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1. 发明授权

US08777471B2 Electronic equipment provided with display portion 有权
标题翻译：设有显示部分的电子设备
公开(公告)号：US08777471B2
公开(公告)日：2014-07-15
申请号：US13381010
申请日：2011-03-23
申请人： Takeshi Wakabayashi , Kazuto Ishida
发明人： Takeshi Wakabayashi , Kazuto Ishida
IPC分类号： F21V7/04
CPC分类号： G09F23/0058 , G02B6/0036 , G02B6/0061 , G02B6/0081 , G02F1/133308 , G02F1/133603 , G02F1/133615 , G09F9/35 , G09F2013/222
摘要： An LCD indicator unit contains an LCD indicator with a display portion that includes set temperature and current temperature display portions, a diffusion sheet disposed on the rear surface side of the LCD indicator, a reflective frame body disposed on the rear surface side of the diffusion sheet, a light guide plate disposed on the rear surface side of the reflective frame body such that an outer peripheral portion thereof is covered with the reflective frame body, and an LCD indicator control substrate-disposed on the rear surface side of the light guide plate, with LEDs serving as light sources for the LCD indicator mounted on a right-side outer peripheral portion on the front surface side of the LCD indicator control substrate. Light emitted from the LEDs is caused to enter a side wall surface portion of the light guide plate to irradiate the display portion of the LCD indicator.
摘要翻译： LCD指示器单元包括具有显示部分的LCD指示器，该显示部分包括设定温度和当前温度显示部分，设置在LCD指示器的后表面侧的漫射片，设置在漫射片的背面侧的反射框架体导光板，其设置在反射框体的后表面侧，使得其外周部分被反射框体覆盖;以及LCD指示器控制基板，设置在导光板的后表面侧，其中LED用作LCD指示器的光源，其安装在LCD指示器控制基板的前表面侧的右侧外周部分上。使从LED发出的光进入导光板的侧壁面，照射LCD显示器的显示部。

2. 发明授权

US08567262B2 Electric power steering apparatus for saddle-ride type vehicle 有权
标题翻译：用于骑马式车辆的电动助力转向装置
公开(公告)号：US08567262B2
公开(公告)日：2013-10-29
申请号：US13073441
申请日：2011-03-28
申请人： Tsuyoshi Tsuda , Takeshi Wakabayashi , Shinichiro Kato , Hiroyuki Kaneta , Katsumi Sahoda
发明人： Tsuyoshi Tsuda , Takeshi Wakabayashi , Shinichiro Kato , Hiroyuki Kaneta , Katsumi Sahoda
IPC分类号： G01L3/02
CPC分类号： B62D6/10 , B62D5/0409 , B62K5/01 , B62K5/08
摘要： An electric power steering apparatus includes a steering shaft for transmitting a steering force of a steering handlebar to a wheel and an upper bearing provided at a location upward from a vehicle body frame so as to rotatably support an upper part of the steering shaft. A lower bearing is provided at a location downward from the vehicle body frame, so as to rotatably support a lower part of the steering shaft. A torque sensor detects a torsional torque applied to the steering shaft. An electric motor imparts a steering force to the steering shaft based on the torsional torque detected by the torque sensor. The electric motor is mounted to the steering shaft between the upper bearing and the lower bearing, while the torque sensor is mounted to the steering shaft at place upward from the upper bearing.
摘要翻译：电动助力转向装置包括用于将转向手柄的转向力传递到车轮的转向轴和设置在从车身框架向上的位置处的上轴承，以便可旋转地支撑转向轴的上部。下部轴承设置在从车身框架向下的位置处，以便可旋转地支撑转向轴的下部。转矩传感器检测施加到转向轴的扭转转矩。电动机基于由扭矩传感器检测到的扭转扭矩向转向轴施加转向力。电动机安装在上轴承和下轴承之间的转向轴上，而转矩传感器从上轴承向上安装到转向轴上。

3. 发明授权

US08154133B2 Semiconductor device having low dielectric constant film and manufacturing method thereof 失效
标题翻译：具有低介电常数薄膜的半导体器件及其制造方法
公开(公告)号：US08154133B2
公开(公告)日：2012-04-10
申请号：US12412576
申请日：2009-03-27
申请人： Taisuke Koroku , Takeshi Wakabayashi , Osamu Okada , Osamu Kuwabara , Junji Shiota , Nobumitsu Fujii
发明人： Taisuke Koroku , Takeshi Wakabayashi , Osamu Okada , Osamu Kuwabara , Junji Shiota , Nobumitsu Fujii
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6835 , H01L23/3135 , H01L24/11 , H01L24/12 , H01L24/27 , H01L2221/6834 , H01L2221/68372 , H01L2221/68377 , H01L2224/03 , H01L2224/0401 , H01L2224/11 , H01L2224/16 , H01L2224/274 , H01L2224/94 , H01L2924/01019 , H01L2924/01029 , H01L2924/10157 , H01L2924/10158 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/3512 , H01L2924/00
摘要： A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.
摘要翻译：在半导体基板的上表面的除了该表面的周边部分之外的区域中设置由低介电常数膜和布线组成的低介电常数膜/布线层叠结构。低介电常数薄膜/布线层叠结构的周边侧表面被密封膜覆盖。这提供了低介电常数膜不容易脱落的结构。在这种情况下，在硅基板的下表面上设置下保护膜，以保护该下表面免受裂纹。

4. 发明申请

US20110239787A1 CONTROL UNIT FOR ELECTRIC POWER STEERING DEVICE 有权
标题翻译：电力转向装置控制单元
公开(公告)号：US20110239787A1
公开(公告)日：2011-10-06
申请号：US13073556
申请日：2011-03-28
申请人： Shinichiro Kato , Takeshi Wakabayashi , Katsumi Sahoda , Tsuyoshi Tsuda , Hiroyuki Kaneta
发明人： Shinichiro Kato , Takeshi Wakabayashi , Katsumi Sahoda , Tsuyoshi Tsuda , Hiroyuki Kaneta
IPC分类号： G01L3/10
CPC分类号： B62D6/10 , B62D5/0409 , B62K5/01 , B62K5/027 , B62K5/08
摘要： A bending load acting on a steering shaft only with a magnetostrictive torque sensor, without separately providing a sensor for detecting the bending moment. A storage unit stores, as an initial characteristic curve formed from initial detection values, a characteristic curve formed from detection values of each of a first detection coil and a second detection coil when only twisting torque is applied to a steering shaft. A bending load detector provided in an ECU detects a bending load amount acting on the steering shaft based on a difference between each detection value of the first and second detection coils and the initial detection value on the initial characteristic curve corresponding to the detection value.
摘要翻译：仅通过磁致伸缩扭矩传感器作用在转向轴上的弯曲载荷，而不单独提供用于检测弯矩的传感器。作为由初始检测值形成的初始特性曲线的存储单元，当仅向转向轴施加扭矩时，存储由第一检测线圈和第二检测线圈的检测值形成的特性曲线。设置在ECU中的弯曲载荷检测器基于第一和第二检测线圈的每个检测值与对应于检测值的初始特性曲线的初始检测值之间的差异检测作用在转向轴上的弯曲载荷量。

5. 发明申请

US20110001238A1 SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件的制造方法及其半导体器件的制造方法及其制造方法
公开(公告)号：US20110001238A1
公开(公告)日：2011-01-06
申请号：US12828492
申请日：2010-07-01
申请人： Shinji WAKISAKA , Takeshi Wakabayashi
发明人： Shinji WAKISAKA , Takeshi Wakabayashi
IPC分类号： H01L23/48 , H01L23/485 , H01L21/768 , H01L21/60
CPC分类号： H01L24/49 , H01L21/561 , H01L21/6835 , H01L23/28 , H01L23/3114 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L23/525 , H01L23/5389 , H01L24/09 , H01L24/14 , H01L24/19 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/04042 , H01L2224/04105 , H01L2224/05599 , H01L2224/12105 , H01L2224/20 , H01L2224/274 , H01L2224/2919 , H01L2224/48151 , H01L2224/48491 , H01L2224/49 , H01L2224/73267 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/85399 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/19043 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/214
摘要： A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
摘要翻译：半导体构造包括半导体衬底和设置在半导体衬底上的连接焊盘。一些连接焊盘连接到公共布线，并且剩余的连接焊盘中的至少一个连接到布线。该构造还包括设置成连接到公共布线的第一柱状电极和设置成连接到布线的连接焊盘部分的第二柱状电极。

6. 发明授权

US07805096B2 Toner conveying device, toner supply device and image forming apparatus using these 有权
标题翻译：调色剂输送装置，调色剂供给装置和使用这些的成像装置
公开(公告)号：US07805096B2
公开(公告)日：2010-09-28
申请号：US11907028
申请日：2007-10-09
申请人： Yasuyuki Ishiguro , Takeshi Okuda , Takeshi Wakabayashi , Jun Yamaguchi , Hiroshi Kawahito
发明人： Yasuyuki Ishiguro , Takeshi Okuda , Takeshi Wakabayashi , Jun Yamaguchi , Hiroshi Kawahito
IPC分类号： G03G15/08
CPC分类号： G03G15/0879 , G03G15/0877 , G03G2215/0802
摘要： In a supply passage assembly having a toner passage arranged under a toner bottle for conveying toner supplied from the toner bottle to a developing unit arranged below, a toner conveying pipe for forming the toner passage is formed of an elastic material and a toner conveying pipe deforming member is arranged adjacent to the toner conveying pipe for elastically deforming the toner conveying pipe.
摘要翻译：在具有调色剂通道的供给通道组件中，调色剂通道布置在调色剂瓶下面，用于将从调色剂瓶供应的调色剂输送到下面布置的显影单元，用于形成调色剂通道的调色剂输送管由弹性材料和调色剂输送管变形构件邻近调色剂输送管布置，用于使调色剂输送管弹性变形。

7. 再颁专利

USRE41511E1 Semiconductor device having a thin-film circuit element provided above an integrated circuit 失效
标题翻译：具有设置在集成电路上方的薄膜电路元件的半导体器件
公开(公告)号：USRE41511E1
公开(公告)日：2010-08-17
申请号：US11726763
申请日：2007-03-22
申请人： Yutaka Aoki , Ichiro Mihara , Takeshi Wakabayashi , Katsumi Watanabe
发明人： Yutaka Aoki , Ichiro Mihara , Takeshi Wakabayashi , Katsumi Watanabe
IPC分类号： H01L23/522 , H01L23/50
CPC分类号： H01L23/3114 , H01L23/5223 , H01L23/5225 , H01L23/5227 , H01L23/5228 , H01L23/525 , H01L2924/0002 , H01L2924/1423 , H01L2924/19041 , H01L2924/00
摘要： In a semiconductor device, re-wiring is provided on a circuit element formation region of a semiconductor substrate. A columnar electrode for connection with a circuit board is provided on the rewiring. A first insulating film is provided over the semiconductor substrate excluding a connection pad, and a ground potential layer connected to a ground potential is provided on an upper surface of the first insulating film. A re-wiring is provided over the ground potential layer with a second insulating film interposed. The ground potential layer serves as a barrier layer for preventing crosstalk between the re-wiring and circuit element formation region. A thin-film circuit element is provided on the second insulating film, and a second ground potential layer is provided as a second barrier layer over the thin-film circuit element with an insulating film interposed. Re-wiring is provided over the second ground potential layer.
摘要翻译：在半导体器件中，在半导体衬底的电路元件形成区域上设置再布线。在重新布线时提供用于与电路板连接的柱状电极。第一绝缘膜设置在除了连接焊盘之外的半导体衬底上，并且在第一绝缘膜的上表面上设置连接到接地电位的接地电位层。在地电位层上提供再布线，其中插入有第二绝缘膜。地电位层用作防止重新布线和电路元件形成区域之间的串扰的阻挡层。薄膜电路元件设置在第二绝缘膜上，第二接地电位层设置在薄膜电路元件上，作为第二阻挡层，绝缘膜被插入。在第二接地电位层上提供重新布线。

8. 发明授权

US07592672B2 Grounding structure of semiconductor device including a conductive paste 失效
标题翻译：包括导电浆料的半导体器件的接地结构
公开(公告)号：US07592672B2
公开(公告)日：2009-09-22
申请号：US11729650
申请日：2007-03-29
申请人： Takeshi Wakabayashi , Ichiro Mihara , Osamu Okada
发明人： Takeshi Wakabayashi , Ichiro Mihara , Osamu Okada
IPC分类号： H01L29/04
CPC分类号： H01L29/78639 , H01L21/563 , H01L23/3114 , H01L23/492 , H01L23/50 , H01L24/16 , H01L24/24 , H01L24/73 , H01L24/82 , H01L24/91 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/16225 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/2518 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73259 , H01L2224/73267 , H01L2224/82007 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/07811 , H01L2924/10156 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/30105 , H01L2924/00 , H01L2224/05599
摘要： A circuit substrate of a grounding structure of a semiconductor device according to the invention has a plurality of connection pads and a grounding wiring. The semiconductor device has a semiconductor substrate having one side face and the other side face opposite thereto, an insulating film formed thereon, an SOI integrated circuit provided thereon and including a plurality of connection pads, and electrodes for external connection each of which is connected to the corresponding connection pad. The semiconductor device has the external connection electrodes connected to the respective connection pads of the circuit substrate by a face-down bonding scheme. An under-filling material is provided between the semiconductor device and the circuit substrate, and there is provided a connection member which connects the other side face of the semiconductor device with the grounding wiring of the circuit substrate, and is made of a conductive material.
摘要翻译：根据本发明的半导体器件的接地结构的电路基板具有多个连接焊盘和接地布线。半导体器件具有一个半导体衬底，其具有一个侧面，另一个侧面与其相对，形成在其上的绝缘膜，设置在其上的SOI集成电路，并且包括多个连接焊盘，以及用于外部连接的电极，相应的连接板。半导体器件具有通过面向下接合方案连接到电路衬底的各个连接焊盘的外部连接电极。在半导体器件和电路基板之间设置有填充不足的材料，并且设置有将半导体器件的另一个侧面与电路基板的接地布线连接的连接部件，并且由导电材料制成。

9. 发明授权

US07368813B2 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof 有权
标题翻译：半导体装置，包括由半导体元件和绝缘构件的绝缘构件和上下表面的配线结构包围的半导体元件及其制造方法
公开(公告)号：US07368813B2
公开(公告)日：2008-05-06
申请号：US10986532
申请日：2004-11-10
申请人： Shinji Wakisaka , Hiroyasu Jobetto , Takeshi Wakabayashi , Ichiro Mihara
发明人： Shinji Wakisaka , Hiroyasu Jobetto , Takeshi Wakabayashi , Ichiro Mihara
IPC分类号： H01L23/52
CPC分类号： H01L24/27 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4943 , H01L2224/73265 , H01L2224/73267 , H01L2224/83191 , H01L2224/83856 , H01L2224/92 , H01L2224/92244 , H01L2224/97 , H01L2225/0651 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H01L2224/83 , H01L2224/82 , H01L2924/07025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.
摘要翻译：第一半导体元件安装在基板上，其周边处于密封状态，被绝缘构件覆盖，其上表面被上绝缘膜覆盖。通过导体将形成在上绝缘膜上的上布线层和通过下绝缘膜形成在基板下方的下布线层连接。第二半导体元件被暴露安装，连接到下布线层。

10. 发明申请

US20080009530A1 Therapeutic Agent for Diabetes 审中-公开
标题翻译：糖尿病治疗剂
公开(公告)号：US20080009530A1
公开(公告)日：2008-01-10
申请号：US11666812
申请日：2006-08-09
申请人： Hidenori Abe , Takeshi Wakabayashi , Kentarou Rikimaru
发明人： Hidenori Abe , Takeshi Wakabayashi , Kentarou Rikimaru
IPC分类号： A61K31/415 , A61K31/44 , A61P3/10 , C07D213/02 , C07D231/06
CPC分类号： C07D213/64 , A61K31/415 , A61K31/44 , A61K31/444 , C07C307/06 , C07C311/04 , C07C311/51 , C07C311/53 , C07C381/00 , C07C2601/02 , C07C2601/14 , C07D207/09 , C07D211/46 , C07D213/42 , C07D213/53 , C07D213/80 , C07D231/12 , C07D231/16 , C07D231/24 , C07D241/12 , C07D263/32 , C07D277/28 , C07D277/32 , C07D307/12 , C07D333/20 , C07D401/06 , C07D401/12 , C07D405/12 , C07D409/12 , C07D413/12
摘要： The present invention provides an agent for the prophylaxis or treatment of diabetes, which is associated with a ferwer side effects such as body weight gain, adipocyte accumulation, cardiac hypertrophy and the like, and which contains a compound represented by the formula: wherein each symbol is as defined in the specification, or a salt thereof or a prodrug thereof.
摘要翻译：本发明提供了预防或治疗糖尿病的药剂，其与诸如体重增加，脂肪细胞积聚，心脏肥大等的发育副作用相关，并且其含有下式表示的化合物：其中每个符号如本说明书中所定义，或其盐或其前药。

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