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1. 发明申请

US20110148827A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110148827A1
公开(公告)日：2011-06-23
申请号：US12975393
申请日：2010-12-22
申请人： Taku ISHIDA , Kazuhisa Higuchi , Shinobu Notomi
发明人： Taku ISHIDA , Kazuhisa Higuchi , Shinobu Notomi
IPC分类号： G09G5/00 , G09G3/36
CPC分类号： G09G3/3688 , G02F1/136286 , G09G2300/0426
摘要： A semiconductor device has an LCD driver formed over a silicon substrate. The LCD driver is arranged in a source output circuit region and includes two or more source output cells for generating data signals and two or more output pads for receiving the data signals and sending them to the outside. The two or more pads are arranged over the silicon substrate along a row direction, and the two or more source output cells are arranged in two rows and N columns along the row direction. A source output cell arranged at an Nth column of a first row is electrically coupled to a (2N−1)th output pad. Also, a source output cell CS1 arranged at the Nth column of a second row is electrically coupled to a (2N)th output pad. The arrangement allows for a reduced chip size.
摘要翻译：半导体器件具有形成在硅衬底上的LCD驱动器。 LCD驱动器被布置在源输出电路区域中，并且包括用于产生数据信号的两个或更多个源输出单元和用于接收数据信号并将它们发送到外部的两个或更多个输出焊盘。两个或更多个焊盘沿着行方向布置在硅衬底上，并且两个或更多个源极输出单元沿着行方向排列成两行和N列。布置在第一行的第N列的源极输出单元电连接到第（2N-1）个输出焊盘。此外，布置在第二行的第N列的源极输出单元CS1电耦合到第（2N）个输出焊盘。该装置允许减小芯片尺寸。

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