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1. 发明授权

US10348015B2 Socket connector for an electronic package 有权
公开(公告)号：US10348015B2
公开(公告)日：2019-07-09
申请号：US15941744
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H01R12/82 , H01R13/11 , H01R13/05 , H01R13/24 , H05K1/18 , H01R12/70 , H01L23/40
摘要： A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

2. 发明申请

US20190148860A1 SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190148860A1
公开(公告)日：2019-05-16
申请号：US15941744
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H01R12/82 , H01R12/70 , H01R13/11 , H01R13/05 , H01R13/24 , H05K1/18
CPC分类号： H01R12/79 , G06F1/184 , H01L23/4006 , H01L2023/4031 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01R12/52 , H01R12/585 , H01R12/61 , H01R12/7005 , H01R12/7076 , H01R12/716 , H01R12/82 , H01R12/85 , H01R13/057 , H01R13/11 , H01R13/111 , H01R13/2442 , H01R13/2464 , H01R43/0256 , H05K1/0203 , H05K1/0243 , H05K1/115 , H05K1/181 , H05K3/3436 , H05K7/1084 , H05K2201/044 , H05K2201/066 , H05K2201/10325 , H05K2201/10393 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

3. 发明授权

US10741951B2 Socket connector assembly for an electronic package 有权
公开(公告)号：US10741951B2
公开(公告)日：2020-08-11
申请号：US15941615
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto
IPC分类号： H01R12/00 , H01R12/82 , H05K7/10 , G06F1/18 , H05K3/34 , H01R43/02 , H01R13/11 , H01R12/52 , H01R12/58 , H01R12/61 , H01R12/70 , H01R12/79 , H01R12/85 , H01R13/24 , H05K1/02 , H05K1/11 , H05K1/18 , H01R13/05 , H01R12/71 , H01L23/40
摘要： A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

4. 发明申请

US20200295483A1 ELECTRICAL CONNECTOR SYSTEM 审中-公开
公开(公告)号：US20200295483A1
公开(公告)日：2020-09-17
申请号：US16353056
申请日：2019-03-14
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Brian Patrick Costello , Naoki Hashimoto
IPC分类号： H01R12/71 , H01R13/6588 , H01R13/6595 , H05K1/11 , H01R13/6583
摘要： An electrical connector system includes a circuit card assembly and a pluggable module. The circuit card assembly including a host circuit board, a socket connector mounted to the host circuit board, and a guide rail extending along the host circuit board. The socket connector has a socket substrate having upper contacts having mating interfaces being accessible from above the socket connector and being coplanar. The guide rail has a guide feature and a module actuator. The pluggable module includes a module body operatively engaging the guide rail to guide mating of the module body with the guide rail in a module mating direction. The pluggable module includes an actuation feature engaging the module actuator to force mating of module contacts with the upper contacts in a contact mating direction transverse to the module mating direction.

5. 发明申请

US20190150311A1 SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190150311A1
公开(公告)日：2019-05-16
申请号：US15941769
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Alex An , Takeshi Nakashima , Naoki Hashimoto , Shigeru Aihara
IPC分类号： H05K7/10 , G06F1/18 , H01R13/24 , H05K3/34 , H01R12/52 , H01R43/02 , H01R13/11
摘要： A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

6. 发明申请

US20190148859A1 SOCKET CONNECTOR ASSEMBLY FOR AN ELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20190148859A1
公开(公告)日：2019-05-16
申请号：US15941615
申请日：2018-03-30
申请人： TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Jeffery Walter Mason , Takeshi Nakashima , Naoki Hashimoto
IPC分类号： H01R12/82 , H01R12/70 , H01R12/58 , H01R13/24 , H05K1/11 , H05K1/18 , H05K1/02
摘要： A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

7. 发明授权

US10079443B2 Interposer socket and connector assembly 有权
公开(公告)号：US10079443B2
公开(公告)日：2018-09-18
申请号：US15183973
申请日：2016-06-16
申请人： TYCO ELECTRONICS CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Brian Patrick Costello , Naoki Hashimoto
IPC分类号： H01R13/24 , H01R12/58
CPC分类号： H01R13/2442 , H01R12/585 , H01R2201/20
摘要： Interposer socket includes a base substrate and a plurality of spring contacts coupled to the base substrate. Each of the spring contacts has an inclined section that extends away from a top side of the base substrate at a generally non-orthogonal orientation. The inclined section configured to be deflected toward the top side when an electronic module is mounted onto the interposer socket. The inclined section has a mating surface of the spring contact that is configured to engage the electronic module. The inclined section also includes first and second beam segments and a contact slot therebetween. The first and second beam segments extend in an oblique direction away from the top side. The contact slot has a slot width that is defined between inner edges of the first and second beam segments. The slot width increases as the contact slot extends in the oblique direction.

8. 发明申请

US20230080167A1 Socket 有权
公开(公告)号：US20230080167A1
公开(公告)日：2023-03-16
申请号：US17946080
申请日：2022-09-16
申请人： Tyco Electronics Japan G.K.
发明人： Naoki Hashimoto , Masashi Inoue
IPC分类号： H01R13/64 , H01R13/24 , H01R12/71 , H01R12/70
摘要： A socket includes a housing with a bottom plate portion and a frame body portion standing at edges of the bottom plate portion and extending along the edges. The frame body portion serves as a locator in an in-plane direction of the bottom plate portion in mounting an electronic component. The bottom plate portion and the frame body portion are integrally molded into the housing. The socket includes a plurality of contacts supported by the bottom plate portion. The socket includes a spring member including a supported portion supported by a first side of the frame body portion and a spring portion that elastically deforms by being pushed by the electronic component, pressing the electronic component against a second side opposite to the first side.

9. 发明申请

US20170365947A1 INTERPOSER SOCKET AND CONNECTOR ASSEMBLY 审中-公开
公开(公告)号：US20170365947A1
公开(公告)日：2017-12-21
申请号：US15183973
申请日：2016-06-16
申请人： TYCO ELECTRONICS CORPORATION , TYCO ELECTRONICS JAPAN G.K.
发明人： Brian Patrick Costello , Naoki Hashimoto
IPC分类号： H01R13/24 , H01R12/71 , H01R12/57
CPC分类号： H01R13/2442 , H01R12/585 , H01R2201/20
摘要： Interposer socket includes a base substrate and a plurality of spring contacts coupled to the base substrate. Each of the spring contacts has an inclined section that extends away from a top side of the base substrate at a generally non-orthogonal orientation. The inclined section configured to be deflected toward the top side when an electronic module is mounted onto the interposer socket. The inclined section has a mating surface of the spring contact that is configured to engage the electronic module. The inclined section also includes first and second beam segments and a contact slot therebetween. The first and second beam segments extend in an oblique direction away from the top side. The contact slot has a slot width that is defined between inner edges of the first and second beam segments. The slot width increases as the contact slot extends in the oblique direction.

10. 发明申请

US20150031242A1 Electrical Connector 有权
标题翻译：电气连接器
公开(公告)号：US20150031242A1
公开(公告)日：2015-01-29
申请号：US14512826
申请日：2014-10-13
申请人： Tyco Electronics Japan G.K.
发明人： Izumi Hasegawa , Naoki Hashimoto
IPC分类号： H01R13/6597 , H01R13/646 , H01R12/71
CPC分类号： H01R13/6597 , H01R12/71 , H01R13/646 , H01R13/6471
摘要： An electrical connector is disclosed having a plurality of contacts. The plurality of contacts includes contact ends positioned in two rows and terminating ends positioned in one row. A first grouping of the plurality of contacts includes units of two differential signal carrying contacts having signal carrying contact ends connected to two signal terminating ends on a one to one ratio. The first grouping also includes grounding contacts positioned adjacent to the signal carrying contacts, and having grounding contact ends connected to grounding terminating ends with a ratio of the number of grounding contact ends being greater than or equal to the number of grounding terminating ends.
摘要翻译：公开了具有多个触点的电连接器。多个触点包括位于两排中的接触端和位于一排中的端接端。多个触点的第一组合包括两个差分信号承载触点的单元，所述两个差分信号承载触点具有以一比一的比例连接到两个信号端接端的信号承载接触端。第一分组还包括邻近信号承载触点定位的接地触点，并且具有连接到接地终端的接地端子端，接地端子数量的比例大于或等于接地端接端数。

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