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1. 发明授权

US07079778B1 Rugged shock-resistant backplane for embedded systems 失效
标题翻译：用于嵌入式系统的坚固耐冲击背板
公开(公告)号：US07079778B1
公开(公告)日：2006-07-18
申请号：US09544762
申请日：2000-04-07
申请人： Shannon Mary Nelson , Richard Joseph Paul , Mark D. Hischke
发明人： Shannon Mary Nelson , Richard Joseph Paul , Mark D. Hischke
IPC分类号： H04B10/00
CPC分类号： H04B10/803 , H04B10/802 , H05K1/02 , H05K1/14
摘要： Infrared communications scheme for use in an embedded system. According to a preferred embodiment, the invention comprises the use of an infrared communications scheme, according to IrDA protocol, which is utilized to transmit and receive data optically between circuit cards housed within an enclosed, embedded system. Preferably, each respective circuit card is provided with an LED and photodiode to respectively transmit and receive data optically. As such, wire connections are eliminated and allows the systems and methods of the present invention to withstand a greater degree of vibration and shock than that of the prior-art systems and methods. Moreover, the systems and methods of the present invention provide increased reliability and provide greater electrical isolation between modules than prior-art systems and methods.
摘要翻译：用于嵌入式系统的红外通信方案。根据优选实施例，本发明包括使用根据IrDA协议的红外通信方案，其用于在封闭的嵌入式系统中容纳的电路卡之间光学地发送和接收数据。优选地，每个相应的电路卡设置有LED和光电二极管以分别以光学方式传送和接收数据。因此，消除了电线连接，并且允许本发明的系统和方法承受比现有技术的系统和方法更大程度的振动和冲击。而且，与现有技术的系统和方法相比，本发明的系统和方法提供增加的可靠性并且在模块之间提供更大的电隔离。

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