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    • 1. 发明申请
    • FABRICATING METHOD OF MOSFET WITH THICK GATE DIELECTRIC LAYER
    • 具有厚栅介质层的MOSFET的制造方法
    • US20080057645A1
    • 2008-03-06
    • US11831443
    • 2007-07-31
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • H01L21/336
    • H01L27/11568H01L27/105H01L27/11573H01L29/513H01L29/7833
    • The fabricating method of a thick gate dielectric layer transistor is disclosed. A substrate including a first and a second regions and isolation structures is provided. A pad layer and a masking layer are formed on the substrate between the isolation structures. After the masking layer and the pad layer in the second region are removed, a dielectric layer and a conductive layer are sequentially formed on the substrate. The conductive layer, the dielectric layer and the pad layer are patterned to form a first gate structure in the first region and a second gate structure in the second region. A first source region and a first drain region are respectively formed in the substrate adjacent to the first gate structure, and a second source region and a second drain region are formed respectively in the substrate adjacent to the second gate structure.
    • 公开了一种厚栅介质层晶体管的制造方法。 提供了包括第一和第二区域和隔离结构的衬底。 在隔离结构之间的衬底上形成衬垫层和掩模层。 在除去第二区域中的掩模层和焊盘层之后,在衬底上依次形成介电层和导电层。 将导电层,电介质层和焊盘层图案化以在第一区域中形成第一栅极结构,在第二区域中形成第二栅极结构。 第一源极区域和第一漏极区域分别形成在与第一栅极结构相邻的衬底中,并且第二源极区域和第二漏极区域分别形成在与第二栅极结构相邻的衬底中。
    • 2. 发明申请
    • NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF
    • 非易失性存储器及其制造方法
    • US20080017917A1
    • 2008-01-24
    • US11778226
    • 2007-07-16
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • H01L29/788H01L21/3205
    • H01L29/7881H01L21/76829H01L27/115H01L27/11521H01L27/11558H01L29/66825
    • A non-volatile memory having an isolation structure, a floating gate transistor, a specific dielectric layer and an erase gate is provided. The isolation structure is disposed in a substrate to define an active region. The floating gate transistor having a floating gate, a tunneling dielectric layer, a first source/drain region and a second source/drain region is disposed on the substrate. The floating gate is disposed on the substrate and runs across the active region. The tunneling dielectric layer is disposed between the floating gate and the substrate. The first source/drain region and the second source/drain region are disposed in the substrate at the sides of the floating gate, respectively. The specific dielectric layer serves as an inter-layer dielectric layer, which is disposed on top of the floating gate. The erase gate is a conductive plug disposed upon the specific dielectric layer.
    • 提供具有隔离结构的非易失性存储器,浮置栅极晶体管,特定介质层和擦除栅极。 隔离结构设置在衬底中以限定有源区。 具有浮置栅极,隧道电介质层,第一源极/漏极区域和第二源极/漏极区域的浮置栅极晶体管设置在衬底上。 浮置栅极设置在衬底上并跨越有源区域。 隧道介电层设置在浮置栅极和衬底之间。 第一源极/漏极区域和第二源极/漏极区域分别设置在浮置栅极的侧面的衬底中。 比电介质层用作层间电介质层,其设置在浮动栅极的顶部。 擦除栅极是设置在特定电介质层上的导电插塞。
    • 9. 发明授权
    • Semiconductor capacitor
    • 半导体电容
    • US08384155B2
    • 2013-02-26
    • US11697070
    • 2007-04-05
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • H01L29/94
    • G11C17/04G11C2216/26H01L27/112H01L27/11206H01L29/94
    • A one time programmable memory cell having a gate, a gate dielectric layer, a source region, a drain region, a capacitor dielectric layer and a conductive plug is provided herein. The gate dielectric layer is disposed on a substrate. The gate is disposed on the gate dielectric layer. The source region and the drain region are disposed in the substrate at the sides of the gate, respectively. The capacitor dielectric layer is disposed on the source region. The capacitor dielectric layer is a resistive protection oxide layer or a self-aligned salicide block layer. The conductive plug is disposed on the capacitor dielectric layer. The conductive plug is served as a first electrode of a capacitor and the source region is served as a second electrode of the capacitor. The one time programmable memory (OTP) cell is programmed by making the capacitor dielectric layer breakdown.
    • 本文提供了具有栅极,栅极介电层,源极区域,漏极区域,电容器电介质层和导电插塞的一次性可编程存储器单元。 栅介质层设置在基板上。 栅极设置在栅极电介质层上。 源极区域和漏极区域分别设置在栅极的侧面的基板中。 电容器介质层设置在源极区域上。 电容器介电层是电阻保护氧化物层或自对准的自对准硅化物阻挡层。 导电插头设置在电容器电介质层上。 导电插头用作电容器的第一电极,源区域用作电容器的第二电极。 一次性可编程存储器(OTP)单元通过使电容器介质层击穿而被编程。
    • 10. 发明申请
    • SEMICONDUCTOR CAPACITOR, ONE TIME PROGRAMMABLE MEMORY CELL AND FABRICATING METHOD AND OPERATING METHOD THEREOF
    • 半导体电容器,一次可编程存储器单元及其制作方法及其工作方法
    • US20120099361A1
    • 2012-04-26
    • US13338632
    • 2011-12-28
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • Chrong-Jung LinHsin-Ming ChenYa-Chin King
    • G11C17/04
    • G11C17/04G11C2216/26H01L27/112H01L27/11206H01L29/94
    • A one time programmable memory cell having a gate, a gate dielectric layer, a source region, a drain region, a capacitor dielectric layer and a conductive plug is provided herein. The gate dielectric layer is disposed on a substrate. The gate is disposed on the gate dielectric layer. The source region and the drain region are disposed in the substrate at the sides of the gate, respectively. The capacitor dielectric layer is disposed on the source region. The capacitor dielectric layer is a resistive protection oxide layer or a self-aligned silicide block layer. The conductive plug is disposed on the capacitor dielectric layer. The conductive plug is served as a first electrode of a capacitor and the source region is served as a second electrode of the capacitor. The one time programmable memory (OTP) cell is programmed by making the capacitor dielectric layer breakdown.
    • 本文提供了具有栅极,栅极介电层,源极区域,漏极区域,电容器电介质层和导电插塞的一次性可编程存储器单元。 栅介质层设置在基板上。 栅极设置在栅极电介质层上。 源极区域和漏极区域分别设置在栅极的侧面的基板中。 电容器介质层设置在源极区域上。 电容器介电层是电阻保护氧化物层或自对准硅化物阻挡层。 导电插头设置在电容器电介质层上。 导电插头用作电容器的第一电极,源区域用作电容器的第二电极。 一次性可编程存储器(OTP)单元通过使电容器介质层击穿而被编程。