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1. 发明授权

US06492284B2 Reactor for processing a workpiece using sonic energy 有权
公开(公告)号：US06492284B2
公开(公告)日：2002-12-10
申请号：US09907552
申请日：2001-07-16
申请人： Steven L. Peace , Paul Z. Wirth , Eric Lund
发明人： Steven L. Peace , Paul Z. Wirth , Eric Lund
IPC分类号： H01L2348
CPC分类号： B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715 , Y10S438/913
摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

2. 发明授权

US06930046B2 Single workpiece processing system 失效
标题翻译：单工件加工系统
公开(公告)号：US06930046B2
公开(公告)日：2005-08-16
申请号：US10690864
申请日：2003-10-21
申请人： Kyle M. Hanson , Eric Lund , Coby Grove , Steven L. Peace , Paul Z. Wirth , Scott A. Bruner , Jonathan Kuntz
发明人： Kyle M. Hanson , Eric Lund , Coby Grove , Steven L. Peace , Paul Z. Wirth , Scott A. Bruner , Jonathan Kuntz
IPC分类号： H01L21/00 , H01L21/3213 , H01L21/311
CPC分类号： H01L21/6715 , H01L21/32134 , H01L21/67017 , Y10S438/906 , Y10S438/907 , Y10S438/913
摘要： A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.
摘要翻译：用于处理工件的系统和方法包括工件处理器。机器人可以在机箱内移动，以将工件加载和卸载进出处理器。处理器包括具有中心气流开口的上转子。上转子被磁力驱动与下转子接合以形成工件处理室。可移动排水机构使不同的排放路径与处理室对准，使得不同的处理流体可以经由不同的排出路径从处理室移除。位于空气流通口中的可移动喷嘴将处理流体分配到工件。处理液通过旋转处理室产生的离心力分布在工件表面上，并通过可移动的排水机构从处理室中移出。

3. 发明授权

US06806194B2 Apparatus and methods for processing a workpiece 失效
标题翻译：用于加工工件的设备和方法
公开(公告)号：US06806194B2
公开(公告)日：2004-10-19
申请号：US10412944
申请日：2003-04-14
申请人： Paul Z. Wirth , Steven L. Peace , Erik Lund
发明人： Paul Z. Wirth , Steven L. Peace , Erik Lund
IPC分类号： H01L21311
CPC分类号： B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715 , Y10S134/902 , Y10S438/906 , Y10S438/913
摘要： A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.
摘要翻译：用于处理工件的系统包括附接到头部升降器的头部。工件在上转子和下转子之间的头部中被支撑。底座有一个容纳液体的碗。头部可由头部升降器从垂直于碗的第一位置移动到第二位置，在该位置，工件至少部分地定位在碗中。碗具有轮廓部分，其侧壁具有与碗中的排水出口相邻增加的曲率半径，以帮助液体从碗中快速排出。头部具有负载位置，其中转子间隔开第一量，以及处理位置，其中转子彼此接合并密封。为了快速排出流体，头部还具有快速的排放位置，其中转子被足够地移动以产生环形的排水间隙。流体通过旋转转子而迅速抽空，头部转子稍微分开并开封，导致流体在离心力下快速流动。

4. 发明授权

US06969682B2 Single workpiece processing system 失效
标题翻译：单工件加工系统
公开(公告)号：US06969682B2
公开(公告)日：2005-11-29
申请号：US10693668
申请日：2003-10-24
申请人： Kyle M. Hanson , Paul Z. Wirth , Steven L. Peace , Jon Kuntz , Scott A. Bruner
发明人： Kyle M. Hanson , Paul Z. Wirth , Steven L. Peace , Jon Kuntz , Scott A. Bruner
IPC分类号： H01L21/00 , H01L21/3213 , H01L21/311
CPC分类号： H01L21/6715 , H01L21/32134 , H01L21/67017 , Y10S438/906 , Y10S438/913
摘要： A system for processing wafers includes a robot moveable within an enclosure to load and unload workpieces into and out of workpiece processors. A processor includes an upper rotor having alignment pins, and a lower rotor having one or more openings for receiving the alignment pins to form a processing chamber around the workpiece. The alignment pins center the workpiece relative to a rotor spin axis and to an etch or drain groove in the upper rotor. A first fluid outlet delivers processing fluid to a central region of the workpiece. The processing fluid is distributed across the workpiece surface via centrifugal force generated by spinning the processing chamber. Purge gas is optionally delivered into the processing chamber through an annular opening around the first fluid outlet to help remove processing fluid from the processing chamber.
摘要翻译：用于处理晶片的系统包括可在外壳内移动以将工件加载和卸载到工件处理器中的机器人。处理器包括具有对准销的上转子和具有一个或多个开口的下转子，用于接收对准销以在工件周围形成处理室。对准销使工件相对于转子旋转轴线和上转子中的蚀刻或排水槽居中。第一流体出口将处理流体输送到工件的中心区域。处理液通过旋转处理室产生的离心力分布在工件表面上。吹扫气体可选地通过围绕第一流体出口的环形开口输送到处理室中，以帮助从处理室去除处理流体。

5. 发明授权

US06680253B2 Apparatus for processing a workpiece 有权
标题翻译：用于加工工件的设备
公开(公告)号：US06680253B2
公开(公告)日：2004-01-20
申请号：US09907522
申请日：2001-07-16
申请人： Paul Z. Wirth , Steven L. Peace
发明人： Paul Z. Wirth , Steven L. Peace
IPC分类号： H01L21311
CPC分类号： B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.
摘要翻译：用于处理工件的系统包括具有用于保持液体的碗或凹部的底座。工艺反应器或头部将工件保持在上转子和下转子之间。头部升降器降低了将工件保持与液体接触的头部。在与液体接触期间或之后，头部旋转工件。上下转子具有用于将工件装载和卸载到头部中的侧开口。转子可轴向移动以对准侧开口。

6. 发明授权

US06548411B2 Apparatus and methods for processing a workpiece 有权
公开(公告)号：US06548411B2
公开(公告)日：2003-04-15
申请号：US09907484
申请日：2001-07-16
申请人： Paul Z. Wirth , Steven L. Peace , Erik Lund
发明人： Paul Z. Wirth , Steven L. Peace , Erik Lund
IPC分类号： H01L21311
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , Y10S134/902 , Y10S438/906 , Y10S438/913
摘要： A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.

7. 发明授权

US06511914B2 Reactor for processing a workpiece using sonic energy 有权
公开(公告)号：US06511914B2
公开(公告)日：2003-01-28
申请号：US09907524
申请日：2001-07-16
申请人： Paul Z. Wirth , Steven L. Peace
发明人： Paul Z. Wirth , Steven L. Peace
IPC分类号： H01L21311
CPC分类号： B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715 , Y10S438/913
摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.

8. 发明申请

US20090024244A1 HIGH THROUGHPUT SEMICONDUCTOR WAFER PROCESSING 有权
标题翻译：高通量半导体波长处理
公开(公告)号：US20090024244A1
公开(公告)日：2009-01-22
申请号：US11778576
申请日：2007-07-16
申请人： Randy A. Harris , Steve L. Eudy , Paul Z. Wirth
发明人： Randy A. Harris , Steve L. Eudy , Paul Z. Wirth
IPC分类号： H01L21/677 , G06F19/00
CPC分类号： H01L21/67778 , H01L21/67772 , H01L21/67775 , H01L21/67781 , Y10S414/14
摘要： A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.
摘要翻译：晶片处理系统具有容纳足够的晶片载体的晶片加载系统，以使处理系统的处理速度能力基本上最大化。晶片载体通过一个或两个架空载体加载轨道放置到装载系统中并从装载系统中移除。承运人可以在其他承运人上班时加载或移走。一个或多个传送机器人可以将晶片从载体移动到缓冲器。过程模块中的一个或多个过程机器人将晶片从缓冲器或其他位置移动到过程模块中的处理器。

9. 发明授权

US07337663B2 Sonic energy process chamber 失效
标题翻译：声能处理室
公开(公告)号：US07337663B2
公开(公告)日：2008-03-04
申请号：US11078997
申请日：2005-03-11
申请人： Paul Z. Wirth , Dana R. Scranton , Brian Aegerter
发明人： Paul Z. Wirth , Dana R. Scranton , Brian Aegerter
IPC分类号： B08B3/12
CPC分类号： H01L21/6719 , H01L21/67028 , H01L21/67086 , Y10S134/902
摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process head lifter lowers the head holding the workpiece into the processing fluid in the bowl. Sonic energy is provided to the workpiece through the processing fluid, optionally while the processing head spins the workpiece. The processing fluid may include de-ionized water and an etchant.
摘要翻译：用于处理工件的系统包括具有用于保持处理流体的碗或凹部的底座。声能量源，例如兆声换能器，为碗中的处理流体提供声能。工艺头保持工件。工艺头升降器将保持工件的头部降低到碗中的处理流体中。通过处理流体，任选地在处理头旋转工件时，将能量提供给工件。处理流体可以包括去离子水和蚀刻剂。

10. 发明申请

US20090022574A1 WORKPIECE LOADING SYSTEM 审中-公开
标题翻译：工作装载系统
公开(公告)号：US20090022574A1
公开(公告)日：2009-01-22
申请号：US11778588
申请日：2007-07-16
申请人： Steve L. Eudy , Randy A. Harris , Paul Z. Wirth
发明人： Steve L. Eudy , Randy A. Harris , Paul Z. Wirth
IPC分类号： H01L21/677 , B66F11/00 , G06F19/00
CPC分类号： H01L21/67775 , H01L21/67769
摘要： A wafer loading system accommodates sufficient wafer carriers to substantially maximize the processing speed capability of wafer processing systems. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading elements, such as overhead track systems. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. Methods of operating the loading system allow delivery and removal of wafers to and from the processing systems to meet or exceed the processing speeds of the processing systems.
摘要翻译：晶片加载系统容纳足够的晶片载体，以大大最大化晶片处理系统的处理速度能力。通过一个或两个架空载体加载元件（例如架空轨道系统）将晶片载体放置到装载系统中并从装载系统中移除。承运人可以在其他承运人上班时加载或移走。一个或多个传送机器人可以将晶片从载体移动到缓冲器。操作装载系统的方法允许将晶片送往和从处理系统移除以满足或超过处理系统的处理速度。

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