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    • 1. 发明授权
    • Surface mounting type antenna system
    • 表面安装型天线系统
    • US5818398A
    • 1998-10-06
    • US823828
    • 1997-03-25
    • Teruhisa TsuruHaruhumi MandaiKoji ShirokiKenji Asakura
    • Teruhisa TsuruHaruhumi MandaiKoji ShirokiKenji Asakura
    • H01Q1/36H01Q11/08H01Q1/24
    • H01Q1/362H01Q11/08
    • A surface mounting type antenna system 10 is formed by spirally winding a conductor 14 made of copper or copper alloy, with a power supply member 12 provided at one end of the conductor 14, the other end thereof being a free end 13, on the edge faces of a rectangular parallelepiped as a dielectric substrate 11 by printing, deposition, pasting or plating. The dielectric substrate 11 is prepared by stacking a plurality of layers of ceramics, resin or a combination of ceramics and resin. On the underside 111 of the dielectric substrate 11 lies a power supply terminal 15 to which the power supply member 12 of the conductor 14 is connected. The power supply terminal 15 is simultaneously used as a fixing terminal for securing the surface mounting type antenna system 10 to, for example, a mounting board. Moreover, the conductor 14 squarely intersecting the axis C of the conductor winding is rectangular in transverse cross section having a width of w and a length of l.
    • 表面安装型天线系统10通过螺旋地缠绕由铜或铜合金制成的导体14而形成,电源构件12设置在导体14的一端,另一端为自由端13,在边缘 通过印刷,沉积,糊化或电镀作为电介质基板11的长方体的表面。 电介质基板11通过层叠多层陶瓷,树脂或陶瓷和树脂的组合来制备。 电介质基板11的下侧111位于与导体14的电源部件12连接的电源端子15上。 电源端子15同时用作用于将表面安装型天线系统10固定到例如安装板的固定端子。 此外,与导体绕组的轴线C正交地交叉的导体14在宽度为w且长度为l的横截面中为矩形。
    • 6. 发明授权
    • Method for producing boundary layer semiconductor ceramic capacitors
    • 边界层半导体陶瓷电容器的制造方法
    • US4380559A
    • 1983-04-19
    • US190711
    • 1980-09-25
    • Haruhumi MandaiKunitaro NishimuraYoshiaki KohnoMasami Yamaguchi
    • Haruhumi MandaiKunitaro NishimuraYoshiaki KohnoMasami Yamaguchi
    • H01G4/12H01G4/10
    • H01G4/1281
    • A method for producing boundary layer semiconductor ceramic capacitors comprises firing shaped bodies of a semiconductor ceramic material in a neutral or reducing atmosphere, heat-treating the resultant semiconductor ceramic bodies to insulatorize crystal grain boundaries of the semiconductor ceramics, and providing opposite electrodes on surfaces of the heat-treated semiconductor ceramic bodies and is characterized in that said heat-treating is carried out by heating the semiconductor ceramic bodies together with power of an insulatorizing agent with stirring in a neutral or oxidizing atmosphere at a temperature ranging from 950.degree. to 1300.degree. C. As a semiconductor ceramic material, there may be used semiconductor ceramics of a barium titanate system, or of a strontium titanate system, or a complex semiconductor ceramic mainly comprising barium titanate or calcium titanate and strontium titanate. This method enables one to produce boundary layer semiconductor ceramics as good quality with small standard deviation and high yield.
    • 制造边界层半导体陶瓷电容器的方法包括在中性或还原性气氛中烧成半导体陶瓷材料的成形体,热处理所得到的半导体陶瓷体,使半导体陶瓷的晶界绝缘,并且在 所述热处理半导体陶瓷体的特征在于,所述热处理是通过在中性或氧化性气氛中在950〜1300℃的温度下搅拌将半导体陶瓷体与绝缘体的功率一起加热而进行的 C.作为半导体陶瓷材料,可以使用钛酸钡体系或钛酸锶系的半导体陶瓷,或主要包含钛酸钡或钛酸钙和钛酸锶的复合半导体陶瓷。 这种方法使得能够以小的标准偏差和高产率生产边界层半导体陶瓷,质量好。