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    • 3. 发明申请
    • Exposure method and electronic device manufacturing method
    • 曝光方法和电子元件制造方法
    • US20090042139A1
    • 2009-02-12
    • US12071911
    • 2008-02-27
    • Naomasa ShiraishiHideya Inoue
    • Naomasa ShiraishiHideya Inoue
    • G03F7/20
    • G03F7/70783G03F7/70266G03F7/703G03F7/70425G03F7/70633G03F9/7003G03F9/7084G03F9/7088H01L23/544H01L2223/54453H01L2223/5446H01L2223/5448H01L2924/0002H01L2924/00
    • An exposure method enabling deformation occurring in a unit exposure field to be measured rapidly and accurately and enabling a plurality of patterns to be superimposed on a substrate with high accuracy. The exposure method of the present embodiment for exposing a bright-dark pattern on the substrate using a projection optical system includes a position detection process for detecting the positions of a plurality of position detection marks, relative to a substrate-in-plane-direction of the substrate, arranged in at least one functional element in a unit exposure field of the substrate, a deformation calculation process for calculating the state of deformation occurring in the unit exposure field based on information related to the positions of the position detection marks obtained in the position detection process, and a shape modification process for modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation process.
    • 能够快速,准确地测量在单位曝光场中发生变形的曝光方法,能够将多个图案高精度地叠加在基板上。 使用投影光学系统在基板上曝光明暗图案的本实施例的曝光方法包括:位置检测处理,用于检测多个位置检测标记相对于基板的平面方向的位置 基板,布置在基板的单位曝光区域中的至少一个功能元件中,基于与在所述基板中获得的位置检测标记的位置相关的信息来计算在单位曝光区域中发生的变形状态的变形计算处理 位置检测处理,以及用于基于在变形计算处理中获得的变形状态来修改要暴露在基板上的亮暗图案的形状的形状修改处理。
    • 9. 发明授权
    • Exposure method and apparatus, and method of fabricating a device
    • 曝光方法和装置以及制造装置的方法
    • US06731371B1
    • 2004-05-04
    • US09690591
    • 2000-10-18
    • Naomasa Shiraishi
    • Naomasa Shiraishi
    • G03B2752
    • G03F7/70933G03B27/52G03F7/70816
    • The image of a pattern of reticle 12 is, being illuminated with exposure light IL of vacuum ultraviolet range, projected, via projection optical system PL, onto wafer 17a on wafer stage 18a in wafer chamber 24. By providing gas blowing plate 15 in which aperture portion 15a for the exposure light optical path is provided between projection optical system PL and wafer 17a, exhausting a gas in the first space S1 over gas blowing plate 15 via exhaust port G1e, purifying the exhausted gas, and then by blowing the purified gas again into space S1 via gas supply port G1i, outgases from wafer 17a are efficiently exhausted. Into the second space S2 under gas blowing plate 15 is supplied a gas of which contamination degree of impurities is controlled to be more relaxed compared with the gas in the first space S1. By this, even when using vacuum ultraviolet light as exposure light, with the decrease of transmittance on the optical path being controlled, a high exposure light intensity can be obtained.
    • 标线片12的图案被真空紫外线范围的曝光光IL照射,经由投影光学系统PL投影到晶片室24中的晶片台18a上的晶片17a上。通过提供气体吹入板15,其中孔 用于曝光光路的部分15a设置在投影光学系统PL和晶片17a之间,通过排气口G1e排出气体吹出板15上的第一空间S1中的气体,净化排出的气体,然后再次吹送净化气体 通过气体供给口G1i进入空间S1,能够有效地排出来自晶片17a的气体。 向气体吹入板15内的第二空间S2供给与第一空间S1中的气体相比,将杂质的污染程度控制得比较宽松的气体。 由此,即使使用真空紫外线作为曝光光,随着光路上透射率的降低受到控制,也能获得高的曝光光强度。
    • 10. 发明授权
    • Photomask and exposure method
    • 光掩模和曝光方法
    • US06727025B1
    • 2004-04-27
    • US09806593
    • 2001-06-25
    • Naomasa Shiraishi
    • Naomasa Shiraishi
    • G03F900
    • G03F7/70058G03F1/50G03F7/70433G03F7/70958
    • A photomask illuminated with an exposure illuminating light having a short wavelength of, e.g., about 200 nm or less and having an improved uniformity of transmittance distribution. On one surface (B) of a flat substrate (1) made of quartz, a quartz glass, or a quartz glass to which a predetermined impurity is added, a thin film (3) made of a material semitrasparent to the exposure illuminating light. The transmittance distribution for the illuminating light of the substrate (1) is measured prior to the formation of the thin film (3), and the distribution of the thickness of the thin film (3) is determined so as to compensate the unevenness of the transmittance distribution. An original pattern (2) is formed on the opposed surface (A) of the substrate (1) to the surface (B).
    • 用曝光照明的光掩模,其具有短波长例如约200nm或更小,并具有改善的透射率分布均匀性。 在由石英制成的平面基板(1)的一个表面(B)上,添加有预定杂质的石英玻璃或石英玻璃制成由对曝光照明光进行半透明的材料制成的薄膜(3)。 在形成薄膜(3)之前测量基板(1)的照明光的透射率分布,并且确定薄膜(3)的厚度分布,以便补偿薄膜 透光率分布。 在基板(1)的与表面(B)相对的表面(A)上形成原始图案(2)。