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    • 5. 发明授权
    • Method for forming a planarized layer of a semiconductor device
    • 用于形成半导体器件的平坦化层的方法
    • US07008755B2
    • 2006-03-07
    • US10464645
    • 2003-06-19
    • Ki-Jong ParkIn-Seak HwangTae-Won Kim
    • Ki-Jong ParkIn-Seak HwangTae-Won Kim
    • G03F7/00G03F7/36
    • H01L21/31055H01L21/0273H01L21/31053H01L21/31144H01L21/76819H01L27/10814H01L27/10894
    • In a method for forming a planarized layer on a semiconductor device having concave and convex structures, a dielectric film is formed on a semiconductor substrate; a photoresist pattern is formed to have a thickness on a portion of the dielectric film other than a convex portion greater than h/n (h and n are real numbers of one or more) to remove the convex portion of the dielectric film by a depth of approximately h. The photoresist pattern is re-flowed to have a thickness below h/n at a portion from an edge of the convex portion to a slant portion of the dielectric film. The dielectric film is etched using an etchant having a selectivity of 1:n between the photoresist pattern and the dielectric film. An edge of the photoresist pattern is made thin by re-flowing thereby minimizing a pillar, hence allowing simple, fast, planarization of the dielectric film.
    • 在具有凹凸结构的半导体器件上形成平坦化层的方法中,在半导体衬底上形成电介质膜; 光致抗蚀剂图案形成为具有除了大于h / n(h和n为一个或多个的实数)的凸部以外的电介质膜的一部分上的厚度,以将电介质膜的凸部去除深度 大约h。 在从凸部的边缘到电介质膜的倾斜部分的部分,光致抗蚀剂图案被重新流动以具有低于h / n的厚度。 使用在光致抗蚀剂图案和电介质膜之间具有1:n选择性的蚀刻剂来蚀刻电介质膜。 通过再流动使光致抗蚀剂图案的边缘变薄,从而使柱最小化,从而允许简单,快速地平坦化介电膜。