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    • 1. 发明授权
    • Clock synchronization device
    • 时钟同步装置
    • US06583654B2
    • 2003-06-24
    • US10139889
    • 2002-05-06
    • Se Jun KimJae Kyung Wee
    • Se Jun KimJae Kyung Wee
    • H03L700
    • H03L7/0812H03L7/089
    • A clock synchronization device is disclosed that includes a phase detecting unit for detecting a phase difference between an external clock signal and an internal clock signal, a binary code generating unit for outputting a binary code value according to output signals from the phase detecting unit, a code converting unit for converting the binary code value from the binary code generating unit into a thermometer code value, a D/A converting unit for outputting a voltage corresponding to the thermometer code value from the code converting unit and a clock synchronization control unit for outputting the internal clock signal from the external clock signal according to the output voltage from the D/A converting unit. As the result, the clock synchronization device is controlled by employing the D/A converting unit for converting the binary code to the thermometer code in order to decrease the number of the registers, the leakage current and the chip size.
    • 公开了一种时钟同步装置,包括用于检测外部时钟信号和内部时钟信号之间的相位差的相位检测单元,用于根据来自相位检测单元的输出信号输出二进制码值的二进制码产生单元, 代码转换单元,用于将来自二进制代码生成单元的二进制代码值转换为温度计代码值; D / A转换单元,用于从代码转换单元输出与温度计代码值相对应的电压;以及时钟同步控制单元,用于输出 来自外部时钟信号的内部时钟信号根据来自D / A转换单元的输出电压。 结果,通过采用用于将二进制码转换为温度计代码的D / A转换单元来控制时钟同步装置,以便减少寄存器的数量,漏电流和芯片尺寸。
    • 4. 发明申请
    • METHOD OF MANUFACTURING FLASH MEMORY DEVICE
    • 制造闪存存储器件的方法
    • US20070207580A1
    • 2007-09-06
    • US11618702
    • 2006-12-29
    • Sun Mi ParkYoo Nam JeonNam Kyeong KimSe Jun Kim
    • Sun Mi ParkYoo Nam JeonNam Kyeong KimSe Jun Kim
    • H01L21/336
    • H01L27/115H01L21/76849H01L21/76877H01L27/11521
    • A method of manufacturing a flash memory device includes etching an insulating layer provided over a substrate to form a contact hole to define a contact hole exposing a junction region formed on the substrate. The contact hole is filled with a first conductive material, the first conductive material contacting the junction region and extending above an upper surface of the contact hole. The first conductive material is etched to partly fill the contact hole, so that the first conductive material fills a lower portion of the contact hole, wherein an upper portion of the contact hole remains not filled due to the etching of the first conductive material, wherein the etched first conductive material defines a contact plug. A first dielectric layer and a second dielectric layer are formed over the contact plug, thereby filling the upper portion of the contact hole. Part of the first and second dielectric layers is etched to expose the contact plug and the upper portion of the contact hole. A second conductive material is formed on the contact plug and filling the upper portion of the contact hole to form a bit line.
    • 制造闪速存储器件的方法包括蚀刻设置在衬底上的绝缘层以形成接触孔,以限定暴露形成在衬底上的接合区域的接触孔。 接触孔填充有第一导电材料,第一导电材料接触接合区并在接触孔的上表面上方延伸。 第一导电材料被蚀刻以部分地填充接触孔,使得第一导电材料填充接触孔的下部,其中接触孔的上部部分由于蚀刻第一导电材料而保持未填充,其中 蚀刻的第一导电材料限定接触插塞。 第一电介质层和第二电介质层形成在接触插塞上,从而填充接触孔的上部。 蚀刻第一和第二电介质层的一部分以暴露接触插塞和接触孔的上部。 第二导电材料形成在接触插塞上并填充接触孔的上部以形成位线。
    • 8. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06757210B2
    • 2004-06-29
    • US10330892
    • 2002-12-27
    • Sang Hoon HongSe Jun KimJeong Hoon Kook
    • Sang Hoon HongSe Jun KimJeong Hoon Kook
    • G11C800
    • G11C7/1066G11C7/10G11C2207/002
    • A semiconductor memory device configured to share a local I/O line is described herein. The device includes: a memory cell array including a plurality of memory cells; a plurality of bit line sense amplifiers configured to sense and to amplify data stored in the plurality of memory cells; a plurality of bit lines configured to transmit transmitting the data stored in the plurality of memory cells to the plurality of bit line sense amplifiers, respectively; a plurality of bit line dividing circuits configured to selectively divide the plurality of bit lines; and a plurality of column selecting circuits configured to sequentially transmit the data amplified by the plurality of bit line sense amplifiers to corresponding I/O lines.
    • 这里描述了配置成共享本地I / O线的半导体存储器件。 该装置包括:包括多个存储单元的存储单元阵列; 多个位线读出放大器,被配置为感测和放大存储在所述多个存储器单元中的数据; 多个位线,被配置为分别将多个存储单元中存储的数据发送到多个位线读出放大器; 多个位线分割电路,被配置为选择性地划分所述多个位线; 以及多个列选择电路,被配置为顺序地将由多个位线读出放大器放大的数据发送到对应的I / O线。
    • 10. 发明授权
    • High speed interface type semiconductor memory device
    • 高速接口型半导体存储器件
    • US06813196B2
    • 2004-11-02
    • US09892549
    • 2001-06-28
    • Yong Jae ParkSe Jun Kim
    • Yong Jae ParkSe Jun Kim
    • G11C700
    • G11C7/222G11C7/1072G11C7/22G11C11/4076
    • The present invention discloses a high speed interface type semiconductor memory device which can transmit data of a plurality of DRAMs of a module to a controller by using only one data strobe clock signal. The high speed interface type semiconductor memory device includes a DRAM module unit for generating a strobe clock signal for synchronizing a data signal in a read operation in a DRAM farthest from a controller among a plurality of DRAMs, providing the strobe clock signal to the other DRAMs, and transmitting data to the controller in the read operation, and a controller for transmitting a clock signal and data signals synchronized with the clock signal to the plurality of DRAMs, and receiving data signals from the DRAMs.
    • 本发明公开了一种高速接口型半导体存储器件,其可以通过仅使用一个数据选通时钟信号将模块的多个DRAM的数据传输到控制器。 高速接口型半导体存储器件包括:DRAM模块单元,用于产生用于在多个DRAM中与控制器最远的DRAM中的读取操作中的数据信号同步的选通时钟信号,将选通时钟信号提供给其它DRAM ,以及在读取操作中向控制器发送数据,以及用于将时钟信号和与时钟信号同步的数据信号发送到多个DRAM的控制器,以及从DRAM接收数据信号。