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    • 2. 发明授权
    • Heat-curable silicone resin composition for sealing optical semiconductors, and a sealed optical semiconductor using the same
    • 用于密封光半导体的可热固化的有机硅树脂组合物和使用其的密封光学半导体
    • US08669583B2
    • 2014-03-11
    • US13402322
    • 2012-02-22
    • Takeaki SaikiYoshihito Takei
    • Takeaki SaikiYoshihito Takei
    • H01L33/52C08G77/08C08G77/04
    • C08L83/04C08G77/18H01L23/293H01L2224/73265
    • A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e  (1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.
    • 一种用于密封光学半导体的可热固化的有机硅树脂组合物,包括:组分(A):100质量份由下式(1)表示的硅化合物; 和组分(B):0.001至10质量份的缩合催化剂。 (R1SiO3 / 2)a((R2)2SiO2 / 2)b((R3)3SiO1 / 2)c(SiO4 / 2)d(XO1 / 2)e(1)在该式中,R1,R2和R3为 相同或不同的一价有机基团,“X”为氢原子或一价有机基团,“a”为正数,“b”为0或正数,“c”为0或正数,“d “为0或正数,”e“为0或正数; 然而,“a”至“e”满足以下条件:b / a为0〜10的数,c / a为0〜0.5的数,d /(a + b + c + d) 0〜0.3,e /(a + b + c + d)为0.01〜1.5的数。
    • 3. 发明申请
    • CURABLE SILICONE RESIN COMPOSITION
    • 可固化硅树脂组合物
    • US20120071604A1
    • 2012-03-22
    • US13321748
    • 2010-06-08
    • Yoshihito TakeiKazunori IshikawaTakeaki Saiki
    • Yoshihito TakeiKazunori IshikawaTakeaki Saiki
    • C09J183/04
    • C08F299/08C08G77/16C08G77/20C08L83/04C08L83/06
    • A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.
    • 可固化有机硅树脂组合物具有优异的封闭系统固化性,粘合性,耐热着色稳定性,以及透明性和粘合强度之间的平衡。 可固化有机硅树脂组合物是一种可固化的有机硅树脂组合物,其包含100质量份的硅氧烷A,其重均分子量为20,000至200,000,每分子具有2个或更多个(甲基)丙烯酰基; 10质量份以上的硅酮B,重均分子量为1000以上且小于20,000,并且每分子具有2个以上的(甲基)丙烯酰基; 2重量份以上的硅氧烷C,其重均分子量为300以上且小于1000,(甲基)丙烯酸当量小于450g / mol,并且具有2个或更多个 (甲基)丙烯酰基; 和自由基引发剂。
    • 4. 发明授权
    • Method for manufacturing a bis(silatranylalkyl) polysulfide, method for manufacturing a mixture of bis(silatranylalkyl) polysulfide etc., a mixture of bis(silatranylalkyl) polysulfide etc., and rubber composition
    • 双(硅烷基烷基)多硫化物的制造方法,双(硅烷基烷基烷基)多硫化物等的混合物的制造方法,双(硅烷基烷基烷基)多硫化物等的混合物和橡胶组合物
    • US08093323B2
    • 2012-01-10
    • US12522835
    • 2008-01-11
    • Takeaki SaikiMakoto IwaiAnil Kumar Tomar
    • Takeaki SaikiMakoto IwaiAnil Kumar Tomar
    • C08K5/24C08K5/00
    • C07F7/188C07F7/1804
    • A method for manufacturing a bis(silatranylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting all Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a method for the preparation of a mixture of a bis(silatranylalkyl) polysulfide and a (silatranyalkyl)(trialkoxysilyl) disulfide or a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting a part of Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a mixture of a bis(silatranylalkyl) polysulfide and a (silatranylalkyl)(trialkoxysilyl) disulfide; a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide; and a rubber composition containing the aforementioned mixture.
    • 在催化量的碱金属醇化物的存在下加热双(三烷氧基甲硅烷基)多硫化物和三乙醇胺,从而将双(三烷氧基甲硅烷基烷基)多硫化物的所有Si键合的烷氧基与 (OCH 2 CH 2)3 N基团; 制备双(硅烷基烷基烷基)多硫化物和(硅烷基烷基)(三烷氧基甲硅烷基)二硫化物的混合物或双(硅烷基烷基烷基)多硫化物,(硅烷基烷基)(三烷氧基甲硅烷基)二硫化物和双(三烷氧基甲硅烷基) 通过在催化量的碱金属醇化物的存在下加热双(三烷氧基甲硅烷基)多硫化物和三乙醇胺,从而用(OCH 2 CH 2)3 N基取代双(三烷氧基甲硅烷基烷基)多硫化物的一部分Si键合的烷氧基, 双(甲硅烷基烷基)多硫化物和(硅烷基烷基烷基)(三烷氧基甲硅烷基)二硫化物的混合物; (硅烷基烷基)多硫化物,(硅烷基烷基)(三烷氧基甲硅烷基)二硫化物和双(三烷氧基甲硅烷基烷基)多硫化物的混合物; 和含有上述混合物的橡胶组合物。
    • 8. 发明授权
    • Curable silicone resin composition
    • 可固化硅树脂组合物
    • US08304489B2
    • 2012-11-06
    • US13321748
    • 2010-06-08
    • Yoshihito TakeiKazunori IshikawaTakeaki Saiki
    • Yoshihito TakeiKazunori IshikawaTakeaki Saiki
    • C09J183/04C08G77/04
    • C08F299/08C08G77/16C08G77/20C08L83/04C08L83/06
    • A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.
    • 可固化有机硅树脂组合物具有优异的封闭系统固化性,粘合性,耐热着色稳定性,以及透明性和粘合强度之间的平衡。 可固化有机硅树脂组合物是一种可固化的有机硅树脂组合物,其包含100质量份的硅氧烷A,其重均分子量为20,000至200,000,每分子具有2个或更多个(甲基)丙烯酰基; 10质量份以上的硅酮B,重均分子量为1000以上且小于20,000,并且每分子具有2个以上的(甲基)丙烯酰基; 2重量份以上的硅氧烷C,其重均分子量为300以上且小于1000,(甲基)丙烯酸当量小于450g / mol,并且具有2个或更多个 (甲基)丙烯酰基; 和自由基引发剂。
    • 9. 发明申请
    • HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTORS, AND A SEALED OPTICAL SEMICONDUCTOR USING THE SAME
    • 用于密封光学半导体的可热固性硅氧烷树脂组合物和使用该半导体的密封光学半导体
    • US20120211797A1
    • 2012-08-23
    • US13402322
    • 2012-02-22
    • Takeaki SaikiYoshihito Takei
    • Takeaki SaikiYoshihito Takei
    • H01L33/52C08G77/08C08G77/04
    • C08L83/04C08G77/18H01L23/293H01L2224/73265
    • A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e  (1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.
    • 一种用于密封光学半导体的可热固化的有机硅树脂组合物,包括:组分(A):100质量份由下式(1)表示的硅化合物; 和组分(B):0.001至10质量份的缩合催化剂。 (R1SiO3 / 2)a((R2)2SiO2 / 2)b((R3)3SiO1 / 2)c(SiO4 / 2)d(XO1 / 2)e(1)在该式中,R1,R2和R3为 相同或不同的一价有机基团,“X”为氢原子或一价有机基团,“a”为正数,“b”为0或正数,“c”为0或正数,“d “为0或正数,”e“为0或正数; 然而,“a”至“e”满足以下条件:b / a为0〜10的数,c / a为0〜0.5的数,d /(a + b + c + d) 0〜0.3,e /(a + b + c + d)为0.01〜1.5的数。