专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06183545B2 Aqueous solutions for obtaining metals by reductive deposition 有权
标题翻译：用于通过还原沉积获得金属的水溶液
公开(公告)号：US06183545B2
公开(公告)日：2001-02-06
申请号：US09340894
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C25D3/02 , C22B3/0051 , C22B11/046 , C23C18/42 , Y02P10/214 , Y02P10/234
摘要： An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
摘要翻译：一种用于金属还原沉积的水溶液，除了水以外还包含（A）通式（1）的膦，其中R 1，R 2和R 3表示低级烷基，其中至少一个是羟基或氨基 - 取代的低级烷基，和（B）通过所述膦形成可溶性络合物而溶解的金属或金属化合物的可溶性化合物。

2. 发明授权

US06235093B1 Aqueous solutions for obtaining noble metals by chemical reductive deposition 有权
标题翻译：通过化学还原沉积获得贵金属的水溶液
公开(公告)号：US06235093B1
公开(公告)日：2001-05-22
申请号：US09340892
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C23C18/44
摘要： An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.
摘要翻译：一种用于通过化学还原获得贵金属的水溶液，其含有至少一种选自金，铂，银和钯的金属的水溶性化合物或络合物作为待沉积金属的来源，以及在至少一种巯基化合物或硫化物化合物或其盐作为还原剂。还原剂通常为巯基乙酸，2-巯基丙酸，2-氨基乙硫醇，2-巯基乙醇，葡萄糖半胱氨酸，1-硫代甘油，巯基丙磺酸钠，N-乙酰基甲硫氨酸，硫代水杨酸，2-噻唑啉-2-硫醇，二巯基-1,3,4-噻二唑，2-苯并噻唑硫醇或2-苯并咪唑硫醇。它们可以单独使用或组合使用。

3. 发明授权

US07938948B2 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07938948B2
公开(公告)日：2011-05-10
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C25D3/64 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

4. 发明授权

US07628903B1 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07628903B1
公开(公告)日：2009-12-08
申请号：US09563479
申请日：2000-05-02
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3′-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.
摘要翻译：银和银合金电镀浴包括（A）可溶性盐，其具有银盐或银盐和金属如锡，铋，铟，铅等的盐的混合物; 和（B）特定的脂族硫醚化合物，例如硫代双（二甘醇），二硫代双（三甘油），3,3'-硫代二丙醇，硫二甘油，3,6-二硫辛烷-1,8-二醇等，至少一个或多个醚氧原子，1-羟丙基，羟基亚丙基，或分子中的硫原子键中的两个或多个，并且不含碱性氮原子。与分子中含有不含醚氧原子，1-羟丙基，羟基亚丙基或两个或多个硫键的脂族单硫醚化合物如硫二甘醇或β-硫二甘醇相比，具有这些特定化合物，本发明的电镀浴在延长的时间内具有优异的稳定性，优异的银和各种金属的共沉积，以及优异的电沉积外观。

5. 发明授权

US06607653B1 Plating bath and process for depositing alloy containing tin and copper 有权
标题翻译：电镀浴和沉积含锡和铜合金的工艺
公开(公告)号：US06607653B1
公开(公告)日：2003-08-19
申请号：US09667715
申请日：2000-09-22
申请人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
发明人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
IPC分类号： C25D358
CPC分类号： C25D3/60
摘要： The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
摘要翻译：本发明提供了含有可溶性金属化合物和特定含硫化合物的锡 - 铜合金电镀浴，锡 - 铜 - 铋合金电镀浴或锡 - 铜 - 银合金电镀浴。本发明的电镀液是含有锡和铜的合金电镀液，该浴能够防止铜在锡阳极上的沉积而被置换，镀层组合物对电流密度的依赖性低，浴的稳定性和耐浑浊

6. 发明授权

US5618404A Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use 失效
标题翻译：用于生产铅酸锡和锡磺酸盐的电解工艺用于焊锡电镀
公开(公告)号：US5618404A
公开(公告)日：1997-04-08
申请号：US442535
申请日：1995-05-16
申请人： Yoshiaki Okuhama , Seishi Masaki , Takao Takeuchi , Yoshiharu Matsuda , Masakazu Yoshimoto
发明人： Yoshiaki Okuhama , Seishi Masaki , Takao Takeuchi , Yoshiharu Matsuda , Masakazu Yoshimoto
IPC分类号： C25B3/00 , C25D3/60 , C25B1/00
CPC分类号： C25B3/00 , C25D3/60
摘要： An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive .alpha. particle counts of less than 0.1 CPH/cm.sup.2.
摘要翻译：一种用于生产铅和锡磺酸盐的电解方法，其包括向电解池中的阳极和多个阴极施加DC电压，从而将铅或锡溶解在电解液中。电解池被阳离子交换膜和阴离子交换膜分隔成阳极室和阴极室。电解液是有机磺酸的溶液，阳极是铅或锡。该方法将诸如铀和钍的放射性同位素的含量降低到低于50ppb的水平，因此根据本发明使用铅和锡盐的焊料镀覆形成的涂层显示出小于0.1CPH / cm2。

7. 发明申请

US20070241170A1 FLUX FOR SOLDERING AND CIRCUIT BOARD 有权
标题翻译：焊接电路板
公开(公告)号：US20070241170A1
公开(公告)日：2007-10-18
申请号：US11767194
申请日：2007-06-22
申请人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K31/02
CPC分类号： H05K3/3489 , H05K3/244 , H05K2203/121 , Y10T428/24917
摘要： A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
摘要翻译：助熔剂含有具有成膜能力的树脂，活化剂，溶剂和至少一种选自银络合物和铜络合物的络合物。当在具有化学镀镍的电路上进行焊接或在化学镀镍上进一步具有镀金时，使用焊剂。允许银或铜的阻挡层沉积在焊盘的表面上，抑制镍在焊接期间向熔化的焊料合金中扩散，并且还防止磷浓度。这提高了焊接的接合强度，并且抑制了银和/或铜对除了电路图案之外的部分的还原沉积。

8. 发明授权

US07669752B2 Flux for soldering and circuit board 有权
标题翻译：用于焊接和电路板的焊剂
公开(公告)号：US07669752B2
公开(公告)日：2010-03-02
申请号：US11767194
申请日：2007-06-22
申请人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K31/02
CPC分类号： H05K3/3489 , H05K3/244 , H05K2203/121 , Y10T428/24917
摘要： A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
摘要翻译：助熔剂含有具有成膜能力的树脂，活化剂，溶剂和至少一种选自银络合物和铜络合物的络合物。当在具有化学镀镍的电路上进行焊接或在化学镀镍上进一步具有镀金时，使用焊剂。允许银或铜的阻挡层沉积在焊盘的表面上，抑制镍在焊接期间向熔化的焊料合金中扩散，并且还防止磷浓度。这提高了焊接的接合强度，并且抑制了银和/或铜对除了电路图案之外的部分的还原沉积。

9. 发明授权

US06923875B2 Solder precipitating composition 有权
标题翻译：焊锡沉淀组合物
公开(公告)号：US06923875B2
公开(公告)日：2005-08-02
申请号：US10342210
申请日：2003-01-15
申请人： Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K35/34 , B23K35/26 , B23K35/363 , C22C13/00 , H05K3/34 , C23C18/00
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/34 , H05K2203/121
摘要： According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
摘要翻译：根据本发明，提供了一种无铅焊料沉淀组合物，其包含锡粉末，以及银离子和/或铜离子与芳基膦，烷基膦，膦或唑类的络合物。焊料沉淀组合物可以在电路板的焊盘上形成适当的无铅焊料，而不在电路板上形成银和/或铜膜。

10. 发明授权

US06852210B2 Plating method and plating bath precursor used therefor 失效
标题翻译：电镀方法及镀浴前驱体
公开(公告)号：US06852210B2
公开(公告)日：2005-02-08
申请号：US10036506
申请日：2002-01-07
申请人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C23C18/31 , C23C18/16 , C23C18/34 , C25D3/56
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式