会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • U-shape metal-oxide-semiconductor (UMOS) gate structure for high power MOS-based semiconductor devices
    • 用于大功率MOS半导体器件的U形金属氧化物半导体(UMOS)栅极结构
    • US07476932B2
    • 2009-01-13
    • US11537454
    • 2006-09-29
    • Qingchun ZhangHsueh-Rong Chang
    • Qingchun ZhangHsueh-Rong Chang
    • H01L29/76H01L21/336
    • H01L29/7813H01L29/0619H01L29/0878H01L29/1608H01L29/7828
    • A U-shape Metal-Oxide-Semiconductor (UMOS) device comprises a P-base layer, an N+ source region disposed in the P-base layer where the source region has a first surface coplanar with a first surface of the P-base layer, a dielectric layer extending through the P-base layer and forming a U-shape trench having side walls and floor enclosing a trench interior region, a conducting gate material filling the trench interior region, a first accumulation channel layer disposed along a first side wall of the U-shape trench and in contact with the source region and a first side wall of the U-shape trench, a P-junction gate disposed adjacent to the dielectric layer floor and in proximity to the first accumulation channel layer, and an N-drift region where the P-junction gate is disposed between the dielectric layer and the N-drift region.
    • U形金属氧化物半导体(UMOS)器件包括P基底层,设置在P基底层中的N +源极区域,其中源区域具有与P基底层的第一表面共面的第一表面 ,延伸穿过所述P基层并形成具有侧壁和包围沟槽内部区域的地板的U形沟槽的介电层,填充所述沟槽内部区域的导电栅极材料,沿着第一侧壁设置的第一堆积沟道层 的U形沟槽并与U形沟槽的源极区域和第一侧壁接触; P结栅极,其设置在电介质层底部附近并且靠近第一累积沟道层,N 其中P结栅极设置在介电层和N漂移区之间。
    • 3. 发明授权
    • Iodine getter for a high intensity metal halide discharge lamp
    • 碘吸收剂用于高强度金属卤化物放电灯
    • US5343118A
    • 1994-08-30
    • US092539
    • 1993-07-16
    • Hsueh-Rong Chang
    • Hsueh-Rong Chang
    • H01J61/12H01J61/26H01J61/35H01J65/04H01J17/20H01J61/18
    • H01J61/35H01J61/125H01J61/26H01J65/048
    • A high intensity discharge lamp having a fill including at least one rare earth metal iodide has an additional metal component for avoiding a substantial loss of the metal component of the fill and the attendant substantial buildup of free iodine, thereby increasing the useful life of the lamp. During lamp operation, the additional metal component combines with iodine in the vapor phase, forming a relatively stable iodide and thus reducing the total level of free iodine in the lamp. As a result, arc instability is avoided. The additional metal component also emits visible light and hence improves efficacy. Moreover, the additional metal component does not attack the arc tube wall by reducing silica. Suitable additional metal components include indium and thallium.
    • 具有包括至少一种稀土金属碘化物的填充物的高强度放电灯具有额外的金属成分,用于避免填充物的金属成分的显着损失和随之而来的游离碘积累,从而增加了灯的使用寿命 。 在灯操作期间,附加的金属组分与气相中的碘结合,形成相对稳定的碘化物,从而降低灯中游离碘的总含量。 结果,避免了电弧不稳定性。 另外的金属组分也发出可见光,因此提高了功效。 此外,附加的金属组分不会通过还原二氧化硅来侵蚀电弧管壁。 合适的附加金属组分包括铟和铊。
    • 8. 发明授权
    • High power rectifier
    • 大功率整流器
    • US06252258B1
    • 2001-06-26
    • US09371740
    • 1999-08-10
    • Hsueh-Rong ChangRajesh Gupta
    • Hsueh-Rong ChangRajesh Gupta
    • H01L31111
    • H01L29/0623H01L29/0692H01L29/872H01L29/8725
    • A high power rectifier device has an − drift layer on an N+ layer. A number of trench structures are recessed into the drift layer opposite the N+ layer; respective mesa regions separate each pair of trenches. Each trench structure includes oxide side-walls and an oxide bottom, and is filled with a conductive material. A metal layer contacts the trench structures and mesa regions, forming Schottky contacts at the metal-mesa interface. Shallow P regions extend from the bottom of each trench into the drift layer. Forward conduction occurs when the Schottky contact's barrier height is overcome. When reversed-biased, depletion regions form around the shallow P regions and the oxide side-walls which provide potential barriers across the mesa regions that shield the Schottky contacts from high electric fields, providing a high reverse blocking voltage and reducing reverse leakage current. The device's unipolar structure provides low switching losses, enabling high switching speeds while reducing the power that must be dissipated when transitioning from forward conduction to reverse blocking mode.
    • 大功率整流器件在N +层上具有漂移层。 多个沟槽结构凹陷到与N +层相反的漂移层中; 相应的台面区域分隔每对沟槽。 每个沟槽结构包括氧化物侧壁和氧化物底部,并且填充有导电材料。 金属层接触沟槽结构和台面区域,在金属 - 台面界面处形成肖特基接触。 浅P区域从每个沟槽的底部延伸到漂移层。 当肖特基接触的屏障高度被克服时,会发生正向传导。 当反向偏置时,在浅的P区和氧化物侧壁周围形成耗尽区,这些侧壁在屏蔽肖特基接触的高电场的台面区域之间提供势垒,提供高的反向阻断电压并减少反向漏电流。 器件的单极结构提供低开关损耗,实现高开关速度,同时降低从正向导通转换为反向阻塞模式时必须消耗的功率。