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1. 发明授权

US07704462B2 Method and apparatus for producing aligned carbon nanotube thermal interface structure 有权
标题翻译：生产校准碳纳米管热界面结构的方法和装置
公开(公告)号：US07704462B2
公开(公告)日：2010-04-27
申请号：US11104354
申请日：2005-04-12
申请人： Stephen W. Montgomery , Tomm V. Aldridge
发明人： Stephen W. Montgomery , Tomm V. Aldridge
IPC分类号： B01J19/08
CPC分类号： H01L51/0048 , B82Y10/00 , Y10S977/842
摘要： The invention relates to a method and apparatus for producing aligned carbon nanotube thermal interface structures using batch and continuous manufacturing processes. In a batch process a capacitor is immersed in a bath containing a slurry of thermoplastic polymer containing randomly oriented carbon nanotubes and energized to create an electrical field to orient the carbon nanotubes prior to curing. In a continuous process, slurry carried by a conveyor receives the nanotube aligning electric field from capacitors positioned on both sides of the conveyor bearing the slurry.
摘要翻译：本发明涉及使用分批和连续制造方法生产对准的碳纳米管热界面结构的方法和装置。在分批处理中，将电容器浸入含有含有随机取向的碳纳米管的热塑性聚合物浆料的浴中，并通电以形成电场，以在固化之前使碳纳米管定向。在连续过程中，由输送机承载的浆料接收位于输送机两侧的电容器的纳米管对准电场，该电机承载着浆料。

2. 发明授权

US06921462B2 Method and apparatus for producing aligned carbon nanotube thermal interface structure 有权
标题翻译：生产校准碳纳米管热界面结构的方法和装置
公开(公告)号：US06921462B2
公开(公告)日：2005-07-26
申请号：US10024057
申请日：2001-12-17
申请人： Stephen W. Montgomery , Tomm V. Aldridge
发明人： Stephen W. Montgomery , Tomm V. Aldridge
IPC分类号： H01L51/30 , B01J19/08
CPC分类号： H01L51/0048 , B82Y10/00 , Y10S977/842
摘要： The invention relates to a method and apparatus for producing aligned carbon nanotube thermal interface structures using batch and continuous manufacturing processes. In a batch process a capacitor is immersed in a bath containing a slurry of thermoplastic polymer containing randomly oriented carbon nanotubes and energized to create an electrical field to orient the carbon nanotubes prior to curing. In a continuous process, slurry carried by a conveyor receives the nanotube aligning electric field from capacitors positioned on both sides of the conveyor bearing the slurry.
摘要翻译：本发明涉及使用分批和连续制造方法生产对准的碳纳米管热界面结构的方法和装置。在分批处理中，将电容器浸入含有含有随机取向的碳纳米管的热塑性聚合物浆料的浴中，并通电以形成电场，以在固化之前使碳纳米管定向。在连续过程中，由输送机承载的浆料接收位于输送机两侧的电容器的纳米管对准电场，该电机承载着浆料。

3. 发明授权

US07770630B2 Modular capillary pumped loop cooling system 有权
标题翻译：模块化毛细管泵回路冷却系统
公开(公告)号：US07770630B2
公开(公告)日：2010-08-10
申请号：US10648170
申请日：2003-08-26
申请人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
发明人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
IPC分类号： F25B29/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/046 , G06F1/20 , H01L2924/0002 , H01L2924/3011 , H05K7/20009 , H05K7/20809 , H01L2924/00
摘要： A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.
摘要翻译：模块化毛细管泵回路（CPL）冷却系统及相关部件。模块化CPL冷却系统将热量从诸如设置在计算机机架内的微处理器的大功率电路组件传送到机箱内部或外部的其他位置，其中可以更容易地去除热量。在各种实施例中，CPL冷却系统包括通过柔性液体输送和蒸汽输送管线连接到一个或多个冷凝器的一个或多个蒸发器。在每个冷凝器内设置诸如体积的烧结铜的芯吸结构。芯吸结构基于毛细管机构和芯吸结构的上表面上的弯液面/蒸气界面之间的压力差将液态的工作流体（例如水）吸入蒸发器。当液体弯液面蒸发时，另外的流体被吸入蒸发器。然后将工作流体冷凝回冷凝器中的液体。

4. 发明授权

US07269008B2 Cooling apparatus and method 有权
公开(公告)号：US07269008B2
公开(公告)日：2007-09-11
申请号：US11171682
申请日：2005-06-29
申请人： Rajiv K. Mongia , Stephen W. Montgomery , Willem M. Beltman , Mark A. Trautman , Nels E. Jewell-Larsen
发明人： Rajiv K. Mongia , Stephen W. Montgomery , Willem M. Beltman , Mark A. Trautman , Nels E. Jewell-Larsen
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.

5. 发明授权

US07269481B2 Method and apparatus for memory bandwidth thermal budgetting 有权
标题翻译：存储器带宽热预算的方法和装置
公开(公告)号：US07269481B2
公开(公告)日：2007-09-11
申请号：US10606514
申请日：2003-06-25
申请人： David S. De Lorenzo , Stephen W. Montgomery , Warren R. Morrow , Robin Steinbrecher
发明人： David S. De Lorenzo , Stephen W. Montgomery , Warren R. Morrow , Robin Steinbrecher
IPC分类号： G05D23/00 , G05B11/01 , G05B13/02 , G06F12/00 , G06F15/00
CPC分类号： G06F13/1668 , G11C7/04 , G11C7/22 , G11C2029/5002
摘要： An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.
摘要翻译：电子系统包括装置和装置的控制器。控制器适于计算设备的温度估计并且根据所计算的温度估计来控制对设备的访问。

6. 发明授权

US06700785B2 Computer system which locks a server unit subassembly in a selected position in a support frame 有权
标题翻译：将服务器单元子组件锁定在支撑框架中的选定位置的计算机系统
公开(公告)号：US06700785B2
公开(公告)日：2004-03-02
申请号：US10039109
申请日：2002-01-04
申请人： William E. Berry , David S. De Lorenzo , Stephen W. Montgomery , Barrett M. Faneuf
发明人： William E. Berry , David S. De Lorenzo , Stephen W. Montgomery , Barrett M. Faneuf
IPC分类号： G06F116
CPC分类号： H05K7/20809 , G06F1/183 , G06F1/20 , G06F2200/201 , H05K7/1454
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

7. 发明授权

US06693797B2 Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another 失效
标题翻译：计算机系统具有机架级热接口部件和可与其彼此热接合和分离的框架级热接口部件
公开(公告)号：US06693797B2
公开(公告)日：2004-02-17
申请号：US10039148
申请日：2002-01-04
申请人： Barrett M. Faneuf , David S. De Lorenzo , Stephen W. Montgomery
发明人： Barrett M. Faneuf , David S. De Lorenzo , Stephen W. Montgomery
IPC分类号： H05K720
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

8. 发明授权

US06981543B2 Modular capillary pumped loop cooling system 有权
公开(公告)号：US06981543B2
公开(公告)日：2006-01-03
申请号：US09957792
申请日：2001-09-20
申请人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
发明人： Jason B. Chesser , Barrett M. Faneuf , Stephen W. Montgomery
IPC分类号： F28D15/00 , F28F7/00 , H01K7/20 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/046 , G06F1/20 , H01L2924/0002 , H01L2924/3011 , H05K7/20009 , H05K7/20809 , H01L2924/00
摘要： A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

9. 发明授权

US06965513B2 Carbon nanotube thermal interface structures 有权
标题翻译：碳纳米管热界面结构
公开(公告)号：US06965513B2
公开(公告)日：2005-11-15
申请号：US10027442
申请日：2001-12-20
申请人： Stephen W. Montgomery , Ven R. Holalkere
发明人： Stephen W. Montgomery , Ven R. Holalkere
IPC分类号： G06F1/20 , F28F13/00 , F28F21/02 , H01L23/373 , H01L23/433 , H05K7/20
CPC分类号： H01L23/373 , B82Y10/00 , F28F13/00 , F28F21/02 , F28F2013/006 , H01L23/3737 , H01L23/433 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/10253 , H01L2924/3011 , Y10S977/833 , H01L2924/00 , H01L2924/0665
摘要： The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed between the electronic device and a heat sink or other cooling solution.
摘要翻译：本发明涉及形成使用碳纳米管以降低电子器件与冷却溶液之间热阻的热界面的方法。排列的纳米管束接收注入的聚合物材料以产生聚合物/碳复合材料，然后将其放置在电子装置和散热片或其它冷却溶液之间。

10. 发明授权

US06891724B2 Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD 失效
标题翻译：使用碳纳米管和CVD增加热界面的导热性
公开(公告)号：US06891724B2
公开(公告)日：2005-05-10
申请号：US10170313
申请日：2002-06-12
申请人： David S. De Lorenzo , Stephen W. Montgomery , Robert J. Fite
发明人： David S. De Lorenzo , Stephen W. Montgomery , Robert J. Fite
IPC分类号： H01L23/373 , H05K7/20
CPC分类号： H01L23/3732 , B82Y10/00 , H01L23/373 , H01L2924/0002 , Y10S977/833 , Y10T428/24975 , Y10T428/30 , H01L2924/00
摘要： The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.
摘要翻译：本发明涉及一种形成集成电路封装的结构和工艺，该集成电路封装利用具有固定在该层的表面上的碳纳米管排列阵列的热界面材料层。热界面材料是通过化学气相沉积金刚石沉积的。碳纳米管通过CVDD表面上的等离子体放电处理而形成，也可以在模具的表面上形成。

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