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1. 发明授权

US5519176A Substrate and ceramic package 失效
标题翻译：基材和陶瓷包装
公开(公告)号：US5519176A
公开(公告)日：1996-05-21
申请号：US223240
申请日：1994-04-05
申请人： Thomas W. Goodman , Hiroyuki Fujita , Yoshikazu Murakami , Arthur T. Murphy , Daniel I. Amey
发明人： Thomas W. Goodman , Hiroyuki Fujita , Yoshikazu Murakami , Arthur T. Murphy , Daniel I. Amey
IPC分类号： H01L23/12 , H01L23/498 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/14
CPC分类号： H01L24/49 , H01L23/49822 , H01L23/49838 , H05K1/0253 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/49109 , H01L2224/4911 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/3011 , H05K1/0213 , H05K1/0224 , H05K1/0298 , H05K1/0306 , H05K2201/09227 , H05K2201/09681 , H05K3/4629
摘要： A substrate or a ceramic package for packaging semiconductor chips, which comprises an insulating layer having a signal line on one surface of said insulating layer and a power line or ground line corresponding to said signal line on the other surface of said insulating layer. A well-controlled constant high frequency characteristics, and particularly, characteristic impedance, can be obtained on the signal line without being influenced by the power line or ground line.
摘要翻译：一种用于封装半导体芯片的衬底或陶瓷封装，其包括在所述绝缘层的一个表面上具有信号线的绝缘层和对应于所述绝缘层的另一个表面上的所述信号线的电力线或接地线。可以在信号线上获得良好控制的恒定高频特性，特别是特性阻抗，而不受电力线或接地线的影响。

2. 发明授权

US5477419A Method and apparatus for electrically connecting an electronic part to a circuit board 失效
标题翻译：将电子部件电连接到电路板的方法和装置
公开(公告)号：US5477419A
公开(公告)日：1995-12-19
申请号：US226049
申请日：1994-04-11
申请人： Thomas W. Goodman , Hiroyuki Fujita , Yoshikazu Murakami , Arthur T. Murphy
发明人： Thomas W. Goodman , Hiroyuki Fujita , Yoshikazu Murakami , Arthur T. Murphy
IPC分类号： H01L21/60 , H05K3/30 , H05K3/34 , H05K7/02
CPC分类号： H05K3/3484 , H05K3/303 , H05K3/3436 , H05K2201/09909 , H05K2201/10568 , H05K2201/10734 , H05K2201/10992 , H05K2203/0126 , H05K2203/0195 , H05K2203/0338 , H05K2203/043 , H05K2203/044 , Y02P70/613 , Y10T29/49144
摘要： A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.
摘要翻译：一种在其上形成有包括连接部分的电路的板上安装具有端子部分的电子部件的方法。它包括在端子部分的表面上形成导电层的工艺; 在连接部分的表面上形成具有与形成在端子部分的表面上的导电层的熔点不同的熔点的导电层的工艺; 在使端子部的导电层与连接部的导体层接触的状态下熔融具有低熔点的导电层的工序，从而将具有低熔点的导电层熔合到导电层上具有高熔点。此外，该方法包括在端子部分周围的电子部件的表面上形成由耐热材料制成的突出部分的工艺，以及在连接部分或端子部分的至少一个表面上形成导电层的工艺; 以及将连接部与端子部电连接并使突出部与板的表面接触的工序。

3. 发明申请

US20110210370A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20110210370A1
公开(公告)日：2011-09-01
申请号：US12932120
申请日：2011-02-17
申请人： Hitoshi Kamamori , Keiichiro Hayashi , Sadao Oku , Hiroyuki Fujita , Koji Tsukagoshi
发明人： Hitoshi Kamamori , Keiichiro Hayashi , Sadao Oku , Hiroyuki Fujita , Koji Tsukagoshi
IPC分类号： H01L33/40
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/45124 , H01L2224/48227 , H01L2924/01322 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： On a through-electrode (7) formed by filling a conductive material into a though hole of a substrate, nano-metal particles are adhered to form a connection electrode (9). An LED element (3) is electrically connected to the through-electrode (7) via the connection electrode (9). The nano-metal particles can be applied into a desired shape by an inkjet method or a dispenser method, and hence a light emitting device (1) having high electrical connection reliability is realized at low cost.
摘要翻译：在通过将导电材料填充到基板的通孔中形成的通孔（7）上，粘附纳米金属颗粒以形成连接电极（9）。 LED元件（3）经由连接电极（9）与连接电极（7）电连接。可以通过喷墨方法或分配方法将纳米金属颗粒施加到期望的形状，因此以低成本实现了具有高电连接可靠性的发光装置（1）。

4. 发明授权

US08005504B2 Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards 失效
标题翻译：具有符合不兼容通信标准的无线通信功能的无线通信装置
公开(公告)号：US08005504B2
公开(公告)日：2011-08-23
申请号：US11560170
申请日：2006-11-15
申请人： Eiichi Sano , Hiroyuki Fujita
发明人： Eiichi Sano , Hiroyuki Fujita
IPC分类号： H04M1/00
CPC分类号： H04W52/42 , H04B7/0602 , H04B7/0805 , H04B7/0825 , H04M2250/02 , H04M2250/06
摘要： A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.
摘要翻译：提供一种无线通信装置。无线通信装置包括符合不兼容的第一和第二通信标准的无线通信功能。无线通信装置包括执行符合第一通信标准的无线通信操作的第一收发器，并且包括第一发送/接收端口，执行符合第二通信标准的无线通信操作的第二收发器，并且包括第二发送/ 接收端口，由第一和第二收发器共享的共享天线，连接共享天线与第一和第二发送/接收端口的天线连接单元，以及控制单元，其控制第一和第二收发器中的通信操作收发器

5. 发明申请

US20110021695A1 URETHANE (METH) ACRYLATE COMPOSITION AND SEAL MEMBER 审中-公开
标题翻译： URETHANE（METH）丙烯酸酯组合物和密封件
公开(公告)号：US20110021695A1
公开(公告)日：2011-01-27
申请号：US12893121
申请日：2010-09-29
申请人： Kouichi Akiyama , Norihiro Fukuta , Masanori Sukenobu , Souichirou Komiya , Hiroyuki Fujita , Kenji Horie , Takako Oyama , Noriyuki Sera , Hisayoshi Makabe
发明人： Kouichi Akiyama , Norihiro Fukuta , Masanori Sukenobu , Souichirou Komiya , Hiroyuki Fujita , Kenji Horie , Takako Oyama , Noriyuki Sera , Hisayoshi Makabe
IPC分类号： C08L75/04 , C08G18/73 , C08G18/76
CPC分类号： C08F290/06 , C08F283/006 , C08F290/061 , C08F290/067 , C08G18/4288 , C08G18/672 , C08G18/724 , C08G18/73 , C08G18/758 , C08G2190/00 , C09D133/14 , C08G18/42
摘要： A urethane (meth)acrylate composition includes a product of a reaction of a polyester polyol made from a polycarboxylic acid and a polyhydric alcohol, a polyisocyanate, and an active hydrogen-containing (meth)acrylate. Part of the polyhydric alcohol is a diol having a straight chain of 3 to 7 carbon atoms and a side chain on the straight chain. The polyisocyanate includes at least one of hexamethylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, and tetramethylene diisocyanate.
摘要翻译：氨基甲酸酯（甲基）丙烯酸酯组合物包括由多元羧酸和多元醇制成的聚酯多元醇，多异氰酸酯和含活性氢的（甲基）丙烯酸酯反应的产物。多元醇的一部分是具有3至7个碳原子的直链和直链上的侧链的二醇。多异氰酸酯包括六亚甲基二异氰酸酯，二苯基甲烷二异氰酸酯，氢化二苯基甲烷二异氰酸酯和四亚甲基二异氰酸酯中的至少一种。

6. 外观设计

USD631039S1 Personal computer 有权
标题翻译：个人电脑
公开(公告)号：USD631039S1
公开(公告)日：2011-01-18
申请号：US29347543
申请日：2010-03-01
申请人： Sho Sakai , Hiroyuki Fujita
设计人： Sho Sakai , Hiroyuki Fujita

7. 外观设计

USD628996S1 Personal computer 有权
公开(公告)号：USD628996S1
公开(公告)日：2010-12-14
申请号：US29347751
申请日：2010-05-12
申请人： Hiroyuki Fujita , Kohei Okamoto
设计人： Hiroyuki Fujita , Kohei Okamoto

8. 外观设计

USD628995S1 Personal computer 有权
公开(公告)号：USD628995S1
公开(公告)日：2010-12-14
申请号：US29347544
申请日：2010-03-01
申请人： Nobuharu Masuyama , Hiroyuki Fujita , Yukihiro Noda
设计人： Nobuharu Masuyama , Hiroyuki Fujita , Yukihiro Noda

9. 外观设计

USD616435S1 Personal computer 有权
公开(公告)号：USD616435S1
公开(公告)日：2010-05-25
申请号：US29311991
申请日：2009-08-17
申请人： Yu Kurosawa , Hisao Morooka , Hiroyuki Fujita
设计人： Yu Kurosawa , Hisao Morooka , Hiroyuki Fujita

10. 发明申请

US20090096559A1 ELECTROMAGNETIC RELAY 有权
标题翻译：电磁继电器
公开(公告)号：US20090096559A1
公开(公告)日：2009-04-16
申请号：US12297393
申请日：2007-05-11
申请人： Keisuke Yano , Masayuki Noda , Hiroshi Ono , Hiroyuki Fujita
发明人： Keisuke Yano , Masayuki Noda , Hiroshi Ono , Hiroyuki Fujita
IPC分类号： H01H50/54
CPC分类号： H01H50/546 , H01H9/443 , H01H49/00 , H01H50/023 , H01H50/045 , H01H50/36 , H01H50/443 , H01H2050/025
摘要： An electromagnetic relay has a solenoid formed from a wound coil, a movable iron core that is reciprocated upwardly and downwardly in an axial hole of the solenoid, and a movable contact point that reciprocates together with the movable iron core. The movable contact point is contacted and separated with and from a fixed contact point for opening and closing a contact point. An arc generated at a time of opening and closing of the contact point is flowed, in a predetermined direction, by the magnetic field of at least a single permanent magnet placed at a side of the fixed contact point and the movable contact point that are contacted and separated with and from each other. Coil terminals are connected to leader lines of the coil, at least at a single side of the flow of the arc.
摘要翻译：电磁继电器具有由绕线圈形成的螺线管，在螺线管的轴向孔中往复运动的可动铁芯和与可动铁芯往复运动的可动接点。活动触点与固定触点接触和分离，用于打开和关闭触点。在接触点的打开和关闭时产生的电弧在预定方向上通过放置在接触点的固定触点和可动触点的一侧的至少一个永磁体的磁场流动并与彼此分离。线圈端子连接到线圈的引线，至少在电弧流的单侧。

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