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    • 3. 发明申请
    • PLANARIZED SACRIFICIAL LAYER FOR MEMS FABRICATION
    • 用于MEMS制造的平面非常薄层
    • US20130020279A1
    • 2013-01-24
    • US13598962
    • 2012-08-30
    • Seungbae LeeSheng-Shian LiKushal Bhattacharjee
    • Seungbae LeeSheng-Shian LiKushal Bhattacharjee
    • B05D5/12H01L41/22B05D3/10
    • B81C1/00476Y10T29/42
    • A method of forming a device is provided. The method includes providing a substrate, forming a sacrificial layer over the substrate, and forming a field layer around the sacrificial layer. After formation, both the sacrificial layer and the field layer are planarized. A component is then formed over the planarized sacrificial layer and the planarized field layer. The component has a first electrode and a second electrode and a single crystal wafer disposed between the first and second electrodes. The component includes anchors disposed substantially over the field layer. Once the component is formed, the sacrificial layer is released with an etchant having a selectivity for the sacrificial layer wherein a cavity is formed beneath the component. The cavity allows free movement within the cavity during operation of the device. The etchant does not release the field layer and the component so the field layer remains below the anchors.
    • 提供了一种形成装置的方法。 该方法包括提供衬底,在衬底上形成牺牲层,以及在牺牲层周围形成场层。 在形成之后,牺牲层和场层都被平坦化。 然后在平坦化的牺牲层和平坦化的场层上形成一个分量。 该部件具有设置在第一和第二电极之间的第一电极和第二电极以及单晶晶片。 该部件包括基本上设置在场层上的锚。 一旦形成了部件,牺牲层就可以用对牺牲层具有选择性的蚀刻剂来释放,其中在部件之下形成空腔。 空腔允许在设备操作期间在空腔内自由移动。 蚀刻剂不释放场层和组分,因此场层保持在锚点下方。
    • 4. 发明授权
    • Planarized sacrificial layer for MEMS fabrication
    • MEMS制造的平面牺牲层
    • US08278802B1
    • 2012-10-02
    • US12429455
    • 2009-04-24
    • Seungbae LeeSheng-Shian LiKushal Bhattacharjee
    • Seungbae LeeSheng-Shian LiKushal Bhattacharjee
    • H01L21/00
    • B81C1/00476Y10T29/42
    • A method of forming a device is provided. The method includes providing a substrate, forming a sacrificial layer over the substrate, and forming an field layer around the sacrificial layer. After formation, both the sacrificial layer and the field layer are planarized. A component is then formed over the planarized sacrificial layer and the planarized field layer. The component has a first electrode and a second electrode and a single crystal wafer disposed between the first electrode and the second electrode. The component also includes anchors disposed substantially over the field layer. Once the component is formed, the sacrificial layer is released with an etchant having a selectivity for the sacrificial layer such that a cavity is formed beneath the component. The cavity allows free movement component within the cavity during operation of the device. In addition, the etchant does not release the field layer and the component such that the field layer remains below the anchors.
    • 提供了一种形成装置的方法。 该方法包括提供衬底,在衬底上形成牺牲层,以及在牺牲层周围形成场层。 在形成之后,牺牲层和场层都被平坦化。 然后在平坦化的牺牲层和平坦化的场层上形成一个分量。 该部件具有设置在第一电极和第二电极之间的第一电极和第二电极以及单晶晶片。 该部件还包括基本上设置在场层上的锚。 一旦形成了部件,牺牲层就被用于对牺牲层具有选择性的蚀刻剂释放,使得在部件之下形成空腔。 空腔在设备运行期间允许空腔内的自由运动部件。 此外,蚀刻剂不会释放场层和组件,使得场层保持在锚点下方。
    • 8. 发明授权
    • Multi-mode MEMS resonator array
    • 多模MEMS谐振器阵列
    • US07750759B1
    • 2010-07-06
    • US12112278
    • 2008-04-30
    • Seungbae LeeKushal Bhattacharjee
    • Seungbae LeeKushal Bhattacharjee
    • H03H9/00H03H9/54
    • H03H9/2452H03H9/462H03H9/485H03H2009/02496
    • The present invention relates to a multi-mode micro-electromechanicalsystems (MEMS) resonator system that may provide low motional resistance and a high quality factor by using a resonating structure that includes multiple parallel-coupled longitudinally resonating bodies, each of which has multiple resonating segments adjacent to one another along an axis. The multi-mode MEMS resonator system may provide high acoustic velocity by using the micro-structure of MEMS technology. The multi-mode MEMS resonator system may include electrostatic transducers, piezoelectric transducers, or both. The present invention includes multiple embodiments that may include different configurations of the resonating structure.
    • 本发明涉及通过使用包括多个并联耦合纵向谐振体的谐振结构来提供低运动电阻和高品质因数的多模式微机电系统(MEMS)谐振器系统,其中每个具有多个谐振段 沿轴线彼此相邻。 多模MEMS谐振器系统可以通过使用MEMS技术的微结构来提供高声速。 多模MEMS谐振器系统可以包括静电换能器,压电换能器或两者。 本发明包括可以包括谐振结构的不同配置的多个实施例。
    • 9. 发明授权
    • Method of manufacturing SAW device substrates
    • 制造SAW器件衬底的方法
    • US08490260B1
    • 2013-07-23
    • US11969956
    • 2008-01-07
    • Sergei ZhgoonKushal Bhattacharjee
    • Sergei ZhgoonKushal Bhattacharjee
    • H04R17/10H01L21/20
    • H03H9/02614H03H9/02574Y10T29/42Y10T29/49005
    • A method of manufacturing composite structures, or composite substrates, for a Surface Acoustic Wave (SAW) device are provided. In one embodiment of the present disclosure, a piezoelectric substrate is provided. A supporting substrate is formed over a first surface of the piezoelectric substrate. The first surface of the piezoelectric substrate may be unpolished. A second surface of the piezoelectric substrate is then processed to a desired thickness and polished. SAW device components such as, for example, interdigitated transducers (IDTs) and reflectors are then formed on the polished surface of the piezoelectric substrate. The supporting substrate may be formed using any desired type of deposition or growth process.
    • 提供了一种制造用于表面声波(SAW)器件的复合结构或复合衬底的方法。 在本公开的一个实施例中,提供压电基板。 在压电基板的第一表面上形成支撑基板。 压电基板的第一表面可以是未抛光的。 然后将压电基板的第二表面加工成所需的厚度并抛光。 然后在压电基板的抛光表面上形成SAW器件部件,例如交叉换能器(IDT)和反射器。 可以使用任何所需类型的沉积或生长工艺来形成支撑衬底。