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1. 发明授权

US08291967B2 Heat sink and cooler 有权
标题翻译：散热器和冷却器
公开(公告)号：US08291967B2
公开(公告)日：2012-10-23
申请号：US12304891
申请日：2007-06-12
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/02 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.
摘要翻译：散热器包括多个翅片。翅片形成为用作冷却剂流动路径的分隔壁。翅片形成为使得冷却剂沿其表面流动。形成合并空间以允许由翅片分开的流动路径中的冷却剂合流。在由翅片形成的流路中形成合并空间。

2. 发明授权

US08251131B2 Injection cooling heat exchanger for vehicle electrical components 有权
标题翻译：汽车电气部件注射冷却热交换器
公开(公告)号：US08251131B2
公开(公告)日：2012-08-28
申请号：US12307493
申请日：2007-07-10
申请人： Tadafumi Yoshida , Yutaka Yokoi , Hiroshi Osada
发明人： Tadafumi Yoshida , Yutaka Yokoi , Hiroshi Osada
IPC分类号： B60H1/00 , F28D11/06 , F28D15/00 , H01L23/34 , H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of a inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member.
摘要翻译：一种冷却装置，包括设有冷却剂介质的流入口的吸热单元和用于排出冷却剂介质的排出口，将冷却介质密封在流入口和排出口以外的部分，其中，吸热单元包括安装具有用作待冷却物体的半导体元件的安装表面的上部构件和用作安装表面的后表面的冷却表面，以及形成具有作为内壁表面的一部分的冷却表面的室的下部构件与上层成员一起。设置与流入口连通以将冷却剂介质朝向冷却表面喷射的喷射口，并且排出口设置在低于下部构件中的喷射口的打开位置的位置。

3. 发明授权

US08213179B2 Semiconductor element cooling structure 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US08213179B2
公开(公告)日：2012-07-03
申请号：US12664572
申请日：2008-06-10
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi , Yasushi Yamada
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi , Yasushi Yamada
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L25/072 , H01L2924/0002 , H02M7/003 , H05K7/20254 , H01L2924/00
摘要： A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.
摘要翻译：半导体元件冷却结构包括多个半导体元件和在其中具有冷却介质通道并与多个半导体元件电连接的电极结构。电极结构包括在相对表面各自具有半导体元件的交流电极和分别安装在交流电极的相对表面上的交流电极和半导体元件之间的多个直流电极。每个交流电极和直流电极都具有冷却介质通道。

4. 发明授权

US08125078B2 Semiconductor element cooling structure 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US08125078B2
公开(公告)日：2012-02-28
申请号：US12521225
申请日：2008-01-09
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element. A protruded portion for the second semiconductor element is provided to be positioned on the downstream side of first semiconductor element and upstream side than the center of second semiconductor element in the direction of arrow DR1.
摘要翻译：半导体元件冷却结构包括第一和第二半导体元件; 具有安装有半导体元件的安装面的散热器和内部形成的冷却介质通道，用于冷却半导体元件的冷却介质流过该散热器; 以及突出部，其设置在与所述散热器的安装面相反的位置，在与所述冷却介质的流动方向（箭头DR1的方向）相交的方向上延伸并且从所述冷却介质通道的底面突出到所述冷却介质的内部冷却介质通道。半导体元件沿箭头DR1的方向并排布置，使得第一半导体元件位于比第二半导体元件的上游侧。第二半导体元件的突出部分设置成位于第一半导体元件的下游侧并且比箭头DR1的方向上的第二半导体元件的中心更靠上游侧。

5. 发明申请

US20100319876A1 SEMICONDUCTOR ELEMENT COOLING STRUCTURE 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US20100319876A1
公开(公告)日：2010-12-23
申请号：US12526361
申请日：2008-02-04
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： F28F13/00
CPC分类号： H01L23/345 , H01L23/34 , H01L23/473 , H01L24/37 , H01L24/40 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/40139 , H01L2924/00014
摘要： A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.
摘要翻译：半导体元件冷却结构包括半导体元件，其上安装有半导体元件的散热器和以与半导体元件相对的散热器相对的方式附接到半导体元件的蓄热构件，并且具有壳体和潜热蓄热材料。

6. 发明申请

US20090090490A1 COOLER 审中-公开
标题翻译：冷却器
公开(公告)号：US20090090490A1
公开(公告)日：2009-04-09
申请号：US12293469
申请日：2007-03-28
申请人： Tadafumi Yoshida , Yutaka Yokoi , Hiroshi Osada
发明人： Tadafumi Yoshida , Yutaka Yokoi , Hiroshi Osada
IPC分类号： F28D15/00
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A cooler includes a substrate for disposing a semiconductor device thereon, a plate member fixed to a back surface of the substrate, a primary pipe, and a secondary pipe. A space sandwiched between the substrate and the primary pipe defines a first flow path for a coolant. The primary pipe and the secondary pipe configure a second flow path for a coolant. The secondary pipe is positioned to jet a coolant toward a region opposite to that having the semiconductor device disposed therein. The second flow path is separated from the first flow path.
摘要翻译：冷却器包括用于在其上设置半导体器件的衬底，固定到衬底的后表面的板构件，主管和次级管。夹在基板和主管之间的空间限定了用于冷却剂的第一流动路径。主管和次管配置冷却剂的第二流路。次级管被定位成朝着与其中设置有半导体器件的区域相对的区域喷射冷却剂。第二流路与第一流路分离。

7. 发明申请

US20100090336A1 SEMICONDUCTOR ELEMENT COOLING STRUCTURE 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US20100090336A1
公开(公告)日：2010-04-15
申请号：US12521225
申请日：2008-01-09
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element. A protruded portion for the second semiconductor element is provided to be positioned on the downstream side of first semiconductor element and upstream side than the center of second semiconductor element in the direction of arrow DR1.
摘要翻译：半导体元件冷却结构包括第一和第二半导体元件; 具有安装有半导体元件的安装面的散热器和内部形成的冷却介质通道，用于冷却半导体元件的冷却介质流过该散热器; 以及突出部，其设置在与所述散热器的安装面相反的位置，在与所述冷却介质的流动方向（箭头DR1的方向）相交的方向上延伸并且从所述冷却介质通道的底面突出到所述冷却介质的内部冷却介质通道。半导体元件沿箭头DR1的方向并排布置，使得第一半导体元件位于比第二半导体元件的上游侧。第二半导体元件的突出部分设置成位于第一半导体元件的下游侧并且比箭头DR1的方向上的第二半导体元件的中心更靠上游侧。

8. 发明授权

US08919424B2 Semiconductor element cooling structure 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US08919424B2
公开(公告)日：2014-12-30
申请号：US12526361
申请日：2008-02-04
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： F28F7/00 , F28D17/00 , F25D23/12 , H05K7/20 , H01L23/34 , H01L23/473
CPC分类号： H01L23/345 , H01L23/34 , H01L23/473 , H01L24/37 , H01L24/40 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/40139 , H01L2924/00014
摘要： A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.
摘要翻译：半导体元件冷却结构包括半导体元件，其上安装有半导体元件的散热器和以与半导体元件相对的散热器相对的方式附接到半导体元件的蓄热构件，并且具有壳体和潜热蓄热材料。

9. 发明授权

US08803275B2 Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle 有权
标题翻译：包括功率半导体元件，分支线和热电转换元件的半导体器件和电动车辆
公开(公告)号：US08803275B2
公开(公告)日：2014-08-12
申请号：US12532120
申请日：2008-03-12
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： H01L31/058 , H02H3/22
CPC分类号： H01L23/38 , H01L23/34 , H01L23/473 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate.
摘要翻译：提供珀耳帖元件，使得形成吸热部分的导电板紧邻绝缘层，并且形成热辐射部分的导电板靠近绝缘层设置。珀耳帖元件的一端连接到从电力线分支的分支线，并且另一端电连接到电极板。此外，珀耳帖元件从分支线接收供应到功率晶体管的一部分电力，并将其输出到电极板。换句话说，珀尔帖元件使用提供给功率晶体管的电力的一部分来吸收由功率晶体管产生的热并将其辐射向散热板。

10. 发明申请

US20100182747A1 SEMICONDUCTOR ELEMENT COOLING STRUCTURE 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US20100182747A1
公开(公告)日：2010-07-22
申请号：US12664572
申请日：2008-06-10
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi , Yasushi Yamada
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi , Yasushi Yamada
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L25/072 , H01L2924/0002 , H02M7/003 , H05K7/20254 , H01L2924/00
摘要： A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.
摘要翻译：半导体元件冷却结构包括多个半导体元件和在其中具有冷却介质通道并与多个半导体元件电连接的电极结构。电极结构包括在相对表面各自具有半导体元件的交流电极和分别安装在交流电极的相对表面上的交流电极和半导体元件之间的多个直流电极。每个交流电极和直流电极都具有冷却介质通道。

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