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1. 发明申请

US20050242085A1 Line type luminous device and induction heating cooker employing same 有权
标题翻译：线型发光装置和采用相同的感应加热炊具
公开(公告)号：US20050242085A1
公开(公告)日：2005-11-03
申请号：US11179496
申请日：2005-07-13
申请人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
发明人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
IPC分类号： F21V8/00 , H05B6/12
CPC分类号： H05B6/1218 , G02B6/001 , H05B6/1263 , Y02B40/123 , Y10S385/901
摘要： A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.
摘要翻译：发光器件包括一个或多个线形发光单元，每个线形发光单元均包括细长光导，一个或多个光源和反射层。导光体具有用于发光的大致平坦的发光面和远离发光面的另一表面。光源用于将光提供到光导中。反射层设置在光导的上述另一表面上。光导可以具有环形。由于发光装置产生连续的线状发光图像，例如环形发光图像，因此可以用于清楚地表示感应加热烹调器的加热范围。

2. 发明授权

US07109450B2 Line type luminous device and induction heating cooker employing same 有权
公开(公告)号：US07109450B2
公开(公告)日：2006-09-19
申请号：US11179496
申请日：2005-07-13
申请人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
发明人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
IPC分类号： H05B6/12 , F21V7/04
CPC分类号： H05B6/1218 , G02B6/001 , H05B6/1263 , Y02B40/123 , Y10S385/901
摘要： A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

3. 发明授权

US06969834B2 Line type luminous device and induction heating cooker employing same 有权
公开(公告)号：US06969834B2
公开(公告)日：2005-11-29
申请号：US10179308
申请日：2002-06-26
申请人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
发明人： Tetsuya Kaji , Katsuyuki Aihara , Yoshio Kinoshita
IPC分类号： F21V8/00 , H05B6/12 , F21V7/04
CPC分类号： H05B6/1218 , G02B6/001 , H05B6/1263 , Y02B40/123 , Y10S385/901
摘要： A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

4. 发明申请

US20060163719A1 Semiconductor device and method of manufacturing a semiconductor device 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060163719A1
公开(公告)日：2006-07-27
申请号：US11180636
申请日：2005-07-14
申请人： Megumi Yamamura , Tetsuya Kaji , Toshihide Shimmei
发明人： Megumi Yamamura , Tetsuya Kaji , Toshihide Shimmei
IPC分类号： H01L23/06
CPC分类号： H01L24/29 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/49513 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2224/0401 , H01L2224/04026 , H01L2224/13144 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/01083 , H01L2924/00012 , H01L2924/01049 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.
摘要翻译：提供了一种半导体器件，包括床，形成在床的第一表面上的钎料，形成在钎料的第一表面上的阻挡金属膜，形成在阻挡层的第一表面上的合金膜金属膜，设置在合金膜的第一表面上的半导体芯片，将形成在半导体芯片的第一表面上的端子与引线端子电连接的接合线和模制该床的模制树脂，钎焊金属阻挡金属膜，合金膜，半导体芯片和接合线。

5. 发明申请

US20050250296A1 Method of fabricating semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US20050250296A1
公开(公告)日：2005-11-10
申请号：US11041697
申请日：2005-01-25
申请人： Megumi Yamamura , Toshihide Shimmei , Tetsuya Kaji
发明人： Megumi Yamamura , Toshihide Shimmei , Tetsuya Kaji
IPC分类号： H01L21/301 , H01L21/02 , H01L21/68 , H01L21/78 , H01L27/01
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape on the second surface of the semiconductor substrate, removing the first protective tape, dicing the semiconductor substrate from the first surface side to separate the semiconductor substrate to a plurality of semiconductor chips, sticking a third protective tape on the first surface of a plurality of the semiconductor chips, removing the second protective tape, and etching a cutting surface of the semiconductor chip and the second surface of the semiconductor chip by dry etching.
摘要翻译：描述制造半导体器件的方法。提供一种制造半导体器件的方法，包括：将第一保护带粘附在半导体衬底的第一表面上，抛光半导体衬底的面向第一表面的第二表面，将第二保护带粘附在第二表面的第二表面上半导体衬底，去除第一保护带，从第一表面侧切割半导体衬底以将半导体衬底分离成多个半导体芯片，将第三保护带粘贴在多个半导体芯片的第一表面上，第二保护带，并且通过干蚀刻蚀刻半导体芯片的切割表面和半导体芯片的第二表面。

6. 发明授权

US07485547B2 Method of fabricating semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07485547B2
公开(公告)日：2009-02-03
申请号：US11041697
申请日：2005-01-25
申请人： Megumi Yamamura , Toshihide Shimmei , Tetsuya Kaji
发明人： Megumi Yamamura , Toshihide Shimmei , Tetsuya Kaji
IPC分类号： H01L21/78 , H01L21/46 , H01L21/301
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape on the second surface of the semiconductor substrate, removing the first protective tape, dicing the semiconductor substrate from the first surface side to separate the semiconductor substrate to a plurality of semiconductor chips, sticking a third protective tape on the first surface of a plurality of the semiconductor chips, removing the second protective tape, and etching a cutting surface of the semiconductor chip and the second surface of the semiconductor chip by dry etching.
摘要翻译：描述制造半导体器件的方法。提供一种制造半导体器件的方法，包括：将第一保护带粘附在半导体衬底的第一表面上，抛光半导体衬底的面向第一表面的第二表面，将第二保护带粘附在第二表面的第二表面上半导体衬底，去除第一保护带，从第一表面侧切割半导体衬底以将半导体衬底分离成多个半导体芯片，将第三保护带粘贴在多个半导体芯片的第一表面上，第二保护带，并且通过干蚀刻蚀刻半导体芯片的切割表面和半导体芯片的第二表面。

7. 发明授权

US07274091B2 Semiconductor device and method of manufacturing a semiconductor device 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07274091B2
公开(公告)日：2007-09-25
申请号：US11180636
申请日：2005-07-14
申请人： Megumi Yamamura , Tetsuya Kaji , Toshihide Shimmei
发明人： Megumi Yamamura , Tetsuya Kaji , Toshihide Shimmei
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52
CPC分类号： H01L24/29 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/49513 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2224/0401 , H01L2224/04026 , H01L2224/13144 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/01083 , H01L2924/00012 , H01L2924/01049 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.
摘要翻译：提供了一种半导体器件，包括床，形成在床的第一表面上的钎料，形成在钎料的第一表面上的阻挡金属膜，形成在阻挡层的第一表面上的合金膜金属膜，设置在合金膜的第一表面上的半导体芯片，将形成在半导体芯片的第一表面上的端子与引线端子电连接的接合线和模制该床的模制树脂，钎焊金属阻挡金属膜，合金膜，半导体芯片和接合线。

8. 发明授权

US5920044A Pressure-responsive switch 失效
标题翻译：压力敏感开关
公开(公告)号：US5920044A
公开(公告)日：1999-07-06
申请号：US724218
申请日：1996-10-01
申请人： Tetsuya Kaji , Norihisa Kurihara
发明人： Tetsuya Kaji , Norihisa Kurihara
IPC分类号： H01H13/18 , B60J10/00 , E05F15/00 , H01H3/14 , H01H13/52 , H01H3/16
CPC分类号： H01H3/142 , B60J10/00 , E05F15/443 , E05Y2900/55 , H01H2003/143
摘要： A pressure responsive switch includes a flexible hollow cord member which includes a predetermined wall portion and an opposing portion which generally opposes the predetermined wall portion. In a transverse cross section of the hollow cord member, a neutral axis of the cord switch is located to the predetermined wall portion side from the center of the distance between the predetermined wall portion and the opposing portion. A contact portion is disposed inwardly of the hollow cord member and extends on a portion of the predetermined wall portion along the longitudinal direction of the hollow cord member. A contact body is disposed apart from the contact portion and extends along the longitudinal direction of the hollow cord member, the contact body being disposed inwardly of the hollow cord member and extending from the opposing portion to portions between the predetermined wall portion and the opposing portion in the hollow cord member, as viewed from a transverse cross section of the hollow cord member.
摘要翻译：压力响应开关包括柔性中空帘线构件，其包括预定的壁部分和与预定壁部分大致相对的相对部分。在中空帘线构件的横截面中，帘线开关的中性轴线从预定壁部分和相对部分之间的距离的中心位于预定壁部分侧。接触部分设置在中空帘线构件的内部，并且沿着中空帘线构件的纵向方向在预定壁部分的一部分上延伸。接触体与接触部分分开设置并且沿着中空绳部件的纵向方向延伸，接触体设置在中空绳部件的内侧，并从相对部分延伸到预定壁部分和相对部分之间的部分从中空绳部件的横截面看，在中空绳部件中。

9. 发明授权

US5834719A Cord switch 失效
标题翻译：线开关
公开(公告)号：US5834719A
公开(公告)日：1998-11-10
申请号：US689001
申请日：1996-07-30
申请人： Tetsuya Kaji , Norihisa Kurihara
发明人： Tetsuya Kaji , Norihisa Kurihara
IPC分类号： E05F15/16 , B60J1/00 , B60J10/00 , E05F15/00 , H01H1/029 , H01H3/14 , H01H13/18 , H01H13/52 , H01H3/16 , E05F15/10
CPC分类号： B60J10/00 , B60J10/273 , E05F15/443 , E05Y2900/55 , H01H1/029 , H01H2003/143 , H01H2300/01 , H01H3/142
摘要： A cord switch that includes a hollow flexible cord member, contact lines and a bridge conductor. The cord member includes two portions generally opposed to and spaced apart from each other in the transverse direction of the cord member. The contact lines are disposed in parallel to each other on one of the inner portions of the two portions of the cord member. The bridge conductor is disposed on the other of the two inner portions so as to be generally opposed to apart from the contact lines. When the cord member is pressed, the bridge conductor is brought into contact with the contact lines to energize the cord member. The cord switch is configured so that its neutral axis is positioned on the side of the one of two inner portions with respect to the central portion of the distance between the two wall portions. As a result, even if the cord switch is mounted at a comer portion of a window frame of a vehicle, contact between the contact lines and bridge conductor can be prevented.
摘要翻译：一种帘线开关，其包括中空柔性绳构件，接触线和桥导体。帘线构件包括在帘线构件的横向方向上彼此大致相对并间隔开的两个部分。接触线在帘线构件的两个部分的内部之一中彼此平行地设置。桥导体设置在两个内部部分中的另一个上，以便与接触线大致相对。当帘线构件被按压时，桥接导体与接触线接触以使线构件通电。帘线开关被构造成使得其中性轴相对于两个壁部之间的距离的中心部分位于两个内部部分中的一个的侧面上。结果，即使电线开关安装在车辆的窗框的拐角部分，也可以防止接触线和桥导体之间的接触。

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