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1. 发明申请

US20100156587A1 THERMOSETTING RESIN COMPOSITION AND COIL FOR ELECTRIC MACHINE 审中-公开
标题翻译：电机的热固性树脂组合物和线圈
公开(公告)号：US20100156587A1
公开(公告)日：2010-06-24
申请号：US12644184
申请日：2009-12-22
申请人： Takahito Muraki , Hisashi Morooka , Hiroyuki Kagawa , Satoru Amou
发明人： Takahito Muraki , Hisashi Morooka , Hiroyuki Kagawa , Satoru Amou
IPC分类号： H01F17/04 , C08F16/12 , C08F8/14
CPC分类号： C08F290/06 , C08F283/01 , C08F290/061 , C08F290/14 , C08F290/141
摘要： A thermosetting resin composition comprises (A) a polymeric component having at least two polymerizable substituents in the molecule, (B) a compound having at least one polymerizable substituent in the molecule and (C) a living polymerization agent for curing the resin composition.
摘要翻译：热固性树脂组合物包含（A）在分子中具有至少两个可聚合取代基的聚合物组分，（B）分子中具有至少一个可聚合取代基的化合物和（C）用于固化树脂组合物的活性聚合剂。

2. 发明申请

US20110316661A1 UNSATURATED POLYESTER RESIN COMPOSITION FOR COIL ADHESION 审中-公开
标题翻译：不饱和聚酯树脂组合物用于线圈粘合
公开(公告)号：US20110316661A1
公开(公告)日：2011-12-29
申请号：US13167147
申请日：2011-06-23
申请人： Takahito MURAKI , Satoru Amou , Tomio Iwasaki
发明人： Takahito MURAKI , Satoru Amou , Tomio Iwasaki
IPC分类号： H01F17/04 , C09J133/04 , C09J131/02 , C09J4/00
CPC分类号： H01F27/022 , C09J4/06 , H01B3/425 , H01F17/04
摘要： It is an objective of the present invention to provide a highly adhesive unsaturated polyester resin composition for fixing or immobilizing coils. There is provided an unsaturated polyester resin composition for adhesion of a coil, which includes the ingredients of: A) an unsaturated polyester resin and/or a vinyl ester resin; B) a monomer including a vinyl group as a polymerizable substituent at at least one end thereof; C) an isocyanate; and D) a polymerization initiator.
摘要翻译：本发明的目的是提供用于固定或固定线圈的高粘合性不饱和聚酯树脂组合物。提供了一种用于线圈粘附的不饱和聚酯树脂组合物，其包括以下成分：A）不饱和聚酯树脂和/或乙烯基酯树脂; B）在其至少一端含有乙烯基作为聚合性取代基的单体; C）异氰酸酯; 和D）聚合引发剂。

3. 发明申请

US20120097447A1 ELECTRIC EQUIPMENT HAVING INSULATION STRUCTURE AT WELDING PARTS 有权
标题翻译：在焊接部件上具有绝缘结构的电气设备
公开(公告)号：US20120097447A1
公开(公告)日：2012-04-26
申请号：US13274371
申请日：2011-10-17
申请人： Takahito MURAKI , Satoru Amou
发明人： Takahito MURAKI , Satoru Amou
IPC分类号： H01R4/00 , B05D5/12
CPC分类号： H01R4/70 , H01R4/029 , H02K3/30 , H02K3/38 , H02K2213/03
摘要： An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 μm in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more.According to the present invention, the insulation performance of the insulation structure in which the welding part formed by joining the end parts of the plurality of conductors with each other can be improved, the welding part having a rectangular cross section and being coated with an insulating coating, and a highly reliable electric equipment can be provided.
摘要翻译：本发明的电气设备在通过将多个导体的端部彼此连接而形成的焊接部分具有绝缘结构，焊接部分具有矩形横截面并且涂覆有绝缘涂层，其中绝缘涂层是无孔隙的，并且在焊接部分中具有50至1000μm的涂层厚度，并且其中绝缘涂层的边缘覆盖率为20％以上。根据本发明，可以提高绝缘结构的绝缘性能，其中通过将多个导体的端部彼此接合形成的焊接部分，焊接部件具有矩形横截面并且涂覆有绝缘体可以提供涂层和高可靠性的电气设备。

4. 发明申请

US20140211373A1 ORGANIC-INORGANIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：有机无机复合材料及其制造方法
公开(公告)号：US20140211373A1
公开(公告)日：2014-07-31
申请号：US14238910
申请日：2012-08-02
申请人： Taku Oyama , Satoru Amou , Kosuke Kuwabara , Takahito Muraki
发明人： Taku Oyama , Satoru Amou , Kosuke Kuwabara , Takahito Muraki
IPC分类号： C08G73/02 , H01G9/00 , H01G9/025
CPC分类号： C08G73/0266 , C07F1/12 , C08G61/126 , C08G2261/3223 , C08G2261/964 , C08L79/02 , H01B1/22 , H01G9/0036 , H01G9/025 , H01G9/028
摘要： The purpose of the present invention is to provide composite particulates and a method for manufacturing the composite particulates, the particulates including an organic substance and a metal having exceptional adhesiveness to a substrate, allowing easier control over metallic particle dispersion, facilitating control over electrical conductivity, and exhibiting high electroconductivity. The metallic particulates are characterized in that they have a thiol compound coordinated on the surfaces thereof, they are adsorbed onto a substrate with a silane compound interposed therebetween, and the thiol compound on the surfaces is subjected to oxidative polymerization, thereby yielding a structure in which an electroconductive polymer is coordinate-bonded to the surface of the metallic particulates.
摘要翻译：本发明的目的是提供复合颗粒和制造复合颗粒的方法，包括有机物质和金属的颗粒与基材具有优异的粘合性，允许更容易地控制金属颗粒分散，促进对导电性的控制，并具有高导电性。金属微粒的特征在于它们具有在其表面上配位的硫醇化合物，它们被硅烷化合物吸附在基板上，并且表面上的硫醇化合物进行氧化聚合，从而产生其中导电聚合物与金属颗粒的表面配位结合。

5. 发明授权

US08735724B2 Electric equipment having insulation structure at welding parts 有权
标题翻译：焊接部件具有绝缘结构的电气设备
公开(公告)号：US08735724B2
公开(公告)日：2014-05-27
申请号：US13274371
申请日：2011-10-17
申请人： Takahito Muraki , Satoru Amou
发明人： Takahito Muraki , Satoru Amou
IPC分类号： H01R4/00 , H02G3/06 , H02G15/08
CPC分类号： H01R4/70 , H01R4/029 , H02K3/30 , H02K3/38 , H02K2213/03
摘要： An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 μm in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more.According to the present invention, the insulation performance of the insulation structure in which the welding part formed by joining the end parts of the plurality of conductors with each other can be improved, the welding part having a rectangular cross section and being coated with an insulating coating, and a highly reliable electric equipment can be provided.
摘要翻译：本发明的电气设备在通过将多个导体的端部彼此连接而形成的焊接部分具有绝缘结构，焊接部分具有矩形横截面并且涂覆有绝缘涂层，其中绝缘涂层是无孔隙的，并且在焊接部分中具有50至1000μm的涂层厚度，并且其中绝缘涂层的边缘覆盖率为20％以上。根据本发明，可以提高绝缘结构的绝缘性能，其中通过将多个导体的端部彼此接合形成的焊接部分，焊接部件具有矩形横截面并且涂覆有绝缘体可以提供涂层和高可靠性的电气设备。

6. 发明申请

US20100180934A1 LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME AND ELECTRONIC PARTS 有权
标题翻译：低熔点玻璃组合物，使用它们的粘合材料和电子部件
公开(公告)号：US20100180934A1
公开(公告)日：2010-07-22
申请号：US12687142
申请日：2010-01-14
申请人： Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Keiichi Kanazawa , Shinji Yamada , Satoru Amou , Hiroki Yamamoto , Takuya Aoyagi
发明人： Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Keiichi Kanazawa , Shinji Yamada , Satoru Amou , Hiroki Yamamoto , Takuya Aoyagi
IPC分类号： H01L31/0224 , C03C3/21 , C03C8/00 , C03C14/00 , H01B1/02 , H01B5/14
CPC分类号： C03C8/08 , C03C3/21 , C03C8/24 , H01L31/022425 , Y02E10/50
摘要： A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.
摘要翻译：低软化点玻璃组合物，其基本上不含铅，铋和锑，并且包含钒，磷，碲和铁的氧化物，组合物的软化点为380℃或更低。

7. 发明授权

US5071824A Heat transfer sheet, method for producing it, and method of heat transfer 失效
标题翻译：传热片，其制造方法和热传递方法
公开(公告)号：US5071824A
公开(公告)日：1991-12-10
申请号：US406536
申请日：1989-09-13
申请人： Shuichi Ohara , Satoru Amou , Shinichi Akasaka
发明人： Shuichi Ohara , Satoru Amou , Shinichi Akasaka
IPC分类号： B41M5/385 , B41M5/035 , B41M5/26 , B41M5/30 , B41M5/388 , B41M5/39 , D06P5/00
CPC分类号： B41M5/385 , B41M5/3854 , B41M5/388 , Y10S428/913 , Y10S428/914
摘要： A heat transfer sheet which has a high recording sensitivity and can form image of high maximum reflection density and of high contrast is provided by containing in an ink layer of the heat transfer sheet at least one dye which has a product of an extinction coefficient (l.cm.sup.-1.g.sup.-1) and an evaporation or sublimation rate at 240.degree. C. (wt %.min..sup.-1) of at least 1.8.times.10.sup.2 (l.wt %.cm.sup.-1.g.sup.-1.min.sup.-1).
摘要翻译：通过在传热片的油墨层中含有至少一种具有消光系数（l）的产物的染料，提供具有高记录灵敏度并且可以形成高最大反射浓度和高对比度的图像的传热片 .cm-1.g-1），并且在240℃（wt％.min.-1）下的蒸发或升华速率为至少1.8×102（重量％.cm-1.g-1.min- 1）。

8. 发明授权

US08470723B2 Low softening point glass composition, bonding material using same and electronic parts 有权
标题翻译：低软化点玻璃组合物，使用相同材料的接合材料和电子部件
公开(公告)号：US08470723B2
公开(公告)日：2013-06-25
申请号：US12687142
申请日：2010-01-14
申请人： Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Keiichi Kanazawa , Shinji Yamada , Satoru Amou , Hiroki Yamamoto , Takuya Aoyagi
发明人： Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Keiichi Kanazawa , Shinji Yamada , Satoru Amou , Hiroki Yamamoto , Takuya Aoyagi
IPC分类号： C03C8/08 , C03C3/21 , C03C8/14 , C03C3/18 , C03C8/16 , B32B17/06
CPC分类号： C03C8/08 , C03C3/21 , C03C8/24 , H01L31/022425 , Y02E10/50
摘要： A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.
摘要翻译：低软化点玻璃组合物，其基本上不含铅，铋和锑，并且包含钒，磷，碲和铁的氧化物，组合物的软化点为380℃或更低。

9. 发明授权

US08227361B2 Prepreg and printed wiring board using thin quartz glass cloth 有权
标题翻译：预浸料和印刷线路板采用薄型石英玻璃布
公开(公告)号：US08227361B2
公开(公告)日：2012-07-24
申请号：US12453029
申请日：2009-04-28
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： B32B17/02 , B32B27/04
CPC分类号： H05K1/0366 , C08J5/24 , H05K1/024 , H05K2201/012 , H05K2201/029 , Y10T442/2418 , Y10T442/2992
摘要： It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.
摘要翻译：本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用预浸料作为绝缘层。

10. 发明授权

US08115105B2 Prepreg and its application products for low thermal expansion and low dielectric tangent 有权
标题翻译：预浸料及其低热膨胀和低介质切线的应用产品
公开(公告)号：US08115105B2
公开(公告)日：2012-02-14
申请号：US12353357
申请日：2009-01-14
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： H05K1/00
CPC分类号： H05K1/0366 , B32B3/08 , B32B3/18 , B32B5/022 , B32B5/024 , B32B15/02 , B32B15/14 , B32B15/20 , B32B17/02 , B32B2260/021 , B32B2260/046 , B32B2262/0253 , B32B2262/101 , B32B2307/202 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/00 , B32B2457/04 , B32B2457/08 , H05K3/4069 , H05K3/4652 , H05K2201/012 , H05K2201/0133 , H05K2201/0278 , H05K2201/068 , Y10T442/2475
摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
摘要翻译：包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中，在50〜100℃下的固化树脂组合物为50ppm /℃以下。公开了印刷电路板，多层电路板和电子部件。

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