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    • 3. 发明授权
    • Solder medium for circuit interconnection
    • 焊接介质用于电路互连
    • US5509815A
    • 1996-04-23
    • US255687
    • 1994-06-08
    • Sungho JinMark T. McCormack
    • Sungho JinMark T. McCormack
    • B23K35/02B23K35/14H05K3/34H05K3/36H01R9/09
    • B23K35/0222H05K3/3436B23K35/0227B23K35/0244H01L2924/0002H05K2201/0215H05K2201/083H05K2201/09945H05K2201/10378H05K2201/10424H05K2203/0235H05K2203/0769H05K2203/104Y02P70/613
    • Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
    • 具有至少两个部件的电子设备配线接触焊盘在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成,使得至少两个焊丝与配合焊盘接触,并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成,该焊丝具有与直径的长宽比的高纵横比。 或者,复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。
    • 7. 发明授权
    • Voltage proportional replication device using magnetoresistive sensing
elements
    • 使用磁阻感测元件的电压比例复制器件
    • US5512818A
    • 1996-04-30
    • US220768
    • 1994-03-31
    • Sungho JinAshraf W. LotfiMark T. McCormack
    • Sungho JinAshraf W. LotfiMark T. McCormack
    • G01R33/09G01R15/20G01R17/16G01R19/00G05F1/10H01F10/18G01V3/06
    • G01R15/205
    • In accordance with the present invention, a voltage proportional replication device comprises an input electromagnet responsive to an input voltage for producing a magnetic field in proportion to the input voltage; and a first magnetoresistive sensing element disposed within the field of the input electromagnet. The device further includes an adjustable source of output voltage; an output electromagnet responsive to the output voltage for producing a magnetic field in proportion to the output voltage; and a second magnetoresistive sensing element disposed within the field of the output electromagnet. A control circuit for controlling the adjustable output voltage maintains a constant ratio between the resistances of the first and second magnetoresistive elements, thereby maintaining a constant ratio between the input voltage and the output voltage.
    • 根据本发明,电压比例复制装置包括响应于输入电压的输入电磁体,用于产生与输入电压成比例的磁场; 以及设置在输入电磁体的场内的第一磁阻感测元件。 该装置还包括可调节的输出电压源; 响应于输出电压的输出电磁体,用于产生与输出电压成比例的磁场; 以及设置在输出电磁体的场内的第二磁阻感测元件。 用于控制可调输出电压的控制电路在第一和第二磁阻元件的电阻之间保持恒定的比例,从而保持输入电压和输出电压之间的恒定比率。
    • 10. 发明授权
    • Solder medium for circuit interconnection
    • 焊接介质用于电路互连
    • US5618189A
    • 1997-04-08
    • US588193
    • 1996-01-18
    • Sungho JinMark T. McCormack
    • Sungho JinMark T. McCormack
    • B23K35/02B23K35/14H05K3/34H05K3/36H01R9/09
    • B23K35/0222H05K3/3436B23K35/0227B23K35/0244H01L2924/0002H05K2201/0215H05K2201/083H05K2201/09945H05K2201/10378H05K2201/10424H05K2203/0235H05K2203/0769H05K2203/104Y02P70/613
    • Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
    • 具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成,使得至少两个焊丝与配合焊盘接触,并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成,该焊丝具有与其直径的长宽比的高纵横比。 或者,复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。