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1. 发明授权

US10573539B2 Substrate liquid processing apparatus 有权
公开(公告)号：US10573539B2
公开(公告)日：2020-02-25
申请号：US15535882
申请日：2015-12-15
申请人： Tokyo Electron Limited
发明人： Hiroshi Komiya , Yasuhiro Takaki , Shinichi Umeno , Koji Tanaka , Takami Satoh , Atsushi Anamoto
IPC分类号： H01L21/67 , B08B3/04
摘要： A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.

2. 发明授权

US10162371B2 Substrate liquid processing apparatus and substrate liquid processing method 有权
公开(公告)号：US10162371B2
公开(公告)日：2018-12-25
申请号：US14536989
申请日：2014-11-10
申请人： Tokyo Electron Limited
发明人： Yasuhiro Takaki , Hiroshi Komiya , Chikara Nobukuni , Keigo Satake , Atsushi Anamoto
IPC分类号： B01F15/00 , B01F3/08 , G05D11/13
摘要： A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

3. 发明申请

US20150131403A1 SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD 审中-公开
标题翻译：基板液体处理装置和底板液体处理方法
公开(公告)号：US20150131403A1
公开(公告)日：2015-05-14
申请号：US14536989
申请日：2014-11-10
申请人： Tokyo Electron Limited
发明人： Yasuhiro Takaki , Hiroshi Komiya , Chikara Nobukuni , Keigo Satake , Atsushi Anamoto
IPC分类号： B01F15/00 , B01F3/08
CPC分类号： G05D11/138
摘要： A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.
摘要翻译：基板液体处理装置包括罐; 循环线处理单元，其通过分支管线连接到循环管线，并且被配置为使用流过循环管线的处理液体在基板上进行液体处理; 处理液生成机构，其通过以受控混合比混合由各原料液源供给的至少两种原料液体来制造处理液; 浓度测量装置，被配置为测量流过所述循环管线的处理液体的浓度和流经所述处理液体供给管线的处理液体的浓度; 以及控制装置，其被配置为基于所测量的处理液体的浓度来控制处理液生成机构。

4. 发明申请

US20130223180A1 LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD, AND STORAGE MEDIUM THAT STORES COMPUTER PROGRAM FOR IMPLEMENTING LIQUID PROCESSING METHOD 有权
标题翻译：液体加工设备，液体加工方法和存储液体加工方法的计算机程序存储介质
公开(公告)号：US20130223180A1
公开(公告)日：2013-08-29
申请号：US13772550
申请日：2013-02-21
申请人： Tokyo Electron Limited
发明人： Hiroshi Komiya , Kazuyoshi Eshima
IPC分类号： B01F15/02
CPC分类号： B01F15/02 , B01F3/088 , B01F5/10 , B01F15/0479 , B01F2003/0896 , B01F2215/0096 , H01L21/6715
摘要： A liquid processing apparatus 200 includes a pure water supply source 20; a pure water flow rate control opening/closing valve 27; a sulfuric acid supply unit 30; a sulfuric acid supply opening/closing valve 34; mixing tanks 11 and 12 configured to mix pure water and sulfuric acid to produce a mixed chemical liquid and connected to a circulation line 100 having a circulation pump 101; a liquid processing unit 210 configured to perform a liquid process on a substrate W with the mixed chemical liquid. A controller 300 controls a pure water supply opening/closing valve 26, the sulfuric acid supply opening/closing valve 34, and the circulation pump 101, such that operation of the circulation pump 101 is started after starting supply of the pure water to the mixing tanks 11 and 12, and then, supply of sulfuric acid to the mixing tanks 11 and 12 is started.
摘要翻译：液体处理装置200包括纯水供给源20; 纯水流量控制开闭阀27; 硫酸供给单元30; 硫酸供给开闭阀34; 混合罐11和12被配置为混合纯水和硫酸以产生混合的化学液体并连接到具有循环泵101的循环管线100; 液体处理单元210，被配置为利用混合的化学液体在基板W上执行液体处理。控制器300控制纯水供给打开/关闭阀26，硫酸供给开闭阀34和循环泵101，使得在开始向混合物供应纯水之后开始循环泵101的操作罐11和12，然后开始向混合罐11和12供应硫酸。

5. 发明授权

US10591935B2 Substrate liquid processing apparatus and substrate liquid processing method 有权
公开(公告)号：US10591935B2
公开(公告)日：2020-03-17
申请号：US16188525
申请日：2018-11-13
申请人： Tokyo Electron Limited
发明人： Yasuhiro Takaki , Hiroshi Komiya , Chikara Nobukuni , Keigo Satake , Atsushi Anamoto
IPC分类号： G05D11/13
摘要： A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

6. 发明申请

US20180358240A1 SUBSTRATE LIQUID PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180358240A1
公开(公告)日：2018-12-13
申请号：US15535882
申请日：2015-12-15
申请人： Tokyo Electron Limited
发明人： Hiroshi Komiya , Yasuhiro Takaki , Shinichi Umeno , Koji Tanaka , Takami Satoh , Atsushi Anamoto
IPC分类号： H01L21/67 , B08B3/04
CPC分类号： H01L21/67023 , B08B3/04 , B08B2203/027 , H01L21/67017 , H01L21/67051 , H01L21/67173 , H01L21/67178 , H01L21/6719
摘要： A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.

7. 发明授权

US09452397B2 Liquid processing apparatus, liquid processing method, and storage medium that stores computer program for implementing liquid processing method 有权
标题翻译：液体处理装置，液体处理方法和存储用于实现液体处理方法的计算机程序的存储介质
公开(公告)号：US09452397B2
公开(公告)日：2016-09-27
申请号：US13772550
申请日：2013-02-21
申请人： Tokyo Electron Limited
发明人： Hiroshi Komiya , Kazuyoshi Eshima
IPC分类号： B01F15/02 , B01F5/10 , B01F15/04 , B01F3/08 , H01L21/67
CPC分类号： B01F15/02 , B01F3/088 , B01F5/10 , B01F15/0479 , B01F2003/0896 , B01F2215/0096 , H01L21/6715
摘要： A liquid processing apparatus 200 includes a pure water supply source 20; a pure water flow rate control opening/closing valve 27; a sulfuric acid supply unit 30; a sulfuric acid supply opening/closing valve 34; mixing tanks 11 and 12 configured to mix pure water and sulfuric acid to produce a mixed chemical liquid and connected to a circulation line 100 having a circulation pump 101; a liquid processing unit 210 configured to perform a liquid process on a substrate W with the mixed chemical liquid. A controller 300 controls a pure water supply opening/closing valve 26, the sulfuric acid supply opening/closing valve 34, and the circulation pump 101, such that operation of the circulation pump 101 is started after starting supply of the pure water to the mixing tanks 11 and 12, and then, supply of sulfuric acid to the mixing tanks 11 and 12 is started.
摘要翻译：液体处理装置200包括纯水供给源20; 纯水流量控制开闭阀27; 硫酸供给单元30; 硫酸供给开闭阀34; 混合罐11和12被配置为混合纯水和硫酸以产生混合的化学液体并连接到具有循环泵101的循环管线100; 液体处理单元210，被配置为利用混合的化学液体在基板W上执行液体处理。控制器300控制纯水供给打开/关闭阀26，硫酸供给开闭阀34和循环泵101，使得在开始向混合物供应纯水之后开始循环泵101的操作罐11和12，然后开始向混合罐11和12供应硫酸。

8. 发明授权

US11353894B2 Liquid processing apparatus and liquid processing method 有权
公开(公告)号：US11353894B2
公开(公告)日：2022-06-07
申请号：US15659750
申请日：2017-07-26
申请人： Tokyo Electron Limited
发明人： Keigo Satake , Hiroshi Komiya , Kouji Ogura
IPC分类号： G05D7/01 , H01L21/67 , G05D7/06
摘要： A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.

9. 发明授权

US11094568B2 Processing apparatus, abnormality detection method, and storage medium 有权
公开(公告)号：US11094568B2
公开(公告)日：2021-08-17
申请号：US15960800
申请日：2018-04-24
申请人： TOKYO ELECTRON LIMITED
发明人： Kenji Nakamizo , Satoshi Morita , Akinori Tanaka , Hiroshi Komiya , Mikio Nakashima , Kousuke Fukuda , Youichi Masaki , Ryoji Ando , Ikuo Sunaka
IPC分类号： H01L21/67 , G01F9/00 , G01M3/28 , G01F25/00 , G05B23/02 , G01F15/00
摘要： A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.

10. 发明授权

US10770316B2 Substrate liquid processing apparatus, substrate liquid processing method and recording medium 有权
公开(公告)号：US10770316B2
公开(公告)日：2020-09-08
申请号：US15777941
申请日：2016-11-17
申请人： Tokyo Electron Limited
发明人： Kazuki Kosai , Yoshihiro Kai , Gentaro Goshi , Hiroshi Komiya , Seiya Fujimoto , Takahisa Otsuka
IPC分类号： H01L21/687 , H01L21/67 , H01L21/3213 , H01L21/306 , H01L21/02 , B08B3/08 , B08B3/04 , B08B3/02
摘要： A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.

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