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1. 发明申请

US20140318680A1 BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD 有权
标题翻译：粘接装置，粘接系统和粘接方法
公开(公告)号：US20140318680A1
公开(公告)日：2014-10-30
申请号：US14249842
申请日：2014-04-10
申请人： TOKYO ELECTRON LIMITED
发明人： Norio Wada , Goro Furutani , Satoshi Ookawa
IPC分类号： B32B38/18 , B32B38/00
CPC分类号： B32B38/1858 , B32B37/10 , B32B38/004 , B32B2457/14 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.
摘要翻译：根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，按压机构和保持机构。第一保持单元设置有第一加热机构并保持第一基板。第二保持单元设置为面对第一保持单元并设置有第二加热机构，保持第二基板。按压机构相对移动第一保持单元和第二保持单元以接触并按压第一基板和第二基板。保持机构弹性保持第一保持单元和第二保持单元的外周。

2. 发明公开

US20240282617A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD 审中-公开
公开(公告)号：US20240282617A1
公开(公告)日：2024-08-22
申请号：US18442522
申请日：2024-02-15
申请人： Tokyo Electron Limited
发明人： Kimio Motoda , Kenji Sugakawa , Norifumi Kohama , Hideyuki Fukushima , Shintaro Sugihara , Norio Wada
IPC分类号： H01L21/683 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/6838 , H01L21/67288 , H01L21/681 , H01L21/68785
摘要： A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.

3. 发明申请

US20230039173A1 BONDING APPARATUS AND BONDING METHOD 有权
公开(公告)号：US20230039173A1
公开(公告)日：2023-02-09
申请号：US17816810
申请日：2022-08-02
申请人： Tokyo Electron Limited
发明人： Norio Wada , Shintaro Sugihara
IPC分类号： H01L21/67 , H01L21/683 , H01L21/687
摘要： A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

4. 发明申请

US20180323089A1 BONDING APPARATUS AND BONDING METHOD 审中-公开
公开(公告)号：US20180323089A1
公开(公告)日：2018-11-08
申请号：US15967788
申请日：2018-05-01
申请人： Tokyo Electron Limited
发明人： Norio Wada , Norifumi Kohama , Kimio Motoda
IPC分类号： H01L21/67 , H01L21/683
CPC分类号： H01L21/67098 , H01L21/67259 , H01L21/683
摘要： A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

5. 发明授权

US09165803B2 Bonding method, bonding apparatus and bonding system 有权
标题翻译：粘合方法，粘合装置和粘结系统
公开(公告)号：US09165803B2
公开(公告)日：2015-10-20
申请号：US14254966
申请日：2014-04-17
申请人： Tokyo Electron Limited
发明人： Goro Furutani , Norio Wada , Satoshi Ookawa
IPC分类号： H01L21/46 , H01L21/67
CPC分类号： H01L21/67092 , H01L21/67103 , H01L21/67109 , H01L21/67248 , Y10T156/1744
摘要： A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.
摘要翻译：根据本公开的示例性实施例的接合方法包括第一保持处理，第二保持处理，临时接合处理，升温处理和主接合处理。在第一保持处理中，保持目标基板。在第二保持处理中，通过静电吸附保持的玻璃基板。在临时接合处理中，目标基板和玻璃基板在比预定温度低的温度下以比预定的按压力低的按压力暂时接合。在升温处理中，在暂时接合的同时或之后释放玻璃基板的静电吸附的同时，将温度升高至规定温度。在主接合处理中，以预定的按压力进行目标基板和玻璃基板的主要接合。

6. 发明申请

US20140318711A1 BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD 有权
标题翻译：粘接装置，粘接系统和粘接方法
公开(公告)号：US20140318711A1
公开(公告)日：2014-10-30
申请号：US14250061
申请日：2014-04-10
申请人： Tokyo Electron Limited
发明人： Norio Wada , Goro Furutani , Satoshi Ookawa
IPC分类号： H01L21/67
CPC分类号： H01L21/67092 , B30B13/00 , B30B15/064 , B30B15/34 , B32B37/06 , B32B37/08 , B32B37/1009
摘要： A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.
摘要翻译：根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，第一冷却机构，第二冷却机构，第三加热机构和第四加热机构。第一保持单元具有第一加热机构并保持第一基板。第二保持单元具有第二加热机构并保持第二基板。按压机构接触并按压第一基板和第二基板。第一冷却机构通过第一保持单元冷却第一基板。第二冷却机构通过第二保持单元冷却第二基板。第三加热机构加热第一冷却机构。第四加热机构加热第二冷却机构。

7. 发明申请

US20230014665A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20230014665A1
公开(公告)日：2023-01-19
申请号：US17933983
申请日：2022-09-21
申请人： Tokyo Electron Limited
发明人： Kimio Motoda , Norifumi Kohama , Norio Wada , Yosuke Omori , Kenji Sugakawa
IPC分类号： H01L21/67 , H01L21/68 , H01L21/683 , H01L21/687
摘要： A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

8. 发明授权

US10964563B2 Bonding apparatus and bonding method 有权
公开(公告)号：US10964563B2
公开(公告)日：2021-03-30
申请号：US15967788
申请日：2018-05-01
申请人： Tokyo Electron Limited
发明人： Norio Wada , Norifumi Kohama , Kimio Motoda
IPC分类号： H01L21/67 , H01L21/683
摘要： A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

9. 发明申请

US20210035827A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20210035827A1
公开(公告)日：2021-02-04
申请号：US16964008
申请日：2019-01-11
申请人： Tokyo Electron Limited
发明人： Kimio Motoda , Norifumi Kohama , Norio Wada , Yosuke Omori , Kenji Sugakawa
IPC分类号： H01L21/67 , H01L21/683 , H01L21/68 , H01L21/687
摘要： A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

10. 发明授权

US09469093B2 Bonding apparatus, bonding system and bonding method 有权
标题翻译：接合装置，粘接系统和粘接方法
公开(公告)号：US09469093B2
公开(公告)日：2016-10-18
申请号：US14249842
申请日：2014-04-10
申请人： Tokyo Electron Limited
发明人： Norio Wada , Goro Furutani , Satoshi Ookawa
IPC分类号： H01L21/67 , B32B37/10 , B32B38/18 , B32B38/00
CPC分类号： B32B38/1858 , B32B37/10 , B32B38/004 , B32B2457/14 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.
摘要翻译：根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，按压机构和保持机构。第一保持单元设置有第一加热机构并保持第一基板。第二保持单元设置为面对第一保持单元并设置有第二加热机构，保持第二基板。按压机构相对移动第一保持单元和第二保持单元以接触并按压第一基板和第二基板。保持机构弹性保持第一保持单元和第二保持单元的外周。

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