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    • 1. 发明申请
    • Plasticized polymer compositions
    • 增塑聚合物组合物
    • US20020165301A1
    • 2002-11-07
    • US10095701
    • 2002-03-13
    • UCB, S.A.
    • August Van GyselJean-Claude Van OverveltAndre NannanPierre GodardJean-Jacques BiebuyckPhilippe De Groote
    • C08K005/43
    • C08K5/435C08L77/00
    • The invention relates to compositions comprising at least one polymer and at least one plasticizer, in which compositions the polymer is semi-crystalline and exhibits a processing temperature equal to or greater than 220null C., preferably 250null C., and the plasticizer is an aromatic benzenesulphonamide represented by the general formula (I) 1 in which R1 represents a hydrogen atom, a C1-C4 alkyl group or a C1-C4 alkoxy group, X represents a linear or branched C2-C10 alkylene group, or a cycloaliphatic group, or an aromatic group, Y represents one of the groups OH or 2 R2 representing a C1-C4 alkyl group or an aromatic group, these groups optionally themselves being substituted by an OH or C1-C4 alkyl group. The aromatic benzenesulphonamides have little volatility and exhibit good thermal stability, which makes it possible to effectively plasticize polyamides which are processed at high temperatures, such as polyamides-6, -6,6, -4,6, -6,9, -6,10, -6,12 and MDX-6 and polyketones, but also polyamides-11 and -12, polyoxymethylene and poly(vinylidene fluoride).
    • 本发明涉及包含至少一种聚合物和至少一种增塑剂的组合物,其中聚合物为半结晶的组合物,其处理温度等于或大于220℃,优选250℃,增塑剂为 由通式(I)表示的芳族苯磺酰胺,其中R 1表示氢原子,C 1 -C 4烷基或C 1 -C 4烷氧基,X表示直链或支链C 2 -C 10亚烷基或脂环族基, 或芳基,Y表示OH或R2中的一个代表C1-C4烷基或芳族基团,这些基团任选地本身被OH或C 1 -C 4烷基取代。 芳香族苯磺酰胺具有很小的挥发性并表现出良好的热稳定性,这使得有可能有​​效地增塑在高温下加工的聚酰胺,例如聚酰胺-6,6,6,-4,6,-6,9,-6 ,10,6-12和MDX-6和聚酮,还有聚酰胺-11和-12,聚甲醛和聚(偏二氟乙烯)。