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1. 发明授权

US07768067B2 DMOS transistor 有权
标题翻译： DMOS晶体管
公开(公告)号：US07768067B2
公开(公告)日：2010-08-03
申请号：US12425592
申请日：2009-04-17
申请人： Seiji Otake , Shuichi Kikuchi , Yasuhiro Takeda , Kenichi Maki
发明人： Seiji Otake , Shuichi Kikuchi , Yasuhiro Takeda , Kenichi Maki
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L29/7816 , H01L29/0878 , H01L29/41758 , H01L29/41775 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/665 , H01L29/66689
摘要： This invention provides a DMOS transistor that has a reduced ON resistance and is prevented from deterioration in strength against an electrostatic discharge. An edge portion of a source layer of the DMOS transistor is disposed so as to recede from an inner corner portion of a gate electrode. A silicide layer is structured so as not to extend out of the edge portion of the source layer. That is, although the silicide layer is formed on a surface of the source layer, the silicide layer is not formed on a surface of a portion of a body layer, which is exposed between the source layer and the inner corner portion of the gate electrode. As a result, the strength against the electrostatic discharge can be improved, because an electric current flows almost uniformly through whole of the DMOS transistor without converging.
摘要翻译：本发明提供一种DMOS晶体管，其具有降低的导通电阻并且防止其相对静电放电的强度劣化。 DMOS晶体管的源极层的边缘部分被设置为从栅电极的内角部分退出。硅化物层被构造为不从源极层的边缘部分延伸出来。也就是说，尽管在源极层的表面上形成硅化物层，但是在源极层和栅电极的内角部之间露出的体层的一部分的表面上不形成硅化物层。结果，由于电流几乎均匀地流过整个DMOS晶体管而没有会聚，所以可以提高抵抗静电放电的强度。

2. 发明申请

US20090261410A1 DMOS TRANSISTOR 有权
标题翻译： DMOS晶体管
公开(公告)号：US20090261410A1
公开(公告)日：2009-10-22
申请号：US12425592
申请日：2009-04-17
申请人： Seiji OTAKE , Shuichi Kikuchi , Yasuhiro Takeda , Kenichi Maki
发明人： Seiji OTAKE , Shuichi Kikuchi , Yasuhiro Takeda , Kenichi Maki
IPC分类号： H01L29/78
CPC分类号： H01L29/7816 , H01L29/0878 , H01L29/41758 , H01L29/41775 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/665 , H01L29/66689
摘要： This invention provides a DMOS transistor that has a reduced ON resistance and is prevented from deterioration in strength against an electrostatic discharge. An edge portion of a source layer of the DMOS transistor is disposed so as to recede from an inner corner portion of a gate electrode. A silicide layer is structured so as not to extend out of the edge portion of the source layer. That is, although the silicide layer is formed on a surface of the source layer, the silicide layer is not formed on a surface of a portion of a body layer, which is exposed between the source layer and the inner corner portion of the gate electrode. As a result, the strength against the electrostatic discharge can be improved, because an electric current flows almost uniformly through whole of the DMOS transistor without converging.
摘要翻译：本发明提供一种DMOS晶体管，其具有降低的导通电阻并且防止其相对静电放电的强度劣化。 DMOS晶体管的源极层的边缘部分被设置为从栅电极的内角部分退出。硅化物层被构造为不从源极层的边缘部分延伸出来。也就是说，尽管在源极层的表面上形成硅化物层，但是在源极层和栅电极的内角部之间露出的体层的一部分的表面上不形成硅化物层。结果，由于电流几乎均匀地流过整个DMOS晶体管而没有会聚，所以可以提高抵抗静电放电的强度。

3. 发明授权

US07439578B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07439578B2
公开(公告)日：2008-10-21
申请号：US11617517
申请日：2006-12-28
申请人： Yasuhiro Takeda , Mitsuaki Morigami , Satoru Shimada , Kazuhiro Yoshitake , Shuichi Kikuchi , Seiji Otake , Toshiyuki Ohkoda
发明人： Yasuhiro Takeda , Mitsuaki Morigami , Satoru Shimada , Kazuhiro Yoshitake , Shuichi Kikuchi , Seiji Otake , Toshiyuki Ohkoda
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119 , H01L29/06
CPC分类号： H01L29/7809 , H01L21/743 , H01L21/823487 , H01L27/088 , H01L29/0653 , H01L29/0696 , H01L29/41766 , H01L29/4236 , H01L29/66734 , H01L29/781
摘要： A semiconductor device includes a trench formed in a surface of a semiconductor substrate. A conductor is embedded in the trench. A conductive layer is arranged adjacent to the trench on the surface of the semiconductor substrate. Semiconductor elements, which include sources provided by one of the conductor and the conductive layer and drains provided by the other one of the conductor and the conductive layer, are formed in a semiconductor element formation region. A planar wiring layer is embedded in the semiconductor substrate under the entire semiconductor element formation region and connected to the conductor.
摘要翻译：半导体器件包括形成在半导体衬底的表面中的沟槽。导体嵌入在沟槽中。导电层被布置成与半导体衬底的表面上的沟槽相邻。包括由导体和导电层之一提供的源和由导体和导电层中的另一个提供的漏极的半导体元件形成在半导体元件形成区中。在整个半导体元件形成区域的半导体衬底内嵌有平面布线层，并与导体连接。

4. 发明申请

US20100193865A1 DMOS TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： DMOS晶体管及其制造方法
公开(公告)号：US20100193865A1
公开(公告)日：2010-08-05
申请号：US12680012
申请日：2008-09-26
申请人： Yasuhiro Takeda , Seiji Otake , Shuichi Kikuchi
发明人： Yasuhiro Takeda , Seiji Otake , Shuichi Kikuchi
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/0696 , H01L21/26586 , H01L29/1095 , H01L29/42368 , H01L29/4238 , H01L29/66689 , H01L29/7816
摘要： The invention provides a DMOS transistor in which a leakage current is decreased and the source-drain breakdown voltage of the transistor in the off state is enhanced when a body layer is formed by oblique ion implantation. After a photoresist layer 18 is formed, using the photoresist layer 18 and a gate electrode 14 as a mask, first ion implantation is performed toward a first corner portion 14C1 on the inside of the gate electrode 14 in a first direction shown by an arrow A′. A first body layer 17A′ is formed by this first ion implantation. The first body layer 17A′ is formed so as to extend from the first corner portion 14C1 to under the gate electrode 14, and the P-type impurity concentration of the body layer 17A′ in the first corner portion 14C1 is higher than that of a conventional transistor.
摘要翻译：本发明提供了一种DMOS晶体管，其中当通过倾斜离子注入形成体层时，泄漏电流降低，并且处于断开状态的晶体管的源极 - 漏极击穿电压增强。在形成光致抗蚀剂层18之后，使用光致抗蚀剂层18和栅电极14作为掩模，在栅极电极14的内侧沿箭头A所示的第一方向进行第一离子注入 '。通过该第一离子注入形成第一体层17A'。第一主体层17A'形成为从第一角部14C1延伸到栅极14的下方，第一角部14C1中的主体层17A'的P型杂质浓度高于常规晶体管。

5. 发明授权

US08395210B2 DMOS transistor and method of manufacturing the same 有权
标题翻译： DMOS晶体管及其制造方法
公开(公告)号：US08395210B2
公开(公告)日：2013-03-12
申请号：US12680012
申请日：2008-09-26
申请人： Yasuhiro Takeda , Seiji Otake , Shuichi Kikuchi
发明人： Yasuhiro Takeda , Seiji Otake , Shuichi Kikuchi
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/0696 , H01L21/26586 , H01L29/1095 , H01L29/42368 , H01L29/4238 , H01L29/66689 , H01L29/7816
摘要： The invention provides a DMOS transistor in which a leakage current is decreased and the source-drain breakdown voltage of the transistor in the off state is enhanced when a body layer is formed by oblique ion implantation. After a photoresist layer 18 is formed, using the photoresist layer 18 and a gate electrode 14 as a mask, first ion implantation is performed toward a first corner portion 14C1 on the inside of the gate electrode 14 in a first direction shown by an arrow A′. A first body layer 17A′ is formed by this first ion implantation. The first body layer 17A′ is formed so as to extend from the first corner portion 14C1 to under the gate electrode 14, and the P-type impurity concentration of the body layer 17A′ in the first corner portion 14C1 is higher than that of a conventional transistor.
摘要翻译：本发明提供了一种DMOS晶体管，其中当通过倾斜离子注入形成体层时，泄漏电流降低，并且处于断开状态的晶体管的源极 - 漏极击穿电压增强。在形成光致抗蚀剂层18之后，使用光致抗蚀剂层18和栅电极14作为掩模，在栅极电极14的内侧沿箭头A所示的第一方向进行第一离子注入 '。通过该第一离子注入形成第一体层17A'。第一主体层17A'形成为从第一角部14C1延伸到栅极14的下方，第一角部14C1中的主体层17A'的P型杂质浓度高于常规晶体管。

6. 发明申请

US20070166925A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20070166925A1
公开(公告)日：2007-07-19
申请号：US11617517
申请日：2006-12-28
申请人： Yasuhiro Takeda , Mitsuaki Morigami , Satoru Shimada , Kazuhiro Yoshitake , Shuichi Kikuchi , Seiji Otake , Toshiyuki Ohkoda
发明人： Yasuhiro Takeda , Mitsuaki Morigami , Satoru Shimada , Kazuhiro Yoshitake , Shuichi Kikuchi , Seiji Otake , Toshiyuki Ohkoda
IPC分类号： H01L21/336 , H01L21/3205
CPC分类号： H01L29/7809 , H01L21/743 , H01L21/823487 , H01L27/088 , H01L29/0653 , H01L29/0696 , H01L29/41766 , H01L29/4236 , H01L29/66734 , H01L29/781
摘要： A semiconductor device includes a trench formed in a surface of a semiconductor substrate. A conductor is embedded in the trench. A conductive layer is arranged adjacent to the trench on the surface of the semiconductor substrate. Semiconductor elements, which include sources provided by one of the conductor and the conductive layer and drains provided by the other one of the conductor and the conductive layer, are formed in a semiconductor element formation region. A planar wiring layer is embedded in the semiconductor substrate under the entire semiconductor element formation region and connected to the conductor.
摘要翻译：半导体器件包括在半导体衬底的表面中形成的沟槽。导体嵌入在沟槽中。导电层被布置成与半导体衬底的表面上的沟槽相邻。包括由导体和导电层之一提供的源和由导体和导电层中的另一个提供的漏极的半导体元件形成在半导体元件形成区域中。在整个半导体元件形成区域的半导体衬底内嵌有平面布线层，并与导体连接。

7. 发明授权

US07948031B2 Semiconductor device and method of fabricating semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US07948031B2
公开(公告)日：2011-05-24
申请号：US12167764
申请日：2008-07-03
申请人： Seiji Otake , Yasuhiro Takeda , Kenichi Maki
发明人： Seiji Otake , Yasuhiro Takeda , Kenichi Maki
IPC分类号： H01L29/66
CPC分类号： H01L29/7813 , H01L29/0615 , H01L29/0623 , H01L29/0646 , H01L29/0653 , H01L29/0696 , H01L29/1095 , H01L29/41766 , H01L29/66734 , H01L29/7809
摘要： A semiconductor device includes a gate electrode formed through an insulating film in a groove having a first side surface adjacent to a source region and a base region, and a second conductive type first impurity region formed adjacent to a second side surface of the groove between the groove and a lead-out portion of a drain region existing below the base region so as to extend downward beyond a lower end of the groove.
摘要翻译：一种半导体器件包括：栅极，其形成在沟槽中，绝缘膜具有与源极区域和基极区域相邻的第一侧面;以及第二导电型第一杂质区域，其形成在所述沟槽的第二侧面附近，凹槽和存在于基底区域下方的漏区的引出部分，以便向下延伸超过凹槽的下端。

8. 发明授权

US08022475B2 Semiconductor device optimized to increase withstand voltage and reduce on resistance 有权
标题翻译：半导体器件经过优化，可提高耐压并降低导通电阻
公开(公告)号：US08022475B2
公开(公告)日：2011-09-20
申请号：US12434128
申请日：2009-05-01
申请人： Yasuhiro Takeda , Seiji Otake , Kazunori Fujita
发明人： Yasuhiro Takeda , Seiji Otake , Kazunori Fujita
IPC分类号： H01L29/76 , H01L29/94
CPC分类号： H01L21/823456 , H01L21/2815 , H01L21/823412 , H01L21/823487 , H01L29/0653 , H01L29/0878 , H01L29/41766 , H01L29/4236 , H01L29/42376 , H01L29/66734 , H01L29/7809 , H01L29/7813
摘要： An ON resistance of a trench gate type transistor and a withstand voltage of a planar type transistor are optimized at the same time. Each of first and second regions of a semiconductor layer is formed by epitaxial growth on each of first and second regions of a semiconductor substrate, respectively. A first buried layer is formed between the first region of the semiconductor substrate and the first region of the semiconductor layer, while a second buried layer is formed between the second region of the semiconductor substrate and the second region of the semiconductor layer. The first buried layer is formed of an N+ type first impurity-doped layer and an N type second impurity-doped layer that extends beyond the fist impurity-doped layer. The second buried layer is formed of an N+ type impurity-doped layer only. In the first region of the semiconductor layer, an impurity is diffused from a surface of the semiconductor layer deep into the semiconductor layer to form an N type third impurity-doped layer. The trench gate type transistor is formed in the first region of the semiconductor layer and the planar type transistor is formed in the second region of the semiconductor layer.
摘要翻译：同时优化沟槽栅型晶体管的导通电阻和平面型晶体管的耐电压。半导体层的第一和第二区域中的每一个分别通过在半导体衬底的第一和第二区域中的每一个上外延生长而形成。在半导体衬底的第一区域和半导体层的第一区域之间形成第一掩埋层，而在半导体衬底的第二区域和半导体层的第二区域之间形成第二掩埋层。第一掩埋层由N +型第一杂质掺杂层和延伸超过第一杂质掺杂层的N型第二杂质掺杂层形成。第二掩埋层仅由N +型杂质掺杂层形成。在半导体层的第一区域中，杂质从半导体层的表面扩散到半导体层中以形成N型第三杂质掺杂层。沟槽栅型晶体管形成在半导体层的第一区域中，并且平面型晶体管形成在半导体层的第二区域中。

9. 发明授权

US08618584B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08618584B2
公开(公告)日：2013-12-31
申请号：US13612224
申请日：2012-09-12
申请人： Seiji Otake , Yasuhiro Takeda , Yuta Miyamoto
发明人： Seiji Otake , Yasuhiro Takeda , Yuta Miyamoto
IPC分类号： H01L21/70 , H01L23/62
CPC分类号： H01L27/0259
摘要： An ESD protection element is formed by a PN junction diode including an N+ type buried layer having a proper impurity concentration and a first P+ type buried layer and a parasitic PNP bipolar transistor which uses a second P+ type buried layer connected to a P+ type diffusion layer as the emitter, an N− type epitaxial layer as the base, and the first P+ type buried layer as the collector. The first P+ type buried layer is connected to an anode electrode, and the P+ type diffusion layer and an N+ type diffusion layer surrounding the P+ type diffusion layer are connected to a cathode electrode. When a large positive static electricity is applied to the cathode electrode, and the parasitic PNP bipolar transistor turns on to flow a large discharge current.
摘要翻译： ESD保护元件由包括具有适当杂质浓度的N +型掩埋层和第一P +型掩埋层的PN结二极管和使用连接到P +型扩散层的第二P +型掩埋层的寄生PNP双极晶体管形成作为发射极，以N型外延层为基底，第一P +型埋层作为集电体。第一P +型埋层与阳极连接，P +型扩散层和围绕P +型扩散层的N +型扩散层与阴极电极连接。当向阴极施加大的正静电时，并且寄生PNP双极晶体管导通以流过大的放电电流。

10. 发明申请

US20130075866A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20130075866A1
公开(公告)日：2013-03-28
申请号：US13612357
申请日：2012-09-12
申请人： Seiji Otake , Yasuhiro Takeda , Yuta Miyamoto
发明人： Seiji Otake , Yasuhiro Takeda , Yuta Miyamoto
IPC分类号： H01L27/07
CPC分类号： H01L27/0248 , H01L27/0251 , H01L27/0255 , H01L27/0259 , H01L27/0647
摘要： A PN junction diode is formed by an N+ type buried layer having a proper impurity concentration and a P+ type buried layer. The P+ type buried layer is combined with a P+ type drawing layer to penetrate an N− type epitaxial layer and be connected to an anode electrode. An N+ type diffusion layer and a P+ type diffusion layer connected to and surrounding the N+ type diffusion layer are formed in the N− type epitaxial layer surrounded by the P+ type buried layer etc. The N+ type diffusion layer and the P+ type diffusion layer are connected to a cathode electrode. An ESD protection element is formed by the PN junction diode and a parasitic PNP bipolar transistor which uses the P+ type diffusion layer as the emitter, the N− type epitaxial layer as the base, and the P+ type drawing layer etc as the collector.
摘要翻译： PN结二极管由具有适当杂质浓度的N +型掩埋层和P +型掩埋层形成。 P +型掩埋层与P +型拉伸层组合以穿透N型外延层并连接到阳极电极。在由P +型埋层等围绕的N型外延层中形成N +型扩散层和与N +型扩散层连接并包围的P +型扩散层.N +型扩散层和P +型扩散层为连接到阴极电极。 ESD保护元件由PN结二极管和使用P +型扩散层作为发射极，N型外延层为基极，P +型拉伸层等作为集电极的寄生PNP双极晶体管形成。

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