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    • 7. 发明授权
    • Thin film magnetic head
    • 薄膜磁头
    • US06920016B2
    • 2005-07-19
    • US10331662
    • 2002-12-31
    • Hideo YamakuraShinji SasakiHidetoshi AnanAkio Takakura
    • Hideo YamakuraShinji SasakiHidetoshi AnanAkio Takakura
    • G11B5/60G11B21/21
    • G11B5/6005
    • A thin film magnetic head includes a three-step configuration including deep and shallow groove surfaces, a super shallow groove surface, and an air bearing surface, and also, island-shaped center rail is provided in the center of the air outflow end of the disk-facing air bearing surface having a boundary on the surface of base alumina between a head element portion and a substrate, without including the surface of the substrate. Further, by providing in the surface of the substrate the super shallow groove surface shallower than a shallow groove surface, an alumina recession between the surface of the substrate and the head element portion, produced in a shallow dual step sub ambient slider, can be eliminated. Magnetic spacing between the head of the head element portion and the magnetic layer of the disk can be thereby reduced.
    • 薄膜磁头包括包括深浅槽表面,超浅槽表面和空气轴承表面的三步构造,并且岛状中心轨道设置在空气流出端的中心 面对面的空气轴承表面,其在基体氧化铝的表面上具有头部元件部分和基底之间的边界,而不包括基底的表面。 此外,通过在基板的表面设置比浅槽表面浅的超浅槽表面,可以消除在浅双步次环境滑块中产生的基板表面和头元件部分之间的氧化铝凹陷 。 因此,头元件部分的头部与盘的磁性层之间的磁性间隔可以减小。
    • 9. 发明申请
    • Method for manufacturing a thin film magnetic head
    • 薄膜磁头制造方法
    • US20070119046A1
    • 2007-05-31
    • US11588866
    • 2006-10-27
    • Takateru SekiAkihiro NambaHideo YamakuraTakahiro Noji
    • Takateru SekiAkihiro NambaHideo YamakuraTakahiro Noji
    • G11B5/127
    • G11B5/3166G11B5/102G11B5/3169G11B5/3173Y10T29/49032Y10T29/49037Y10T29/49041Y10T29/49046Y10T29/49048Y10T29/49052Y10T29/49798
    • Head elements are formed on a wafer in order to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during a thin film magnetic head production process, particularly in an air bearing surface polishing step. The wafer is cut line by line into rovers in each of which the head elements are connected; surfaces to be used as air bearing surfaces of the rover are polished until an MR element height reaches to a predetermined value. After this air bearing surface polishing, an electroconductive polishing liquid is used in a final bearing surface polishing step of finishing the air bearing surfaces to achieve a predetermined shape with high accuracy and a predetermined value of a surface roughness. In order to suppress a pinning defect occurrence rate by suppressing deterioration in pinning strength of a pinned layer of a read element, a specific resistance of the electroconductive polishing liquid is controlled to GΩ·cm or less, preferably 1 GΩ·cm or less. After that, a shallow rail and a deep rail are formed on the air bearing surfaces, and the rover is cut to accomplish thin film magnetic heads.
    • 头元件形成在晶片上,以便抑制在薄膜磁头制造过程中产生的ESD引起的钉扎层的钉扎强度的劣化,特别是在空气轴承表面抛光步骤中。 每个头元件连接的晶片被逐行切割成流动站; 用作流动站的空气轴承表面的表面被抛光直到MR元件高度达到预定值。 在这种空气轴承表面抛光之后,在最终的轴承表面抛光步骤中使用导电研磨液,以完成空气轴承表面,以高精度和预定的表面粗糙度值达到预定的形状。 为了通过抑制读取元件的被钉扎层的钉扎强度的劣化来抑制钉扎缺陷发生率,导电研磨液的比电阻被控制在GOmea.cm以下,优选为1Ggga.cm以下。 之后,在空气轴承表面上形成浅轨和深轨,并且切割流动站以实现薄膜磁头。