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1. 发明授权

US06263559B1 Electronic component mounting method and apparatus 有权
标题翻译：电子元件安装方法和装置
公开(公告)号：US06263559B1
公开(公告)日：2001-07-24
申请号：US09670691
申请日：2000-09-28
申请人： Yoshihiro Mimura , Noriaki Yoshida , Osamu Okuda
发明人： Yoshihiro Mimura , Noriaki Yoshida , Osamu Okuda
IPC分类号： B23P2100
CPC分类号： H05K13/08 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： The behavior of a nozzle tip is measured with a jig when the suction nozzle moves vertically and rotatively before the start of production. The nozzle tip displacement is formulated from the results with a component thickness and a mounting angle used as parameters, and the parameters are corrected according to the component thickness and the final mounting angle of the electronic component to be mounted in the production stage.
摘要翻译：当吸嘴在生产开始之前垂直和可旋转地移动时，用夹具测量喷嘴尖端的行为。从作为参数的部件厚度和安装角度的结果来表示喷嘴尖端位移，并且根据要在安装在生产阶段中的电子部件的部件厚度和最终安装角度来校正参数。

2. 发明授权

US6158117A Electronic component mounting method and apparatus 失效
标题翻译：电子元件安装方法和装置
公开(公告)号：US6158117A
公开(公告)日：2000-12-12
申请号：US94982
申请日：1998-06-15
申请人： Yoshihiro Mimura , Noriaki Yoshida , Osamu Okuda
发明人： Yoshihiro Mimura , Noriaki Yoshida , Osamu Okuda
IPC分类号： B23P19/00 , H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/08 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： The behavior of a nozzle tip is measured with a jig when the suction nozzle moves vertically and rotatively before the start of production. The nozzle tip displacement is formulated from the results with a component thickness and a mounting angle used as parameters, and the parameters are corrected according to the component thickness and the final mounting angle of the electronic component to be mounted in the production stage.
摘要翻译：当吸嘴在生产开始之前垂直和可旋转地移动时，用夹具测量喷嘴尖端的行为。从作为参数的部件厚度和安装角度的结果来表示喷嘴尖端位移，并且根据要在安装在生产阶段中的电子部件的部件厚度和最终安装角度来校正参数。

3. 发明授权

US06519838B1 Component mounting apparatus 失效
标题翻译：组件安装设备
公开(公告)号：US06519838B1
公开(公告)日：2003-02-18
申请号：US09515498
申请日：2000-02-29
申请人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
发明人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
IPC分类号： B23P1900
CPC分类号： H05K13/0409 , Y10T29/49131 , Y10T29/53087 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261
摘要： A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards. Also, a remaining-component discarding device performs an operation of discarding a component which remains at the suction nozzle during a time period following the component-mounting operation while the component mounting section is kept halted.
摘要翻译：部件安装装置包括：板部件传送部，用于在部件安装位置上承载电路板，并在部件安装操作之后执行电路板。提供了一个部件供给部分，用于将一个要安装到电路板上的部件供给到一个特定的位置;一个部件安装部分，用于装载一个与待安装部件相匹配的吸嘴，从部件上吸取部件进给部分并将组件移动到安装位置，并将组件安装在电路板的指定位置。提供用于控制各个部分的操作的控制器是为了执行部件安装到电路板上的生产操作。此外，剩余部件丢弃装置在部件安装部分被停止的同时，在部件安装操作之后的时间段期间执行废弃在吸嘴处残留的部件的操作。

4. 发明授权

US06868603B2 Method of mounting component on circuit board 失效
标题翻译：组件安装在电路板上的方法
公开(公告)号：US06868603B2
公开(公告)日：2005-03-22
申请号：US10076300
申请日：2002-02-19
申请人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
发明人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0409 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.
摘要翻译：一种部件安装方法，其包括在部件安装位置上携带电路板并在部件安装操作之后执行电路板。部件安装操作包括从部件供给部分吸取部件并将部件移动到安装位置，并将部件安装在电路板的指定位置。此外，在部件安装操作停止的同时，在部件安装操作之后的指定时间段内执行剩余部件废弃操作以丢弃保留在吸嘴处的部件。

5. 发明授权

US06466837B1 Parts installation method and parts mounting method and mounter 有权
标题翻译：零件安装方法和零件安装方法和贴装机
公开(公告)号：US06466837B1
公开(公告)日：2002-10-15
申请号：US09308889
申请日：1999-07-08
申请人： Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
发明人： Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
IPC分类号： G06F700
CPC分类号： H05K13/0478 , H05K13/0409 , H05K13/0452 , H05K13/0812 , Y10T29/53178
摘要： A parts mounter including a unit for supplying a part, circuit board supporting means for fastening a circuit board when mounting a part, parts mounting means including a mechanism loaded with a suction nozzle and for vertically moving the suction nozzle when sucking and holding a part, and for positioning the suction nozzle at any position, and nozzle exchanging means including a mechanism for removing and installing a requested suction nozzle from and to the parts mounting means. The parts mounting means further includes a nozzle existence checking sensor for performing detection of conditions of a suction nozzle loaded to the parts mounting means.
摘要翻译：一种零件安装机，包括用于供应零件的单元，用于在安装零件时紧固电路板的电路板支撑装置，包括装有吸嘴的机构的部件安装装置，以及用于在吸入和保持部件时垂直移动吸嘴，并且用于将吸嘴定位在任何位置，以及喷嘴更换装置，其包括用于从所述部件安装装置移除和安装所要求的吸嘴的机构。部件安装装置还包括用于检测装载到部件安装装置的吸嘴的状态的喷嘴存在检查传感器。

6. 发明授权

US5867897A Method of mounting electronic components 失效
标题翻译：安装电子元器件的方法
公开(公告)号：US5867897A
公开(公告)日：1999-02-09
申请号：US601324
申请日：1996-02-16
申请人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
IPC分类号： H05K13/04
CPC分类号： H05K13/0408 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： An electronic component mounting method for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.
摘要翻译：一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装方法包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件根据吸嘴的上下运动速度安装在板上，并且独立地用于当吸附有吸嘴的部件和吸附部件安装在板上时的每一个。一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为安装在板上。

7. 发明授权

US06584683B2 Mounting electronic component method and apparatus 失效
标题翻译：安装电子元件的方法和装置
公开(公告)号：US06584683B2
公开(公告)日：2003-07-01
申请号：US09769515
申请日：2001-01-26
申请人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
发明人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
IPC分类号： H05K330
CPC分类号： H05K13/0413 , H05K13/0813 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53191
摘要： In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.
摘要翻译：在电子部件安装方法和装置中，从电子部件供给位置取出电子部件，检测出部件的姿势，根据检测结果将部件安装在基板上。该方法包括从进给位置利用组件的照相机获取图像数据，用用于检测部件姿势的多种算法处理获取的图像数据，以及检测部件的姿势。

8. 发明授权

US6094808A Apparatus for mounting electronic components 失效
标题翻译：用于安装电子部件的装置
公开(公告)号：US6094808A
公开(公告)日：2000-08-01
申请号：US192400
申请日：1998-11-16
申请人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/0408 , Y10T29/4913 , Y10T29/49144 , Y10T29/53022 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.
摘要翻译：一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装装置，包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件安装在板上。空气压力切换定时根据吸嘴的上下运动速度进行切换，并且独立地用于当吸附有吸入部件的部件和吸附部件安装在基板上时。一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为安装在板上。

9. 发明授权

US06289256B1 Method and apparatus for mounting parts 失效
标题翻译：安装零件的方法和装置
公开(公告)号：US06289256B1
公开(公告)日：2001-09-11
申请号：US09008611
申请日：1998-01-15
申请人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
发明人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
IPC分类号： G06F1900
CPC分类号： G05B19/416 , G05B2219/43155 , G05B2219/45029 , Y10T29/53178
摘要： A control device controls to move a chucking mechanism part to a first stop height 451 at a first speed, then at a second speed lower than the first speed before the chucking mechanism part comes in touch with a part from the first stop height, and stop when the chucking mechanism part touches the part, thereby to hold the part. So, a shock to the part when the part is held is reduced in the constitution, and the apparatus becomes light-weight because of the elimination of a shock-absorbing mechanism, hence realizing high-speed mounting.
摘要翻译：控制装置控制将夹紧机构部件以第一速度移动到第一停止高度451，然后以比第一速度低的第二速度移动到夹紧机构部分与第一停止高度部分接触之前，并且停止当夹紧机构部分接触该部分时，从而保持该部分。因此，当部件保持时对部件的冲击减小，并且由于消除了减震机构而使设备变得轻巧，从而实现了高速安装。

10. 发明授权

US6041494A Electronic part mounting method 失效
标题翻译：电子零件安装方式
公开(公告)号：US6041494A
公开(公告)日：2000-03-28
申请号：US29477
申请日：1998-02-24
申请人： Yoshihiro Mimura , Noriaki Yoshida , Junichi Hada
发明人： Yoshihiro Mimura , Noriaki Yoshida , Junichi Hada
IPC分类号： B23P21/00 , H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/08 , H05K13/0413 , H05K13/0452 , Y10T29/4913 , Y10T29/49139 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183
摘要： The maintenance of nozzles is carried out efficiently and smoothly by automatically identifying a defective nozzle, hence contributing to the increase of productivity. A method of mounting electronic components implemented in an electronic component mounting apparatus which includes an electronic component mounting means (7) provided with a plurality of nozzles (13) for attracting by suction and mounting electronic components (14), an imaging means (15) for shooting an image of the electronic component (14) held by the nozzle (13), and a recognition controlling means (16) for analyzing the image of the electronic component (14) recorded by the imaging means (15) to inspect the condition of the electronic component (14) being attracted, comprises the steps of taking an image of a tip surface of the nozzle (13) with the imaging means (15) which has repeated a suction error by a specific number of times, analyzing the image with the recognition controlling means (16) to inspect the condition of the tip surface of the nozzle (13), and judging the said nozzle (13) as a defective nozzle.
摘要翻译： PCT No.PCT / JP97 / 02266 Sec。 371日期：1998年2月24日 102（e）1998年2月24日PCT 1997年6月26日PCT公布。出版物WO97 / 50286 日期1997年12月31日通过自动识别缺陷喷嘴，有效且平稳地进行喷嘴的维护，从而有助于提高生产率。一种安装在电子部件安装装置中的电子部件的安装方法，该电子部件安装装置包括：电子部件安装部件（7），具有吸引吸引和安装电子部件（14）的多个喷嘴（13），成像部件（15）用于拍摄由喷嘴（13）保持的电子部件（14）的图像;以及识别控制装置（16），用于分析由成像装置（15）记录的电子部件（14）的图像，以检查条件所述电子部件（14）被吸引的步骤包括以下步骤：用已经重复抽吸误差一定次数的成像装置（15）拍摄喷嘴（13）的尖端表面的图像，分析图像识别控制装置（16）检查喷嘴（13）的尖端表面的状态，并将所述喷嘴（13）判断为缺陷喷嘴。

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