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1. 发明授权

US5209688A Plasma display panel 失效
标题翻译：等离子显示面板
公开(公告)号：US5209688A
公开(公告)日：1993-05-11
申请号：US672765
申请日：1991-03-20
申请人： Susumu Nishigaki , Syozo Ohtomo , Rikiya Kamimura , Kazunari Tanaka
发明人： Susumu Nishigaki , Syozo Ohtomo , Rikiya Kamimura , Kazunari Tanaka
IPC分类号： H01J17/49
CPC分类号： H01J17/492
摘要： A plasma display panel is disclosed, which comprises a pair of insulating substrates with a predetermined space therebetween; a group of anode electrodes and a group of cathode electrodes formed on the inner side of each of the insulating substrates in such a manner that the groups of the electrodes are normal to each other; and barriers formed on the insulating substrate having the anode electrodes thereon by photolithography. Since the barriers are formed by photolithography using an ultraviolet-curable resin or positive-type resist, high precison patterns having a line width of 100 .mu.m or less and a line spacing of 100 .mu.m or less can be easily obtained and, thereby, a high resolution plasma display having a decreased picture element area and a wider discharge space can be obtained. When photolithography is used in the formation of the cathode electrodes, further high precision fine patterns can be obtained and further finely detailed pitch of picture elements can be achieved.
摘要翻译：公开了一种等离子体显示面板，其包括一对具有预定间隔的绝缘基板; 一组阳极电极和一组阴极电极，其形成在每个绝缘基板的内侧，使得电极组彼此正交; 以及通过光刻法在其上具有阳极电极的绝缘基板上形成的屏障。由于通过使用紫外线固化型树脂或正型抗蚀剂的光刻法形成了阻挡层，所以容易得到线宽为100μm以下，线间隔为100μm以下的高精细图案，可以获得具有减小的像素面积和更宽放电空间的高分辨率等离子体显示器。当在形成阴极电极中使用光刻时，可以获得更高精度的精细图案，并且可以实现更精细的图像元素间距。

2. 发明申请

US20110042812A1 Electronic device and method of manufacturing the same 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：US20110042812A1
公开(公告)日：2011-02-24
申请号：US12805396
申请日：2010-07-29
申请人： Kimiharu Kayukawa , Rikiya Kamimura , Masaya Mizutani
发明人： Kimiharu Kayukawa , Rikiya Kamimura , Masaya Mizutani
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L25/16 , H01L21/56 , H01L23/3107 , H01L23/49513 , H01L23/4952 , H01L23/49537 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/64 , H01L24/66 , H01L24/69 , H01L24/73 , H01L25/072 , H01L2224/04026 , H01L2224/05624 , H01L2224/32225 , H01L2224/45014 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2924/206
摘要： An electronic device includes a power element on a first substrate and an electronic component on a second substrate. The first and second substrates are stacked so that the power element and the electronic component can be located between the first and second substrates. A first end of a first wire is connected to the power element. A second end of the first wire is connected to the first substrate. A middle portion of the first wire projects toward the second substrate. A first end of a second wire is connected to the power element. A second end of the wire extends above a top of the middle portion of the first conductive member and is connected to the second substrate.
摘要翻译：电子设备包括第一基板上的功率元件和第二基板上的电子元件。堆叠第一和第二基板，使得功率元件和电子部件可以位于第一和第二基板之间。第一线的第一端连接到功率元件。第一线的第二端连接到第一衬底。第一线的中间部分向第二衬底突出。第二导线的第一端连接到功率元件。线的第二端在第一导电构件的中间部分的顶部的上方延伸并连接到第二衬底。

3. 发明授权

US07417318B2 Thick film circuit board, method of producing the same and integrated circuit device 有权
标题翻译：厚膜电路板，其制造方法和集成电路器件
公开(公告)号：US07417318B2
公开(公告)日：2008-08-26
申请号：US10831229
申请日：2004-04-26
申请人： Tohru Nomura , Yoshihiro Shimoide , Yoshihiko Shiraishi , Rikiya Kamimura , Hiroshi Kasugai
发明人： Tohru Nomura , Yoshihiro Shimoide , Yoshihiko Shiraishi , Rikiya Kamimura , Hiroshi Kasugai
IPC分类号： H01L23/48
CPC分类号： H05K3/4061 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H05K1/092 , H05K3/248 , H05K2201/035 , H05K2201/09981 , H05K2203/1572 , H01L2924/00
摘要： A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.
摘要翻译：可以低成本制造的厚膜电路板，其制造方法和集成电路器件。第一厚膜电路板具有在不高于750℃下烧制的含铜导体的导电层，并且包括通过使用含银导体形成的导电部分。第二厚膜电路板具有形成在通孔中的导体，以便至少封闭其一侧的开口。以低成本生产厚膜电路板，并且在使用时抑制电导率的降低。

4. 发明授权

US06360600B1 Angular velocity sensor, related method for manufacturing the sensor, and piezoelectric vibrator element used in this sensor 有权
标题翻译：角速度传感器，制造传感器的相关方法以及该传感器中使用的压电振子
公开(公告)号：US06360600B1
公开(公告)日：2002-03-26
申请号：US09392635
申请日：1999-09-09
申请人： Hisao Kuroki , Rikiya Kamimura
发明人： Hisao Kuroki , Rikiya Kamimura
IPC分类号： G01P900
CPC分类号： G01C19/5607 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/78313 , H01L2224/78318 , H01L2224/78901 , H01L2224/85181 , H01L2224/85205 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Drive electrodes and sensing electrodes are formed on a front face of a piezoelectric body of a vibrator. A first reference electrode is formed on a rear face. Second reference electrodes are formed on side faces of arm bars of the vibrator at a position corresponding to the sensing electrodes. The second reference electrodes are connected to the first reference electrode formed on said rear face.
摘要翻译：驱动电极和感测电极形成在振动器的压电体的前表面上。第一参考电极形成在后表面上。第二参考电极形成在对应于感测电极的位置处的振动器的臂杆的侧面上。第二参考电极连接到形成在所述后表面上的第一参考电极。

5. 发明授权

US07107661B2 Method of recycling printed circuit board 有权
标题翻译：印刷电路板回收方法
公开(公告)号：US07107661B2
公开(公告)日：2006-09-19
申请号：US10381054
申请日：2002-12-16
申请人： Rikiya Kamimura , Katsumi Nakamura , Kouji Kond , Atsusi Sakaida , Toshihisa Taniguchi
发明人： Rikiya Kamimura , Katsumi Nakamura , Kouji Kond , Atsusi Sakaida , Toshihisa Taniguchi
IPC分类号： B23P19/04 , B02C17/00
CPC分类号： H05K3/22 , B09B5/00 , B29B17/02 , B29B2017/0255 , B29B2017/0456 , B29B2017/0464 , B29L2031/3425 , C22B7/001 , C22B7/005 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2203/178 , Y02P10/214 , Y02P70/613 , Y02W30/622 , Y02W30/625 , Y10T29/49751 , Y10T29/49755 , Y10T29/49757 , Y10T29/53 , Y10T29/53274
摘要： The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.
摘要翻译：本发明提供一种回收用于分离和回收包括印刷金属材料的金属材料的印刷电路板和构成印刷电路板的绝缘材料的方法和装置。分离和回收的金属材料和绝缘材料都可以进行再循环。在回收印刷电路板的方法中，热过滤处理P 400中使用热过滤设备4a和树脂金属分离设备51。对废弃印刷电路板1进行加热和强制过滤，使得只有绝缘材料1a通过过滤器。然后，分离和取出绝缘材料1a和金属材料1b。优选作为废印刷电路板的印刷电路板100的绝缘体基体23由热塑性树脂或热塑性树脂和无机负载材料的混合物制成。结果，当回收的金属材料和回收的绝缘材料分别成为回收的必需品时，金属材料和绝缘材料都可以进行再循环。

6. 发明申请

US20050246879A1 Method and apparatus of recycling printed circuit board 有权
标题翻译：回收印刷电路板的方法和设备
公开(公告)号：US20050246879A1
公开(公告)日：2005-11-10
申请号：US11185760
申请日：2005-07-21
申请人： Rikiya Kamimura , Katsumi Nakamura , Kouji Kondo , Atsusi Sakaida , Toshihisa Taniguchi
发明人： Rikiya Kamimura , Katsumi Nakamura , Kouji Kondo , Atsusi Sakaida , Toshihisa Taniguchi
IPC分类号： B09B5/00 , B29B17/02 , C22B7/00 , H05K3/22 , H05K3/40 , H05K3/46 , H02G1/12
CPC分类号： H05K3/22 , B09B5/00 , B29B17/02 , B29B2017/0255 , B29B2017/0456 , B29B2017/0464 , B29L2031/3425 , C22B7/001 , C22B7/005 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2203/178 , Y02P10/214 , Y02P70/613 , Y02W30/622 , Y02W30/625 , Y10T29/49751 , Y10T29/49755 , Y10T29/49757 , Y10T29/53 , Y10T29/53274
摘要： The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.
摘要翻译：本发明提供一种回收用于分离和回收包括印刷金属材料的金属材料的印刷电路板和构成印刷电路板的绝缘材料的方法和装置。分离和回收的金属材料和绝缘材料都可以进行再循环。在回收印刷电路板的方法中，热过滤处理P 400中使用热过滤设备4a和树脂金属分离设备51。对废弃印刷电路板1进行加热和强制过滤，使得只有绝缘材料1a通过过滤器。然后，分离和取出绝缘材料1a和金属材料1b。优选作为废印刷电路板的印刷电路板100的绝缘体基体23由热塑性树脂或热塑性树脂和无机负载材料的混合物制成。结果，当回收的金属材料和回收的绝缘材料分别成为回收的必需品时，金属材料和绝缘材料都可以进行再循环。

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