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1. 发明申请

US20120100669A1 METHOD OF MANUFACTURING TMV PACKAGE-ON-PACKAGE DEVICE 审中-公开
标题翻译：制造TMV封装封装器件的方法
公开(公告)号：US20120100669A1
公开(公告)日：2012-04-26
申请号：US13279655
申请日：2011-10-24
申请人： Se Young JANG , Kun Tak KIM , Jeong Ung KIM
发明人： Se Young JANG , Kun Tak KIM , Jeong Ung KIM
IPC分类号： H01L21/60
CPC分类号： H01L25/105 , H01L21/563 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/831 , H01L2225/1023 , H01L2225/1058 , H01L2924/15331 , H01L2924/3511 , H01L2924/00012
摘要： A method of manufacturing a Through Mold Via (TMV) package-on-package device while preventing a bad solder joint from occurring in the TMV package-on-package device is provided. The method includes coating exposed portions of a lower semiconductor package with an organic soldering preservative, and stacking a top semiconductor package on the lower semiconductor package and connecting lower solder balls of the top semiconductor package with the top solder balls of the lower semiconductor package. According to the method, a bad solder joint may be prevented from occurring when a top semiconductor package is bonded to a lower semiconductor package.
摘要翻译：提供了一种制造通过模具通（TMV）封装封装器件的方法，同时防止在TMV封装封装器件中发生不良焊点。该方法包括用有机焊接防腐剂涂覆下半导体封装的暴露部分，并且在下半导体封装上堆叠顶部半导体封装并将顶部半导体封装的下焊球与下半导体封装的顶部焊球连接。根据该方法，当顶部半导体封装被接合到下半导体封装时，可以防止发生不良焊接接头。

2. 发明申请

US20130027115A1 METHOD FOR CONTROLLING TEMPERATURE OF TERMINAL AND TERMINAL SUPPORTING THE SAME 有权
标题翻译：用于控制终端和终端支持温度的方法
公开(公告)号：US20130027115A1
公开(公告)日：2013-01-31
申请号：US13543262
申请日：2012-07-06
申请人： Ki Yeon PARK , Se Young JANG , Chul Eun Yun
发明人： Ki Yeon PARK , Se Young JANG , Chul Eun Yun
IPC分类号： H03K3/02
CPC分类号： G05D23/1951
摘要： A method for controlling a temperature of a terminal and a terminal supporting the same are provided. A terminal supporting temperature control includes a temperature sensor for detecting a temperature of the terminal, and a controller for performing at least one of a first throttle procedure including driving the controller with a first preset driving frequency when the temperature of the terminal detected by the temperature sensor is a first preset temperature, and driving the controller with a second driving frequency higher than the first driving frequency when the temperature of the terminal is reduced to a second preset temperature lower than the first preset temperature, and a second throttle procedure including driving the controller with the first preset driving frequency for a first time, and driving the controller with the second driving frequency higher than the first driving frequency for a second time after the first time elapses.
摘要翻译：提供了一种用于控制终端和支持终端的终端的温度的方法。终端支持温度控制包括用于检测终端的温度的温度传感器，以及控制器，用于当由温度检测到的终端的温度时，执行包括以第一预设驱动频率驱动控制器的第一节流程序中的至少一个传感器是第一预设温度，并且当端子的温度降低到比第一预设温度低的第二预设温度时，以比第一驱动频率高的第二驱动频率驱动控制器，以及第二节流程序，包括驱动具有第一预设驱动频率的控制器，并且在第一次经过第二次之后，以比第一驱动频率高的第二驱动频率驱动控制器。

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