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1. 发明授权

US5266828A Image sensors with an optical fiber array 失效
标题翻译：具有光纤阵列的图像传感器
公开(公告)号：US5266828A
公开(公告)日：1993-11-30
申请号：US884826
申请日：1992-05-18
申请人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
发明人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
IPC分类号： G02B6/42 , H04N1/031 , H01L27/14
CPC分类号： H04N1/0312 , G02B6/4249 , H01L27/14618 , H01L27/14625 , H04N1/0311 , H04N1/0316 , H01L2224/16 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： This invention relates to an image sensor with photo sensors (13). An object thereof is to simplify mounting operation of an image sensor chip (12) provided with the photo sensors (13). In order to accomplish this object, according to this invention, the photo sensors (13) and electrodes (15) are disposed on the underside of the image sensor chip (12). The image sensor chip (12) is bonded to the upper side of a transparent substrate (18) by means of a transparent photo-setting type insulating resin (16), so that the electrodes (15) come into contact with circuit conductor layers (17) disposed on the upper side of the transparent substrate (18). With the above-mentioned construction, since fine metal wire (75) by which the electrodes (15) and the circuit conductor layers (17) are connected to each other is not required, mounting operation can be simplified.
摘要翻译：本发明涉及具有光传感器（13）的图像传感器。其目的在于简化设置有光传感器（13）的图像传感器芯片（12）的安装操作。为了实现该目的，根据本发明，光传感器（13）和电极（15）设置在图像传感器芯片（12）的下侧。图像传感器芯片12通过透明光固定型绝缘树脂16与透明基板18的上侧接合，使得电极15与电路导体层（ 17）设置在透明基板（18）的上侧。利用上述结构，由于不需要将电极（15）和电路导体层（17）彼此连接的细金属线（75），因此可以简化安装操作。

2. 发明授权

US5138145A Method for producing image sensors with current flow into chip and with simplified chip mounting 失效
标题翻译：用于生产图像传感器的方法，电流流入芯片并具有简化的芯片安装
公开(公告)号：US5138145A
公开(公告)日：1992-08-11
申请号：US739562
申请日：1991-08-21
申请人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
发明人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
IPC分类号： G02B6/42 , H04N1/031
CPC分类号： H04N1/0312 , G02B6/4249 , H01L27/14618 , H01L27/14683 , H04N1/0311 , H04N1/0316 , H01L2224/16 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： Methods for the production of image sensors having simplified chip mounting are provided which comprise disposing a photo-setting type insulating resin on the upper side of a substrate, a portion of the substrate being transparent and having circuit conductor layers on its upper side; bringing an image sensor chip, the underside of which has electrodes, into contact with the upper side of the substrate so that the photo-setting type resin is wedged away and the electrodes come into contact with the corresponding circuit conductor layers; flowing current into the image sensor chip through the circuit conductor layers to determine that the image sensor chip operates in a normal manner; and irradiating the photo-setting type resin with light so that the resin is hardened.

3. 发明授权

US5065006A Image sensors with simplified chip mounting 失效
标题翻译：具有简化芯片安装的图像传感器
公开(公告)号：US5065006A
公开(公告)日：1991-11-12
申请号：US476483
申请日：1990-06-04
申请人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
发明人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
IPC分类号： G02B6/42 , H04N1/031
CPC分类号： H04N1/0312 , G02B6/4249 , H01L27/14618 , H01L27/14683 , H04N1/0311 , H04N1/0316 , H01L2224/16 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： Image sensors are provided which include a transparent substrate having circuit conductor layers on one side thereof and an image sensor chip set on the one side of the transparent substrate by means of transparent photo-setting type insulating resin. The image sensor chip has photo sensors and electrodes on the side thereof facing the transparent substrate. The electrodes are in contact with the circuit conductor layers.
摘要翻译： PCT No.PCT / JP89 / 01059 Sec。 371日期1990年6月4日第 102（e）1990年6月4日PCT PCT 1989年10月13日PCT公布。出版物WO90 / 04263 日期为1990年04月19日。提供图像传感器，其包括透明基板，其一侧具有电路导体层，并且通过透明光固定型绝缘树脂设置在透明基板的一侧上的图像传感器芯片。图像传感器芯片在其面向透明基板的一侧具有光电传感器和电极。电极与电路导体层接触。

4. 发明授权

US06268600B1 Linear illumination device 失效
标题翻译：线性照明装置
公开(公告)号：US06268600B1
公开(公告)日：2001-07-31
申请号：US09344075
申请日：1999-06-25
申请人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
发明人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
IPC分类号： G02B600
CPC分类号： G02B6/0001 , G02B6/0061 , H04N1/02835 , H04N1/0289 , Y10S362/806
摘要： A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon by refraction, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.
摘要翻译：本发明的线性照明装置包括：由沿第一方向延伸的透光材料制成的导向件，具有侧面和至少一个端面; 至少一个光发射器，用于允许光从所述引导件的所述至少一个端面进入所述引导件的内部; 以及形成在引导件的侧面的一部分上的光扩散部分，用于通过折射扩散入射到其上的光，其中进入引导件内部的光的至少一部分从引导面的侧面的一部分光扩散部分，从而沿着第一方向提供基本上线性的照明光。

5. 发明授权

US5969343A Linear illumination device 失效
公开(公告)号：US5969343A
公开(公告)日：1999-10-19
申请号：US608744
申请日：1996-02-29
申请人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
发明人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
IPC分类号： H04N1/028 , H04N1/031 , G02B6/08 , H04N1/04
CPC分类号： H04N1/02835 , H04N1/02815 , H04N1/02885 , H04N1/0289 , H04N1/0311 , H04N1/0312 , H04N1/0316 , Y10S362/80
摘要： A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.

6. 发明授权

US6127675A Linear illumination device 失效
公开(公告)号：US6127675A
公开(公告)日：2000-10-03
申请号：US238394
申请日：1999-01-27
申请人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
发明人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
IPC分类号： H04N1/028 , H04N1/031 , G02B6/08 , H04N1/04
CPC分类号： H04N1/02835 , H04N1/02815 , H04N1/02885 , H04N1/0289 , H04N1/0311 , H04N1/0312 , H04N1/0316 , Y10S362/80
摘要： A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.

7. 发明授权

US6072171A Linear illumination device 失效
标题翻译：线性照明装置
公开(公告)号：US6072171A
公开(公告)日：2000-06-06
申请号：US965755
申请日：1997-11-10
申请人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
发明人： Tetsuroh Nakamura , Kouki Hongou , Eiichiro Tanaka , Shinji Fujiwara , Takahiko Murata , Yuka Kajita
IPC分类号： H04N1/028 , H04N1/031 , G02B6/08 , H04N1/04
CPC分类号： H04N1/02835 , H04N1/02815 , H04N1/02885 , H04N1/0289 , H04N1/0311 , H04N1/0312 , H04N1/0316 , Y10S362/80
摘要： A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.
摘要翻译：本发明的线性照明装置包括：由沿第一方向延伸的透光材料制成的导向件，具有侧面和至少一个端面; 至少一个光发射器，用于允许光从所述引导件的所述至少一个端面进入所述引导件的内部; 以及形成在所述引导件的侧面的一部分上的光漫射部分，用于使入射到其上的光扩散，其中进入所述引导件内部的光的至少一部分从所述引导件的面向所述光的所述侧面的部分出来从而沿第一方向提供基本上线性的照明光。

8. 发明授权

US5835142A Direct contact type image sensor and its production method 失效
标题翻译：直接接触式图像传感器及其制作方法
公开(公告)号：US5835142A
公开(公告)日：1998-11-10
申请号：US487971
申请日：1995-06-07
申请人： Tetsuro Nakamura , Masahiro Nakagawa , Eiichiro Tanaka , Shinji Fujiwara
发明人： Tetsuro Nakamura , Masahiro Nakagawa , Eiichiro Tanaka , Shinji Fujiwara
IPC分类号： H04N1/031 , H04N5/225
CPC分类号： H04N1/0312 , H04N1/0311 , H04N1/0316
摘要： A direct contact type image sensor includes an optical fiber array plate including a transparent substrate and an optical fiber array and having a lower face brought into close contact with an original document. A semiconductor image sensor chip including a photosensor array is mounted on an upper face of the optical fiber array plate by transparent photo-setting and insulating resin. A circuit conductive layer is formed on an upper face of the transparent substrate, and a bump electrode is formed on a lower face of the semiconductor image sensor chip so as to be brought into contact with the circuit conductive layer. A light source is provided for illuminating the original document. The optical fiber array plate is formed, on the upper face, with a slit for allowing light from the light source to pass therethrough. A first light shielding layer is provided at other portions of the lower face of the optical fiber array plate than that corresponding to the optical fiber array, and a second light shielding layer is provided at other portions of the upper face of the optical fiber array plate than those corresponding to the optical fiber array and the slit.
摘要翻译：直接接触型图像传感器包括具有透明基板和光纤阵列的光纤阵列板，并且具有与原稿紧密接触的下表面。包括光电传感器阵列的半导体图像传感器芯片通过透明光固定和绝缘树脂安装在光纤阵列板的上表面上。在透明基板的上表面上形成电路导电层，并且在半导体图像传感器芯片的下表面上形成凸起电极以与电路导电层接触。提供用于照亮原稿的光源。光纤阵列板在上表面上形成有用于使来自光源的光通过的狭缝。在光纤阵列板的下表面的与光纤阵列相对的另一部分设置有第一遮光层，第二遮光层设置在光纤阵列板的上表面的其他部分比对应于光纤阵列和狭缝的那些。

9. 发明授权

US5556809A Direct-contact type image sensor device, an image sensor unit, and methods for producing the same 失效
标题翻译：直接接触型图像传感器装置，图像传感器单元及其制造方法
公开(公告)号：US5556809A
公开(公告)日：1996-09-17
申请号：US351020
申请日：1994-12-07
申请人： Masahiro Nakagawa , Tetsuro Nakamura , Shinji Fujiwara , Eiichiro Tanaka
发明人： Masahiro Nakagawa , Tetsuro Nakamura , Shinji Fujiwara , Eiichiro Tanaka
IPC分类号： H04N1/031 , H01L21/60
CPC分类号： H04N1/0316 , H04N1/0313
摘要： A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; e transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.
摘要翻译：根据本发明的直接接触型图像传感器装置包括：具有上表面和下表面的透光基底; 形成在所述透光基板的上表面上的图案化导体层; 透明导电层，形成在透光基板的下表面上; 图像传感器芯片，其面向下安装在透光基板的上表面上，绝缘树脂层插入在图像传感器芯片和透光基板的上表面之间，图像传感器芯片由倒装芯片接合方法，设置在图案化导体层和透光基板的上表面之间的遮光层; 以及用于中断光束的一部分的遮光部，通过透光基板通过设置在透光基板上方的光源将光束照射在原稿上。图像传感器芯片和遮光部分用作光束的光学节流阀。

10. 发明授权

US5408121A Semiconductor device, an image sensor device, and methods for producing the same 失效
标题翻译：半导体装置，图像传感器装置及其制造方法
公开(公告)号：US5408121A
公开(公告)日：1995-04-18
申请号：US131125
申请日：1993-10-04
申请人： Tetsuro Nakamura , Eiichiro Tanaka , Shinji Fujiwara , Masahiro Nakagawa
发明人： Tetsuro Nakamura , Eiichiro Tanaka , Shinji Fujiwara , Masahiro Nakagawa
IPC分类号： H01L21/56 , H01L21/60 , H01L31/0203 , H01L27/14 , H01L31/00
CPC分类号： H01L31/0203 , H01L21/563 , H01L24/81 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83224 , H01L2224/83874 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01065 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , Y10T29/49128 , Y10T29/49144
摘要： A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated metal layer upon the circuit conductor layer.
摘要翻译：根据本发明的半导体器件包括：具有第一表面和第二表面的透光衬底; 形成在所述透光性基板的第一面上的电路导体层; 具有形成在其表面上的电极的半导体芯片，所述半导体器件面朝下安装在所述透光衬底的第一表面上; 用于将所述半导体芯片固定在所述透光基板上的光热交联绝缘树脂层; 形成在所述电路导体层的至少一部分上的电镀金属层，所述半导体芯片的电极通过所述电镀金属层与所述电路导体层连接; 在每个镀覆的金属层和电路导体层之间的邻接部分中形成的合金层; 以及在每个电极和每个电镀金属层之间的邻接部分中形成的第二合金层，通过在电路导体层上熔化和重新填充镀覆的金属层来形成合金层。

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