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1. 发明申请

US20130236838A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM 审中-公开
标题翻译：基板处理装置，基板处理方法和存储介质
公开(公告)号：US20130236838A1
公开(公告)日：2013-09-12
申请号：US13862526
申请日：2013-04-15
申请人： TOKYO ELECTRON LIMITED
发明人： Kenichirou MATSUYAMA , Tomohiro KANEKO
IPC分类号： G03F7/20
CPC分类号： G03F7/20 , H01L21/6715 , H01L21/67178 , H01L21/67276 , H01L21/67745 , H01L21/67769
摘要： A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.
摘要翻译：公开了一种基板处理装置，其具有将在处理块处理的基板传送到载体的转印机构，从而抑制转印处理次数的增加，提高处理效率。衬底处理装置被配置成使得当第二转移模块容纳至少一个衬底时，可以容纳至少一个衬底的载体不被放置在载体放置单元中时，所述至少一个衬底是转移到缓冲模块。当第二转移模块容纳至少一个基底并且能够容纳至少一个基底的载体被放置在载体放置单元中时，至少一个基底被转移到载体，而不管基底是否是从缓冲模块传输到载体。

2. 发明公开

US20240331998A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM 审中-公开
公开(公告)号：US20240331998A1
公开(公告)日：2024-10-03
申请号：US18711900
申请日：2022-11-15
申请人： Tokyo Electron Limited
发明人： Susumu HAYAKAWA , Kazuya IKEUE , Tomohiro KANEKO
IPC分类号： H01L21/02 , B24B7/22 , B24B41/00 , B24B51/00
CPC分类号： H01L21/02013 , B24B7/228 , B24B41/005 , B24B51/00
摘要： A substrate processing method of processing a substrate includes: grinding a first surface of the substrate; and grinding, after grinding the first surface, a second surface of the substrate opposite to the first surface. A first grinding mark extending from a center of the first surface toward an outer periphery thereof in a gently curved manner is formed when the first surface is ground, a second grinding mark extending from a center of the second surface toward an outer periphery thereof in a gently curved manner is formed when the second surface is ground, and a curving direction of the first grinding mark and a curving direction of the second grinding mark are opposite when viewed through from one of the first surface or the second surface.

3. 发明公开

US20240017375A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20240017375A1
公开(公告)日：2024-01-18
申请号：US18254608
申请日：2021-11-15
申请人： Tokyo Electron Limited
发明人： Takeshi TAMURA , Munehisa KODAMA , Tomohiro KANEKO
IPC分类号： B24B49/02 , B24B7/04
CPC分类号： B24B49/02 , B24B7/04
摘要： A substrate processing system configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a processing apparatus configured to grind the first substrate; a first thickness measuring apparatus configured to measure a thickness of the first substrate before being ground by the processing apparatus and a total thickness of the combined substrate including the first substrate; and a second thickness measuring apparatus configured to measure the thickness of the first substrate after being ground by the processing apparatus.

4. 发明申请

US20220402094A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220402094A1
公开(公告)日：2022-12-22
申请号：US17776642
申请日：2020-11-02
申请人： Tokyo Electron Limited
发明人： Nobutaka FUKUNAGA , Takeshi MATSUMOTO , Tomohiro KANEKO
IPC分类号： B24B49/05 , H01L21/304 , H01L21/66
摘要： A substrate processing method includes measuring a first thickness distribution of a first substrate in a first one of multiple combined substrates before being subjected to a finishing grinding; measuring a second thickness distribution of the first substrate in a second one of the multiple combined substrates before being subjected to the finishing grinding; deciding a relative inclination between a substrate holder configured to hold the second one of the multiple combined substrates and a grinder configured to perform the finishing grinding on the corresponding combined substrate, based on first difference data between the first thickness distribution and the second thickness distribution; and performing finishing grinding on the first substrate in the second one of the multiple combined substrates while holding the second one of the multiple combined substrates at the inclination which is decided.

5. 发明申请

US20220277962A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20220277962A1
公开(公告)日：2022-09-01
申请号：US17627147
申请日：2020-07-08
申请人： Tokyo Electron Limited
发明人： Munehisa KODAMA , Tomohiro KANEKO
IPC分类号： H01L21/306 , H01L21/02 , H01L21/67 , H01L21/687
摘要： A substrate processing apparatus includes a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards; a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards; a rotary table which is configured to be rotated about a rotation axis; a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.

6. 发明公开

US20230341224A1 THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD 审中-公开
公开(公告)号：US20230341224A1
公开(公告)日：2023-10-26
申请号：US18044590
申请日：2021-08-27
申请人： Tokyo Electron Limited
发明人： Takeshi TAMURA , Munehisa KODAMA , Tomohiro KANEKO
IPC分类号： G01B21/08
CPC分类号： G01B21/08
摘要： A thickness measuring device configured to measure a thickness of a substrate includes a substrate holder configured to hold the substrate; a measurer configured to measure the thickness of the substrate held by the substrate holder; and a moving mechanism configured to move the substrate holder and the measurer relatively in a horizontal direction. The substrate holder is provided with a notch portion which extends in a diametrical direction from a center of the substrate holder to an outer end thereof, and the measurer is configured to be relatively advanced into or retreated from the notch portion.

7. 发明申请

US20150077727A1 COATING AND DEVELOPING APPARATUS, METHOD OF OPERATING THE SAME AND STORAGE MEDIUM 有权
标题翻译：涂料和开发设备，操作方法和储存介质
公开(公告)号：US20150077727A1
公开(公告)日：2015-03-19
申请号：US14488737
申请日：2014-09-17
申请人： TOKYO ELECTRON LIMITED
发明人： Tomohiro KANEKO
IPC分类号： G03F7/20
CPC分类号： G03F7/2035 , G03F7/3042
摘要： A coating and developing apparatus includes: first and second transfer mechanisms for transferring a substrate from a first mount module to a second mount module, one of the first and second transfer mechanisms being selected each time when the substrate transfer should be performed; first and second processing modules for performing substrate processing, for which the transfer of substrates is performed by the first and second transfer mechanisms, respectively; and a control unit. The control unit controls the transfer mechanisms for the substrate transfer by determining a delay time, representing a delay caused by the transfer of the substrate to the second mount module to the timing of transfer of a substrate from the first/second processing module, in regard to each of the first and second transfer mechanisms and selecting one of the first and second transfer mechanisms whose delay time is the shortest.
摘要翻译：涂覆和显影设备包括：第一和第二传送机构，用于将基板从第一安装模块传送到第二安装模块，每当要执行基板传送时，选择第一和第二传送机构中的一个; 用于执行基板处理的第一和第二处理模块，其中基板的传送分别由第一和第二传送机构执行; 和控制单元。控制单元通过确定延迟时间来控制基板传送的传送机构，该延迟时间表示由基板传送到第二安装模块所引起的延迟至基板从第一/第二处理模块传送的时刻到第一和第二传送机制中的每一个，并且选择延迟时间最短的第一和第二传送机制之一。

8. 发明申请

US20220402087A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220402087A1
公开(公告)日：2022-12-22
申请号：US17776639
申请日：2020-11-02
申请人： Tokyo Electron Limited
发明人： Nobutaka FUKUNAGA , Tomohiro KANEKO , Takeshi MATSUMOTO
IPC分类号： B24B7/04 , B24B49/05
摘要： A substrate processing method of grinding a first substrate in a combined substrate in which the first substrate and a second substrate are bonded to each other includes measuring a total thickness distribution of the combined substrate; measuring a thickness distribution of the first substrate; calculating a thickness distribution of the second substrate by subtracting the thickness distribution of the first substrate from the total thickness distribution of the combined substrate; deciding a relative inclination between a substrate holder configured to hold the combined substrate and a grinder configured to grind the combined substrate, based on the thickness distribution of the second substrate; and grinding the first substrate while holding the combined substrate at the inclination which is decided.

9. 发明申请

US20210362290A1 PROCESSING APPARATUS, PROCESSING METHOD AND COMPUTER- READABLE RECORDING MEDIUM 有权
公开(公告)号：US20210362290A1
公开(公告)日：2021-11-25
申请号：US17257042
申请日：2019-06-25
申请人： Tokyo Electron Limited
发明人： Tomohiro KANEKO , Takeshi MATSUMOTO , Nobutaka FUKUNAGA , Masakazu YARIMITSU , Hidejiro RYU
IPC分类号： B24B37/005 , B24B37/34
摘要： A processing apparatus includes a holder configured to hold a substrate; a grinding device configured to perform a grinding on a processing surface of the substrate held on the holder; a transfer device configured to transfer the substrate to the holder; and a controller configured to control the holder, the grinding device and the transfer device. The controller controls the holder, the grinding device and the transfer device to perform performing initialization of the holder, initialization of the grinding device and initialization of the transfer device after the processing apparatus is stopped during an operation thereof and the processing apparatus is restarted; detecting the substrate on the holder; deciding whether the grinding on the detected substrate by the grinding device is required; and performing, by the grinding device, the grinding on the processing surface of the substrate on which the grinding is decided to be required.

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