
公开(公告)日：2015-11-17
申请号：US13884013
申请日：2011-11-04
申请人： Tomoyuki Takahashi , Akito Yoshii
发明人： Tomoyuki Takahashi , Akito Yoshii
IPC分类号： B22F9/24 , B22F9/18 , B22F1/00 , B22F3/11 , C22C5/06 , C22C5/02 , C22C1/02 , C22C9/00 , C22C5/04 , C22C19/03 , H01B1/02 , H01B1/22
CPC分类号： B22F9/24 , B22F1/0011 , B22F1/0014 , B22F3/11 , B22F9/18 , C22C1/02 , C22C5/02 , C22C5/04 , C22C5/06 , C22C9/00 , C22C19/03 , H01B1/02 , H01B1/22 , Y10T428/12
摘要： A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. The metal particle is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility. When the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance.
摘要翻译：金属颗粒是具有连续开孔的非成核球形多孔材料，由不需要成核剂的中心均匀地生长的树枝晶体形成。金属颗粒不太可能遭受金属颗粒的结合或聚集并且表现出优异的分散性。当导电组合物中使用金属颗粒如导电浆料时，可以在较低温度下获得具有良好导电性能的固化产物，从而可以容易地控制比重或电阻。

4. 发明申请

US20100065790A1 Conductive Composition 有权
标题翻译：导电成分
公开(公告)号：US20100065790A1
公开(公告)日：2010-03-18
申请号：US12512976
申请日：2009-07-30
申请人： Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
发明人： Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
IPC分类号： H01B1/22
CPC分类号： C09J9/02 , C08K3/08 , C08K7/18 , C09J11/04 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/12044 , H01L2924/15787 , H01L2924/00
摘要： Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (
摘要翻译：提供可用作导热组合物并且也可用作导电组合物的导电组合物。组合物包括与烧结助剂组合的导电颗粒组分，其可以例如是纳米金属中相同金属的化合物，有机金属，金属有机盐，硫醇和/或树脂酸盐。在一些实施方案中，导电颗粒包括少量的纳米级（<200nm）颗粒。组合物表现出增加的导热性。

5. 发明申请

US20130221287A1 METAL PARTICLE AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：金属颗粒及其制造方法
公开(公告)号：US20130221287A1
公开(公告)日：2013-08-29
申请号：US13884013
申请日：2011-11-04
申请人： Tomoyuki Takahash , Akito Yoshii
发明人： Tomoyuki Takahash , Akito Yoshii
IPC分类号： B22F1/00 , B22F9/18 , H01B1/22
CPC分类号： B22F9/24 , B22F1/0011 , B22F1/0014 , B22F3/11 , B22F9/18 , C22C1/02 , C22C5/02 , C22C5/04 , C22C5/06 , C22C9/00 , C22C19/03 , H01B1/02 , H01B1/22 , Y10T428/12
摘要： A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles. The metal particle produced by the method, which is a non-nucleated, spherical porous material having continuous open pores, is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility, and, when the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance.
摘要翻译：金属颗粒是具有连续开孔的非成核球形多孔材料，由不需要成核剂的中心均匀地生长的树枝晶体形成。一种金属粒子的制造方法，其特征在于，包括以下步骤：将液态金属盐和多元羧酸混合; 向所得混合物中加入还原剂以沉积金属颗粒; 并干燥沉积的金属颗粒。通过该方法制造的金属颗粒是具有连续开孔的非成核球形多孔材料，不太可能发生金属颗粒的结合或聚集并表现出优异的分散性，并且当金属颗粒用于导电可以在比较低的温度下获得具有良好导电性能的固化物，例如导电糊剂，能够容易地控制比重或电阻。

6. 发明授权

US08344523B2 Conductive composition 有权
标题翻译：导电组成
公开(公告)号：US08344523B2
公开(公告)日：2013-01-01
申请号：US12512976
申请日：2009-07-30
申请人： Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
发明人： Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
IPC分类号： H01B1/22
CPC分类号： C09J9/02 , C08K3/08 , C08K7/18 , C09J11/04 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/12044 , H01L2924/15787 , H01L2924/00
摘要： Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (
摘要翻译：提供可用作导热组合物并且也可用作导电组合物的导电组合物。组合物包括与烧结助剂组合的导电颗粒组分，其可以例如是纳米金属中相同金属的化合物，有机金属，金属有机盐，硫醇和/或树脂酸盐。在一些实施方案中，导电颗粒包括少量的纳米级（<200nm）颗粒。组合物表现出增加的导热性。

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