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1. 发明申请

US20160198528A1 MOUNTING TABLE AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：安装台和底板加工设备
公开(公告)号：US20160198528A1
公开(公告)日：2016-07-07
申请号：US14977001
申请日：2015-12-21
申请人： TOKYO ELECTRON LIMITED
发明人： Dai KITAGAWA
IPC分类号： H05B3/28 , H01J37/32 , H05B3/06 , H05B3/00 , H05B3/02
CPC分类号： H05B3/283 , H01J37/32724 , H01J2237/2007 , H01L21/67103 , H01L21/67109 , H01L21/68735 , H05B1/0233 , H05B2213/06
摘要： Provided is a mounting table according to one aspect of the present disclosure includes: a ceramic body; a heater provided in the ceramic body; a base including a support surface that supports the ceramic body and provides a space for accommodating a temperature sensor as a space that is opened at least at the support surface side; and a heat transfer body extending between a first end provided in the ceramic body and a second end that is positioned above the space and provided closer to the space than the first end, the heat transfer body having a heat conductivity that is higher than that of the ceramic body around the heat transfer body.
摘要翻译：根据本公开的一个方面，提供了一种安装台，包括：陶瓷体; 设置在陶瓷体中的加热器; 基部，其包括支撑陶瓷体的支撑表面，并且提供用于容纳温度传感器作为至少在支撑表面侧开口的空间的空间; 以及传热体，其在设置在所述陶瓷体中的第一端部和位于所述空间上方并且比所述第一端部更靠近所述空间设置的第二端部之间延伸，所述传热体的导热性高于传热体周围的陶瓷体。

2. 发明申请

US20170140954A1 PLACING TABLE AND PLASMA TREATMENT APPARATUS 审中-公开
公开(公告)号：US20170140954A1
公开(公告)日：2017-05-18
申请号：US15308686
申请日：2015-06-01
申请人： TOKYO ELECTRON LIMITED
发明人： Dai KITAGAWA , Katsuyuki KOIZUMI , Tsutomu NAGAI , Daisuke HAYASHI , Satoru TERUUCHI
IPC分类号： H01L21/67 , H01J37/32 , H01L21/683
摘要： A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.

3. 发明申请

US20150214653A1 FEEDER-COVER STRUCTURE AND SEMICONDUCTOR PRODUCTION APPARATUS 审中-公开
标题翻译：进料盖结构和半导体生产设备
公开(公告)号：US20150214653A1
公开(公告)日：2015-07-30
申请号：US14597312
申请日：2015-01-15
申请人： Tokyo Electron Limited
发明人： Ryota SAKANE , Dai KITAGAWA
IPC分类号： H01R13/52
CPC分类号： H01R13/631 , C23C16/4586 , C23C16/509 , C23C16/5096 , H01J37/32577 , H01R13/53 , H01R2103/00
摘要： A feeder-cover structure includes a power feeder including a socket and a plug fitted together, a cover structure that covers and seals the power feeder, and a supply mechanism that supplies dry air or an inert gas into the cover structure. A gap is formed between the power feeder and the cover structure such that the dry air or the inert gas is supplied through the gap into the cover structure.
摘要翻译：供料器盖结构包括一个供电器，它包括一个插座和一个插在一起的插头，一个覆盖和密封供电器的盖结构，以及一个将干燥空气或惰性气体供给到盖结构中的供应机构。在供电器和盖结构之间形成间隙，使得干燥空气或惰性气体通过间隙供应到盖结构中。

4. 发明申请

US20210366741A1 HEATER POWER FEEDING MECHANISM 有权
公开(公告)号：US20210366741A1
公开(公告)日：2021-11-25
申请号：US17399055
申请日：2021-08-11
申请人： Tokyo Electron Limited
发明人： Dai KITAGAWA , Katsuyuki KOIZUMI
IPC分类号： H01L21/67 , H05B3/28 , H01L21/683 , H05B1/02
摘要： A heater power feeding mechanism for independently controlling temperatures of zones of a stage on which a substrate is placed. The respective zones of the stage include heaters. The heater power feeding mechanism includes a plurality of heater terminals configured to be connected to the heaters, a plurality of heater wires connected to the heater terminals, and an offset structure that offsets the heater wires from each other. The heater terminals are disposed on the periphery of a holding plate for holding the stage.

5. 发明申请

US20160225645A1 TEMPERATURE CONTROL MECHANISM, TEMPERATURE CONTROL METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：温度控制机制，温度控制方法和基板处理装置
公开(公告)号：US20160225645A1
公开(公告)日：2016-08-04
申请号：US15021326
申请日：2014-10-16
申请人： TOKYO ELECTRON LIMITED
发明人： Katsuyuki KOIZUMI , Shigeru SENZAKI , Tomoyuki TAKAHASHI , Dai KITAGAWA
IPC分类号： H01L21/67 , H01L21/683
CPC分类号： H01L21/67103 , F27B5/14 , F27B5/18 , F27B17/0025 , F27D11/02 , F27D2019/0037 , H01L21/67248 , H01L21/6831 , H01L21/6833
摘要： There is provided a temperature control mechanism comprising: a plurality of combinations of a heater and a thyristor, wherein at least one combination of the heater and the thyristor is provided on a zone-by-zone basis, and wherein an area of an electrostatic chuck for mounting a substrate is divided into a plurality of zones; a power supply configured to supply current to heaters of the plurality of combinations respectively through the thyristors of the plurality of combinations; a pair of filters disposed at a power supply line for supplying electric power from the power supply to the heaters and configured to eliminate high frequency power applied to the power supply.
摘要翻译：提供了一种温度控制机构，包括：加热器和晶闸管的多个组合，其中加热器和晶闸管的至少一个组合在逐区的基础上设置，并且其中静电卡盘的面积将基板安装分成多个区域; 电源，被配置为分别通过所述多个组合的晶闸管向所述多个组合的加热器提供电流; 一对滤波器，设置在电源线处，用于从电源向加热器提供电力，并且被配置为消除施加到电源的高频功率。

6. 发明申请

US20150373783A1 PLACING TABLE AND PLASMA PROCESSING APPARATUS 审中-公开
标题翻译：配置表和等离子体加工设备
公开(公告)号：US20150373783A1
公开(公告)日：2015-12-24
申请号：US14730520
申请日：2015-06-04
申请人： TOKYO ELECTRON LIMITED
发明人： Dai KITAGAWA
IPC分类号： H05B3/26 , H01L21/683 , H01L21/67 , H01J37/32
CPC分类号： H05B3/26 , H01J37/32532 , H01J37/32715 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H01L21/68757 , H05B3/262
摘要： Provided is a placing table configured to place a workpiece thereon. The placing table includes: an electrostatic chuck configured to attract the workpiece; a support member configured to support a focus ring; and a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region. The support member includes: an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive; a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and a heater electrode provided within the thermally sprayed ceramic layer. The heater electrode is formed by the thermal spraying method.
摘要翻译：提供了一种配置成将工件放置在其上的放置台。放置台包括：静电卡盘，其构造成吸引工件; 构造成支撑聚焦环的支撑构件; 以及具有构造成支撑所述静电卡盘的第一区域的金属基座和被构造成支撑所述支撑构件的第二区域，所述第二区域围绕所述第一区域。支撑构件包括：由陶瓷烧结体形成的中间层，并通过粘合剂支撑在第二区域上; 通过热喷涂法形成在中间层上的热喷涂陶瓷层; 以及设置在热喷涂陶瓷层内的加热电极。加热电极通过热喷涂法形成。

7. 发明申请

US20210051772A1 PLACING TABLE AND PLASMA PROCESSING APPARATUS 有权
公开(公告)号：US20210051772A1
公开(公告)日：2021-02-18
申请号：US17085591
申请日：2020-10-30
申请人： TOKYO ELECTRON LIMITED
发明人： Dai KITAGAWA
IPC分类号： H05B3/26 , H01L21/683 , H01L21/67 , H01J37/32 , H01L21/687
摘要： Provided is a placing table configured to place a workpiece thereon. The placing table includes: an electrostatic chuck configured to attract the workpiece; a support member configured to support a focus ring; and a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region. The support member includes: an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive; a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and a heater electrode provided within the thermally sprayed ceramic layer. The heater electrode is formed by the thermal spraying method.

8. 发明申请

US20200266081A1 PLACING TABLE AND PLASMA TREATMENT APPARATUS 审中-公开
公开(公告)号：US20200266081A1
公开(公告)日：2020-08-20
申请号：US16866232
申请日：2020-05-04
申请人： Tokyo Electron Limited
发明人： Dai KITAGAWA , Katsuyuki KOIZUMI , Tsutomu NAGAI , Daisuke HAYASHI , Satoru TERUUCHI
IPC分类号： H01L21/67 , H01J37/32 , H01L21/683
摘要： A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.

9. 发明申请

US20180144945A1 PLACING UNIT AND PLASMA PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180144945A1
公开(公告)日：2018-05-24
申请号：US15813796
申请日：2017-11-15
申请人： TOKYO ELECTRON LIMITED
发明人： Tomoyuki TAKAHASHI , Daisuke HAYASHI , Dai KITAGAWA
IPC分类号： H01L21/3065 , H01J37/32 , H01L21/67 , H01L21/683
CPC分类号： H01L21/3065 , H01J37/32091 , H01J37/32165 , H01J37/32192 , H01J37/32422 , H01J37/3244 , H01J37/32532 , H01J37/32678 , H01J37/32816 , H01J2237/332 , H01J2237/334 , H01L21/67063 , H01L21/67103 , H01L21/67109 , H01L21/6831
摘要： The present disclosure relates to a placing unit including: a base to which a high-frequency power is applied; an electrostatic chuck provided on the base and including a placing region configured to place a workpiece and an outer peripheral region configured to surround the placing region; a heater provided in the placing region; a wiring layer connected to the heater and extending to an inside of the outer peripheral region; a power supply terminal connected to a contact portion of the wiring layer in the outer peripheral region; and a conductive layer formed in the outer peripheral region or in other regions along a thickness direction of the outer peripheral region so as to overlap with the power supply terminal when viewed from thickness direction of the outer peripheral region.

10. 发明申请

US20170140958A1 HEATER POWER FEEDING MECHANISM 审中-公开
公开(公告)号：US20170140958A1
公开(公告)日：2017-05-18
申请号：US15300349
申请日：2015-05-08
申请人： Tokyo Electron Limited
发明人： Dai KITAGAWA , Katsuyuki KOIZUMI
IPC分类号： H01L21/67 , H05B1/02 , H01L21/683
摘要： A heater power feeding mechanism for independently controlling temperatures of zones of a stage on which a substrate is placed. The respective zones of the stage include heaters. The heater power feeding mechanism includes a plurality of heater terminals configured to be connected to the heaters, a plurality of heater wires connected to the heater terminals, and an offset structure that offsets the heater wires from each other. The heater terminals are disposed on the periphery of a holding plate for holding the stage.

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