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1. 发明申请

US20080112585A1 Microphone and microphone mounting structurre 有权
标题翻译：麦克风和麦克风安装结构
公开(公告)号：US20080112585A1
公开(公告)日：2008-05-15
申请号：US11982501
申请日：2007-11-01
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
IPC分类号： H04R11/04
CPC分类号： H04R19/016 , H04R1/021 , H04R1/086 , H04R31/006 , H04R2499/11 , H05K1/181 , H05K2201/09072 , H05K2201/10083 , Y02P70/611
摘要： A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.
摘要翻译：麦克风包含胶囊中的电容器，其中隔膜用作电容器的电极之一。当安装在封闭胶囊的开口的电路板的外表面上的外部端子与安装板上的连接端子面对面地连接时，麦克风安装在安装板上。在电路板上形成一个声孔，并且在安装板上形成通孔，放置在安装麦克风时避免彼此重叠的位置。当外部端子与安装板上的连接端子连接时，形成连通通孔和声孔的封闭空间。

2. 发明授权

US08050443B2 Microphone and microphone mounting structure 有权
标题翻译：麦克风和麦克风安装结构
公开(公告)号：US08050443B2
公开(公告)日：2011-11-01
申请号：US11982501
申请日：2007-11-01
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
IPC分类号： H04R9/08 , H04R11/04 , H04R17/02 , H04R19/04 , H04R25/00
CPC分类号： H04R19/016 , H04R1/021 , H04R1/086 , H04R31/006 , H04R2499/11 , H05K1/181 , H05K2201/09072 , H05K2201/10083 , Y02P70/611
摘要： A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.
摘要翻译：麦克风包含胶囊中的电容器，其中隔膜用作电容器的电极之一。当安装在封闭胶囊的开口的电路板的外表面上的外部端子与安装板上的连接端子面对面地连接时，麦克风安装在安装板上。在电路板上形成一个声孔，并且在安装板上形成通孔，放置在安装麦克风时避免彼此重叠的位置。当外部端子与安装板上的连接端子连接时，形成连通通孔和声孔的封闭空间。

3. 发明申请

US20060285707A1 Electro-acoustic transducer 有权
标题翻译：电声换能器
公开(公告)号：US20060285707A1
公开(公告)日：2006-12-21
申请号：US11449908
申请日：2006-06-08
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
IPC分类号： H04R25/00
CPC分类号： H04R19/00 , H04R19/016
摘要： An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.
摘要翻译：本发明的目的是提供一种具有吸收振动和高频噪声，减少部件数量以及同时防止热传导的效果的电声换能器。根据本发明的电声换能器包括：导电胶囊，具有用于将内部电路电连接到外部物体的开口; 从开口向外突出的端子; 以及作为开口侧上的胶囊的一部分并且与胶囊的内部结构间隔开的凸起部分。凸起部分和端子被布置成使得凸起部分和所有端子能够直接焊接到布线板。凸起部分可以以开口变窄的方式朝向端子延伸。此外，凸起部分可以具有延伸到胶囊的凸起部分和另一部分之间的边界的狭缝。

4. 发明申请

US20060177085A1 Microphone 有权
标题翻译：麦克风
公开(公告)号：US20060177085A1
公开(公告)日：2006-08-10
申请号：US11341257
申请日：2006-01-27
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
IPC分类号： H04R17/02
CPC分类号： H04R19/04 , H04R1/086
摘要： In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mm2 or less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.
摘要翻译：为了使包括防尘处理的麦克风组装过程自动化，本发明的目的是提供一种具有适于自动组装的结构的防尘麦克风。根据本发明，麦克风具有设置在具有声孔并且覆盖声孔的导电壳体（胶囊）中的板状或膜状防尘部。防尘部至少在与声孔对应的区域中具有多个孔，防尘部还具有无孔区域。在驻极体电容麦克风的情况下，从麦克风的性能的观点出发，防尘部是导电的。此外，考虑到回流炉中的焊接，防尘部分是耐热的。理想地设计每个孔，考虑到麦克风的使用环境。然而，如果假设麦克风在嘴口附近使用，每个孔的面积为0.01mm以下。此外，为了提高防尘效果，可以对该孔进行防水处理。

5. 发明授权

US07907743B2 Electro-acoustic transducer 有权
标题翻译：电声换能器
公开(公告)号：US07907743B2
公开(公告)日：2011-03-15
申请号：US11449908
申请日：2006-06-08
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
IPC分类号： H04R25/00
CPC分类号： H04R19/00 , H04R19/016
摘要： An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.
摘要翻译：本发明的目的是提供一种具有吸收振动和高频噪声，减少部件数量以及同时防止热传导的效果的电声换能器。根据本发明的电声换能器包括：导电胶囊，具有用于将内部电路电连接到外部物体的开口; 从开口向外突出的端子; 以及作为开口侧上的胶囊的一部分并且与胶囊的内部结构间隔开的凸起部分。凸起部分和端子被布置成使得凸起部分和所有端子能够直接焊接到布线板。凸起部分可以以开口变窄的方式朝向端子延伸。此外，凸起部分可以具有延伸到胶囊的凸起部分和另一部分之间的边界的狭缝。

6. 发明授权

US07974430B2 Microphone with dust-proof section 有权
标题翻译：麦克风带防尘部分
公开(公告)号：US07974430B2
公开(公告)日：2011-07-05
申请号：US11341257
申请日：2006-01-27
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
IPC分类号： H04R9/08 , H04R11/04 , H04R17/02 , H04R19/04 , H04R21/02 , H04R25/00
CPC分类号： H04R19/04 , H04R1/086
摘要： In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly.According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mm2 or less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.
摘要翻译：为了使包括防尘处理的麦克风组装过程自动化，本发明的目的是提供一种具有适于自动组装的结构的防尘麦克风。根据本发明，麦克风具有设置在具有声孔并且覆盖声孔的导电壳体（胶囊）中的板状或膜状防尘部。防尘部至少在与声孔对应的区域中具有多个孔，防尘部还具有无孔区域。在驻极体电容麦克风的情况下，从麦克风的性能的观点出发，防尘部是导电的。此外，考虑到回流炉中的焊接，防尘部分是耐热的。理想地设计每个孔，考虑到麦克风的使用环境。然而，如果假设麦克风在嘴口附近使用，则每个孔的面积为0.01mm 2或更小。此外，为了提高防尘效果，可以对该孔进行防水处理。

7. 发明授权

US07687723B2 Mounting substrate and microphone mounted thereon 有权
标题翻译：安装在其上的安装基板和麦克风
公开(公告)号：US07687723B2
公开(公告)日：2010-03-30
申请号：US11483303
申请日：2006-07-06
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
IPC分类号： H05K1/16
CPC分类号： H05K3/341 , H04R1/06 , H04R19/016 , H04R31/006 , H05K1/0243 , H05K3/3452 , H05K2201/09809 , H05K2201/0989 , H05K2201/10083 , H05K2201/10583 , H05K2203/1178 , Y02P70/613
摘要： To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.
摘要翻译：为了提供一种安装基板，其需要减少量的焊料并减少焊料在电子部件内部的热效应，以及要安装在基板上的麦克风。根据本发明的安装基板包括：形成在形成在安装基板上的电极的一部分上的焊料部分; 形成为防止焊料部分的焊料流出预定范围的抗蚀剂膜; 以及由不存在电极和抗蚀剂膜构成的气体排出槽，能够使焊接时产生的气体逸出。

8. 发明申请

US20070010141A1 Mounting substrate and microphone mounted thereon 有权
标题翻译：安装在其上的安装基板和麦克风
公开(公告)号：US20070010141A1
公开(公告)日：2007-01-11
申请号：US11483303
申请日：2006-07-06
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi
IPC分类号： H01R4/02
CPC分类号： H05K3/341 , H04R1/06 , H04R19/016 , H04R31/006 , H05K1/0243 , H05K3/3452 , H05K2201/09809 , H05K2201/0989 , H05K2201/10083 , H05K2201/10583 , H05K2203/1178 , Y02P70/613
摘要： To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below. That is, the electrode formed on the mounting substrate includes a central electrode part that faces the central terminal, a plurality of outer electrode parts that face part of the peripheral terminal, and a linkage electrode part that interconnects the outer electrode parts. The solder part is formed on each of the central electrode part and the outer electrode parts. The gas-escape groove is configured to allow the gas inside the peripheral terminal to escape to the outside.
摘要翻译：为了提供一种安装基板，其需要减少量的焊料并减少焊料在电子部件内部的热效应，以及要安装在基板上的麦克风。根据本发明的安装基板包括：形成在形成在安装基板上的电极的一部分上的焊料部分; 形成为防止焊料部分的焊料流出预定范围的抗蚀剂膜; 以及由不存在电极和抗蚀剂膜构成的气体排出槽，能够使焊接时产生的气体逸出。在具有中心端子和外围端子的部件安装在安装基板上的情况下，安装基板的各部分具有下述特征。也就是说，形成在安装基板上的电极包括面向中心端子的中心电极部件，与外围端子的一部分相对的多个外部电极部件和互连外部电极部件的连接电极部件。焊料部分形成在每个中心电极部分和外部电极部分上。排气槽构造成允许外围端子内的气体逸出到外部。

9. 发明授权

US08724839B2 Unidirectional microphone 有权
标题翻译：单向麦克风
公开(公告)号：US08724839B2
公开(公告)日：2014-05-13
申请号：US13500217
申请日：2010-09-09
申请人： Hiroyuki Harano , Hiroshi Yamagata , Kazuo Ono , Kensuke Nakanishi
发明人： Hiroyuki Harano , Hiroshi Yamagata , Kazuo Ono , Kensuke Nakanishi
IPC分类号： H04R19/01
CPC分类号： H04R19/04
摘要： A unidirectional microphone includes a cylindrical capsule, a front plate blocking one end of the cylindrical capsule, a front plate sound hole formed in the front plate, a vibrating membrane and a first rear pole plate that are housed in the cylindrical capsule and form capacitance, a substrate blocking another open end of the capsule, and a rear plate sound hole formed in the substrate. The front plate sound hole and the rear plate sound hole are placed on mutually opposite sides of a central axis of the capsule so as to be offset relative to the central axis. The directional axis can be significantly offset relative to the central axis of the microphone using the microphone alone.
摘要翻译：单向麦克风包括圆柱形胶囊，阻挡圆柱形胶囊的一端的前板，形成在前板中的前板声孔，容纳在圆柱形胶囊中并形成电容的振动膜和第一后极板，衬底，其阻挡胶囊的另一开口端，以及形成在衬底中的后板声孔。前板声孔和后板音孔位于胶囊的中心轴线的相对的两侧，以相对于中心轴线偏移。方向轴可以相对于麦克风的中心轴显着地偏移，仅使用麦克风。

10. 发明申请

US20130010981A1 MICROPHONE 有权
标题翻译：麦克风
公开(公告)号：US20130010981A1
公开(公告)日：2013-01-10
申请号：US13583474
申请日：2011-03-10
申请人： Hiroyuki Harano , Hiroshi Yamagata , Kazuo Ono , Kensuke Nakanishi
发明人： Hiroyuki Harano , Hiroshi Yamagata , Kazuo Ono , Kensuke Nakanishi
IPC分类号： H04B15/00
CPC分类号： H04R19/016
摘要： A microphone capable of canceling vibration noise caused by mechanical vibration is provided with, in capsules, a pair of diaphragms and a pair of back plates opposite to the respective diaphragms. A printed circuit board is disposed at the middle of capsules. A pair of diaphragms is disposed close and opposite to the surfaces of the printed circuit board with the printed circuit board disposed therebetween. The difference in distance from a vibration source to the two diaphragms is made small. The microphone has a high canceling effect for canceling vibration noise caused by mechanical vibration.
摘要翻译：能够消除由机械振动引起的振动噪音的麦克风在胶囊中设置有一对隔膜和与相应隔膜相对的一对背板。印刷电路板设置在胶囊的中间。一对隔膜与印刷电路板的表面靠近并相对设置，印刷电路板位于它们之间。从振动源到两个隔膜的距离的差异变小。麦克风具有抵消机械振动引起的振动噪声的高消除效果。

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