专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11776756B2 Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component 有权
公开(公告)号：US11776756B2
公开(公告)日：2023-10-03
申请号：US17591389
申请日：2022-02-02
申请人： TAIYO YUDEN CO., LTD.
发明人： Ryosuke Hoshino , Satoshi Kobayashi
IPC分类号： H01G4/30 , H01G4/012 , C04B35/64 , H01G4/008 , H01G2/06 , H01G4/12
CPC分类号： H01G4/30 , C04B35/64 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1218
摘要： A ceramic electronic component includes an element body, and first and second external electrodes formed on the element body. The element body has a dielectric, and first and second internal electrodes. The first external electrode includes a first base layer formed on the element body. The first base layer is connected to the first internal electrode and an edge of the first baser layer is present on a first surface of the element body. The first external electrode also includes a first plating layer formed on the first base layer. An edge of the first plating layer is present on the first surface of the element body at a position different from a position of the edge of the first base layer in a direction perpendicular to the first surface. The second external electrode has a similar structure to the first external electrode.

2. 发明授权

US11688559B2 Multilayer ceramic capacitor having external electrodes provided with fluorine compound 有权
公开(公告)号：US11688559B2
公开(公告)日：2023-06-27
申请号：US16828786
申请日：2020-03-24
申请人： TAIYO YUDEN CO., LTD.
发明人： Kiyoshiro Yatagawa , Satoshi Kobayashi , Takahisa Fukuda
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/248
CPC分类号： H01G4/30 , H01G4/012 , H01G4/1209 , H01G4/248
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.

3. 发明授权

US11631542B2 Electronic component, circuit board arrangement and method of manufacturing electronic component 有权
公开(公告)号：US11631542B2
公开(公告)日：2023-04-18
申请号：US17331559
申请日：2021-05-26
申请人： TAIYO YUDEN CO., LTD.
发明人： Kiyoshiro Yatagawa , Satoshi Kobayashi , Ryosuke Hoshino
IPC分类号： H01G4/30 , H05K1/18 , H01G4/12 , H01G4/248 , H01G4/012
摘要： An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.

4. 发明授权

US11482381B2 Ceramic electronic component, method of producing the same, and circuit board 有权
公开(公告)号：US11482381B2
公开(公告)日：2022-10-25
申请号：US17194128
申请日：2021-03-05
申请人： TAIYO YUDEN CO., LTD.
发明人： Ryosuke Hoshino , Satoshi Kobayashi , Yasuaki Uchida , Satsuki Fujii
IPC分类号： H01G4/30 , H05K1/18 , H05K1/11 , H01G4/012 , H01G4/12 , H01G4/228
摘要： A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

5. 发明授权

US11361891B2 Coil component 有权
公开(公告)号：US11361891B2
公开(公告)日：2022-06-14
申请号：US16042358
申请日：2018-07-23
申请人： TAIYO YUDEN CO., LTD.
发明人： Natsuko Sato , Satoshi Tokunaga , Satoshi Kobayashi
IPC分类号： H01F5/04 , H01F17/04 , H01F38/14 , H01F27/32 , H01F27/02 , H01F17/00
摘要： One object is to provide a magnetic coupling coil component having an improved coupling coefficient. A coil component according to one embodiment of the present invention includes: an insulator body; and first and second coil conductors embedded in the insulator body and wound around a coil axis. A first coil surface of the first coil conductor is opposed to a second coil surface of the second coil conductor. The insulator body includes: an intermediate portion disposed between the first coil surface and the second coil surface; a core portion disposed inside the first and second coil conductors; and an outer peripheral portion disposed outside the first and second coil conductors. A magnetic permeability of the intermediate portion in a direction perpendicular to the coil axis is smaller than those of the core portion and the outer peripheral portion in a direction parallel to the coil axis.

6. 发明授权

US11735372B2 Ceramic electronic device 有权
公开(公告)号：US11735372B2
公开(公告)日：2023-08-22
申请号：US17669160
申请日：2022-02-10
申请人： TAIYO YUDEN CO., LTD.
发明人： Kiyoshiro Yatagawa , Satoshi Kobayashi , Takahisa Fukuda
IPC分类号： H01G4/30 , H01G4/12 , H01G4/248
CPC分类号： H01G4/30 , H01G4/1209 , H01G4/248
摘要： A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face; a first external electrode provided on the first end face; and a second external electrode provided on the second end face, wherein a silane film is provided on a surface of the ceramic electronic device, and wherein an organic compound is provided on the silane film, and has a siloxane bonding.

7. 发明授权

US11361890B2 Coil element 有权
公开(公告)号：US11361890B2
公开(公告)日：2022-06-14
申请号：US16941066
申请日：2020-07-28
申请人： TAIYO YUDEN CO., LTD.
发明人： Satoshi Kobayashi , Satoshi Tokunaga
IPC分类号： H01F27/28 , H01F27/29 , H01F5/00 , H01F5/06 , H01F27/245 , H01F27/255 , H01F17/04 , H01F17/00
摘要： One object is to lessen the difference between the direction of the magnetic flux and the easy direction of magnetization in a coil element and improve the effective permeability of the coil element. A coil element according to one element of the present invention includes: a coil conductor wound around a coil axis; at least one isotropic magnetic material layer provided on at least one of an upper surface and a lower surface of the coil conductor, the at least one isotropic magnetic material layer being made of an isotropic magnetic material; and at least one anisotropic magnetic material layer provided on an opposite surface of the at least one isotropic magnetic material layer to the coil conductor, the at least one anisotropic magnetic material layer being made of an anisotropic magnetic material having an easy direction of magnetization oriented perpendicular to the coil axis.

8. 发明授权

US11315731B2 Ceramic electronic device and manufacturing method of the same 有权
公开(公告)号：US11315731B2
公开(公告)日：2022-04-26
申请号：US17116114
申请日：2020-12-09
申请人： TAIYO YUDEN CO., LTD.
发明人： Kiyoshiro Yatagawa , Satoshi Kobayashi
IPC分类号： H01G4/224 , H01G4/008 , H01G4/30 , H01G4/012 , H01G4/12
摘要： A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.

9. 发明授权

US09349539B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US09349539B2
公开(公告)日：2016-05-24
申请号：US13949028
申请日：2013-07-23
申请人： TAIYO YUDEN CO., LTD.
发明人： Satoshi Kobayashi , Tomoaki Nakamura , Takahisa Fukuda
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06 , H01G4/30 , H01G4/232 , H01G4/12
CPC分类号： H01G4/30 , H01G4/12 , H01G4/2325
摘要： A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A≦0.47 and condition C/A≧0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer.
摘要翻译：陶瓷电子部件包括具有包括中间导电树脂层的多层结构的外部电极，其中外部电极中的中间导电树脂层由包含导电填料的环氧树脂制成，并且中间导电树脂层满足条件B （A，B，C表示通过ATR法获得的基于中间导电性树脂层的波数和光谱强度的关系线得到的最大光谱强度）。陶瓷电子部件最小化在这种中间导电树脂层和金属层之间的界面处可能发生的分离。

10. 发明授权

US11842839B2 Magnetic coupling coil component 有权
公开(公告)号：US11842839B2
公开(公告)日：2023-12-12
申请号：US16995215
申请日：2020-08-17
申请人： TAIYO YUDEN CO., LTD.
发明人： Satoshi Kobayashi , Tomoo Kashiwa
IPC分类号： H01F17/04 , H01F27/24 , H01F27/32 , H01F27/28 , H01F27/29 , H01F27/38
CPC分类号： H01F27/24 , H01F17/045 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/324 , H01F27/38
摘要： One object of the present invention is to provide a magnetic coupling coil component having a coupling coefficient that can be readily adjusted. A coil component according to one embodiment of the present invention includes: a drum core including a winding core, a first flange, and a second flange, the first flange being provided on one axial end of the winding core, the second flange being provided on another axial end of the winding core; a spacer provided on a surface of the winding core between the first flange and the second flange, the spacer being separate from the winding core; a first winding wire wound around the winding core between the first flange and the spacer; and a second winding wire wound around the winding core between the second flange and the spacer.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式