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    • 1. 发明授权
    • Tunable laser source and wavelength selection method thereof
    • 可调谐激光源及其波长选择方法
    • US07142569B2
    • 2006-11-28
    • US10818723
    • 2004-04-06
    • Sean ChangChia-chi Wu
    • Sean ChangChia-chi Wu
    • H01S3/10H01S3/08
    • H01S5/141H01S5/005H01S5/143
    • A tunable laser source includes a gain chip, a collimating lens, a grating, a focusing lens and a wavelength selection device. The grating is positioned to be impinged by the collimated light to provide diffracted beams at different diffraction angles whose wavelengths disperse in accordance with the diffraction angles. Those diffracted beams are then brought to separate focal points on the wavelength selection device through the focusing lens. The wavelength selection device includes a light shield with a single slit formed thereon and a mirror. The single silt allows the mirror to reflect only one diffracted beam back to the gain chip so as to maintain the oscillation of the tunable laser source at the wavelength corresponding to the diffraction angle of the only one focused diffracted beam.
    • 可调激光源包括增益芯片,准直透镜,光栅,聚焦透镜和波长选择装置。 光栅定位成被准直光照射,以提供不同衍射角的衍射光束,其波长根据衍射角分散。 那些衍射光束然后通过聚焦透镜被带到波长选择装置上的分离焦点。 波长选择装置包括其上形成有单个狭缝的光屏蔽和反射镜。 单个淤泥允许反射镜仅将一个衍射光束反射回增益芯片,以便将可调激光源的振荡保持在对应于仅一个聚焦衍射光束的衍射角的波长处。
    • 3. 发明申请
    • DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES
    • 沉积在高比例特征中
    • US20130330926A1
    • 2013-12-12
    • US13888077
    • 2013-05-06
    • Anand ChandrashekarRaashina HumayunMichal DanekAaron R. FellisSean Chang
    • Anand ChandrashekarRaashina HumayunMichal DanekAaron R. FellisSean Chang
    • H01L21/48
    • H01L21/486H01L21/28556H01L21/32136H01L21/76865H01L21/76877
    • Methods and apparatuses for filling high aspect ratio features with tungsten-containing materials in a substantially void-free manner are provided. In certain embodiments, the method involves depositing an initial layer of a tungsten-containing material followed by selectively removing a portion of the initial layer to form a remaining layer, which is differentially passivated along the depth of the high-aspect ration feature. In certain embodiments, the remaining layer is more passivated near the feature opening than inside the feature. The method may proceed with depositing an additional layer of the same or other material over the remaining layer. The deposition rate during this later deposition operation is slower near the feature opening than inside the features due to the differential passivation of the remaining layer. This deposition variation, in turn, may aid in preventing premature closing of the feature and facilitate filling of the feature in a substantially void free manner.
    • 提供了以基本上无空隙的方式用含钨材料填充高纵横比特征的方法和装置。 在某些实施方案中,该方法包括沉积含钨材料的初始层,然后选择性地去除初始层的一部分以形成沿着高纵横比特征的深度差异钝化的剩余层。 在某些实施例中,剩余层在特征开口附近比在特征内更加钝化。 该方法可以继续在剩余层上沉积相同或其它材料的附加层。 由于剩余层的差分钝化,在该后续沉积操作期间的沉积速率在特征开口附近比在特征内部的沉积速率更慢。 这种沉积变化又可以有助于防止特征的过早闭合并且有助于以基本无空隙的方式填充特征。
    • 5. 发明申请
    • Depositing Tungsten Into High Aspect Ratio Features
    • 将钨沉积到高宽比特征中
    • US20120009785A1
    • 2012-01-12
    • US12833823
    • 2010-07-09
    • Anand ChandrashekarRaashina HumayunMichal DanekAaron R. FellisSean Chang
    • Anand ChandrashekarRaashina HumayunMichal DanekAaron R. FellisSean Chang
    • H01L21/768C23F1/08
    • C23F4/00C23C16/045C23C16/06H01L21/76877
    • Methods and apparatuses for filling high aspect ratio features with tungsten-containing materials are provided. The method involves providing a partially fabricated semiconductor substrate and depositing a tungsten-containing layer on the substrate surface to partially fill one or more high aspect ratio features. The method continues with selective removal of a portion of the deposited layer such that more material is removed near the feature opening than inside the feature. In certain embodiments, removal may be performed at mass-transport limited conditions with less etchant available inside the feature than near its opening. Etchant species are activated before being introduced into the processing chamber and/or while inside the chamber. In specific embodiments, recombination of the activated species is substantially limited and/or controlled during removal, e.g., operation is performed at less than about 250° C. and/or less than about 5 Torr.
    • 提供了用含钨材料填充高纵横比特征的方法和装置。 该方法包括提供部分制造的半导体衬底并且在衬底表面上沉积含钨层以部分填充一个或多个高纵横比特征。 该方法继续选择性地去除沉积层的一部分,使得在特征开口附近更多的材料在特征内部被移除。 在某些实施方案中,可以在质量传输限制条件下进行移除,在特征内可用蚀刻剂较少,而不是靠近其开口。 在引入处理室之前和/或在室内时,蚀刻剂物质被激活。 在具体实施方案中,活化物质的重组在除去期间基本上受到限制和/或控制,例如在小于约250℃和/或小于约5托下进行操作。
    • 6. 发明授权
    • Magnetic actuator
    • 磁力执行机构
    • US07594239B2
    • 2009-09-22
    • US11153549
    • 2005-06-16
    • Chii-How ChangSean Chang
    • Chii-How ChangSean Chang
    • G11B17/03
    • H01F7/066H01F7/122
    • A magnetic actuator. The magnetic actuator comprises a first magnet, a second magnet, a first yoke, and a first coil. The second magnet is arranged axially with respect to the first magnet with repulsion therebetween. The first yoke is disposed between the first magnet and the second magnet, and the magnetic field lines produced by the first magnet and the second magnet extend from the first yoke. The first coil surrounds and corresponds to the first yoke. When a current is occurred in the first coil, the magnetic force generated between the first magnet and the second magnet will actuates the first coil to move axially with respect to the first and second magnets.
    • 磁力驱动器。 磁致动器包括第一磁体,第二磁体,第一磁轭和第一线圈。 第二磁体相对于第一磁体轴向布置,在它们之间具有排斥力。 第一磁轭设置在第一磁体和第二磁体之间,由第一磁体和第二磁体产生的磁场线从第一磁轭延伸。 第一线圈围绕并对应于第一轭。 当在第一线圈中发生电流时,在第一磁体和第二磁体之间产生的磁力将致动第一线圈相对于第一和第二磁体轴向移动。