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1. 发明公开

US20240028814A1 METHOD AND SYSTEM FOR MEASURING STRUCTURE BASED ON SPECTRUM 审中-公开
公开(公告)号：US20240028814A1
公开(公告)日：2024-01-25
申请号：US18348469
申请日：2023-07-07
申请人： Samsung Electronics Co., Ltd.
发明人： QHwan KIM , Jaeyoon KIM , Hyeonkyun NOH , Ami MA , Sunghee LEE , Kyubaik CHANG , Wooyoung CHEON , Jaehoon JEONG
IPC分类号： G06F30/398
CPC分类号： G06F30/398 , G06F2111/20
摘要： A method for measuring a structure based on a spectrum, includes obtaining a first model that includes a first sub-model and a second sub-model following the first sub-model and is trained based on simulation data, generating a second model including a third sub-model identical to the first sub-model, training the second model based on sample spectrum data generated by measuring spectra of sample structures, and estimating, based on the trained second model, the structure from measured spectrum data generated by measuring a spectrum of the structure.

2. 发明申请

US20210158173A1 NON-TRANSITORY COMPUTER-READABLE MEDIUM STORING PROGRAM CODE GENERATING WAFER MAP BASED ON GENERATIVE ADVERSARIAL NETWORKS AND COMPUTING DEVICE INCLUDING THE SAME 有权
公开(公告)号：US20210158173A1
公开(公告)日：2021-05-27
申请号：US16909132
申请日：2020-06-23
申请人： Samsung Electronics Co., Ltd.
发明人： Wonik JANG , Sanghoon MYUNG , Changwook JEONG , Sunghee LEE
IPC分类号： G06N3/08 , G06N3/04
摘要： A non-transitory computer-readable medium storing a program code including an image generation model, which when executed, causes a processor to input input data including sampling data of some of a plurality of semiconductor dies of a wafer to a generator network of the image generation model and output a wafer map indicating the plurality of semiconductor dies, and to input the wafer map output from the generator network to a discriminator network of the image generation model and discriminate the wafer map.

3. 发明公开

US20240211755A1 METHOD OF PROVIDING ARTIFICIAL INTELLIGENCE ALGORITHM, OPERATING METHOD OF ARTIFICIAL INTELLIGENCE ALGORITHM, ELECTRONIC DEVICE, RECORDING MEDIUM, AND COMPUTER PROGRAM 审中-公开
公开(公告)号：US20240211755A1
公开(公告)日：2024-06-27
申请号：US18453651
申请日：2023-08-22
申请人： Samsung Electronics Co., Ltd.
发明人： Sunghee LEE , QHwan KIM , Minkyu KIM , Bongseok KIM , Youngseok KIM , Ami MA , Jinkook PARK , Kyubaik CHANG , Jaehoon JEONG
IPC分类号： G06N3/08
CPC分类号： G06N3/08
摘要： Provided are a method of providing an artificial intelligence (AI) algorithm, an operation method of an AI algorithm, an electronic device, a recording medium, and a computer program. The method of providing the AI algorithm includes loading data sets with respect to a spectrum of a semiconductor and a structure of the semiconductor, calculating an out of distribution (OOD) index with respect to the spectrum of the semiconductor, performing data split by clustering sampling the data sets into at least one learning data set with respect to OOD indexes according to semiconductors, and providing an optimal AI algorithm from among a plurality of AI algorithms that have learned the at least one learning data set.

4. 发明公开

US20230221049A1 AIR CONDITIONER 审中-公开
公开(公告)号：US20230221049A1
公开(公告)日：2023-07-13
申请号：US18124335
申请日：2023-03-21
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Munsub KIM , Hyunwuk KANG , Jiho BAEK , Hyeongjoon SEO , Duhan JUNG , Jaewoo CHOI , Junyeong KIM , Taeryong SEONG , Sunghee LEE
IPC分类号： F25B41/40 , F25B40/02 , F16L55/02
CPC分类号： F25B41/40 , F25B40/02 , F16L55/02 , F25B2500/13 , F25B2400/075
摘要： An air conditioner is disclosed. The air conditioner comprises: a compressor for compressing a refrigerant; a discharge pipe for guiding the refrigerant discharged from the compressor; an accumulator for storing the refrigerant flowing into the compressor from an outdoor heat exchanger or an indoor heat exchanger; a suction pipe for guiding the refrigerant discharged from the accumulator to the compressor; a subcooler disposed in a pipe between the outdoor heat exchanger and the indoor heat exchanger so as to secure a degree of subcooling of the refrigerant; an injection pipe for guiding a refrigerant superheated in the subcooler to the compressor; and a fixing member provided for fixing the discharge pipe, the suction pipe, and the injection pipe together.

5. 发明申请

US20220232459A1 ELECTRONIC DEVICE FOR CONTROLLING CONNECTION TO ACCESS POINT AND METHOD OF THE SAME 有权
公开(公告)号：US20220232459A1
公开(公告)日：2022-07-21
申请号：US17573045
申请日：2022-01-11
申请人： Samsung Electronics Co., Ltd.
发明人： Sunghee LEE
IPC分类号： H04W48/16 , H04W36/00 , H04W76/18 , H04W48/20
摘要： An electronic device according to an embodiment of the disclosure includes a communication circuit, a memory, and a processor configured to be operatively connected to the communication circuit and the memory. The processor may be configured to control the communication circuit to perform wireless communication through a first access point, to search for another access point while performing communication through the first access point, and attempt to connect to a candidate access point selected based on a block list stored in the memory, and to store, when a designated event occurs while attempting to connect to the candidate access point, a recovery condition configured according to a type of the designated event together with identification information of the candidate access point in the block list.

6. 发明申请

US20210092657A1 METHOD AND SYSTEM FOR NETWORK HANDOVER ON TRANSPORT LAYER 有权
公开(公告)号：US20210092657A1
公开(公告)日：2021-03-25
申请号：US16994344
申请日：2020-08-14
申请人： Samsung Electronics Co., Ltd.
发明人： Madhan Raj KANAGARATHINAM , Chounjong NAM , Gaurav SINHA , Gunjan kumar CHOUDHARY , Karthikeyan ARUNACHALAM , Sunghee LEE , Sujith Rengan JAYASEELAN , Dronamraju Siva SABAREESH , Harikrishnan Natarajan , Jaheon GU
IPC分类号： H04W36/04 , H04W80/06 , H04L29/06 , H04W36/00
摘要： Disclosed herein is a method and network handover system for handling a data session in a user equipment (UE). The method comprises initiating a data session of at least one application from a plurality of applications with a first communication interface using a first socket of the UE having a first socket file descriptor (SOCKFD) for the data session, detecting a deterioration in a network connection of the first communication interface, identifying a second communication interface, establishing a second socket having a second SOCKFD associated with the second communication interface and migrating the data session from the first communication interface to the second communication interface by mapping the first SOCKFD corresponding to the first socket to the second SOCKFD corresponding to the second socket.

7. 发明申请

US20160049564A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20160049564A1
公开(公告)日：2016-02-18
申请号：US14656298
申请日：2015-03-12
申请人： Samsung Electronics Co., Ltd.
发明人： Kunmo CHU , Changyoul MOON , Sunghee LEE , Junsik HWANG
IPC分类号： H01L33/62 , H01L33/00 , H01L33/32
CPC分类号： H01L25/50 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L33/0079 , H01L2224/04026 , H01L2224/05666 , H01L2224/05671 , H01L2224/131 , H01L2224/16225 , H01L2224/24146 , H01L2224/29082 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29155 , H01L2224/32145 , H01L2224/32503 , H01L2224/33181 , H01L2224/48225 , H01L2224/73204 , H01L2224/73217 , H01L2224/73227 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/83005 , H01L2224/83193 , H01L2224/83204 , H01L2224/8381 , H01L2224/83825 , H01L2224/83948 , H01L2224/92 , H01L2224/9202 , H01L2224/92144 , H01L2224/92244 , H01L2224/94 , H01L2924/00014 , H01L2924/10253 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/3512 , H01L2933/0066 , H01L2224/83 , H01L2924/014 , H01L21/78 , H01L2224/81 , H01L2224/45099
摘要： A semiconductor device includes a base substrate and a semiconductor chip on the base substrate, the semiconductor chip including a first layer structure and a second layer structure opposite to the first layer structure, at least one of the first and second layer structures including a semiconductor device portion, and a bonding structure between the first layer structure and the second layer structure, the bonding structure including a silver-tin (Ag—Sn) compound and a nickel-tin (Ni—Sn) compound.
摘要翻译：半导体器件包括基底基板和基底基板上的半导体芯片，该半导体芯片包括第一层结构和与第一层结构相对的第二层结构，第一和第二层结构中的至少一个包括半导体器件所述第一层结构和所述第二层结构之间的接合结构，所述接合结构包括银 - 锡（Ag-Sn）化合物和镍 - 锡（Ni-Sn）化合物。

8. 发明公开

US20240056878A1 MANAGING QUALITY OF SERVICE OF APPLICATIONS IN WIRELESS NETWORK 审中-公开
公开(公告)号：US20240056878A1
公开(公告)日：2024-02-15
申请号：US18447756
申请日：2023-08-10
申请人： Samsung Electronics Co., Ltd.
发明人： Madhan Raj KANAGARATHINAM , Irlanki SANDEEP , Kavin Kumar THANGADORAI , Srihari KUNCHA , Dronamraju Siva SABAREESH , Srihari SRIRAM , Sukhdeep SINGH , Sri Vinod PALACHARLA , Jayendra Reddy KOVVURI , Mohan Rao GOLI , Sunghee LEE
IPC分类号： H04W28/02
CPC分类号： H04W28/0268
摘要： Embodiments herein provide a method for managing Quality of Service (QoS) of applications in a wireless network. Detecting a plurality of data traffic of plurality of applications based on current activities of a user equipment (UE), hardware components of UE, a plurality traffic parameter, a QoS report received from an access point (AP) associated with UE in a wireless network. Detecting an enhanced distributed channel access (EDCA) function based on plurality of data traffic. The EDCA function includes current mapping between access category of each data structure and traffic category of plurality of data traffic based on association. Classifying plurality of data traffic of the plurality of applications into priority data traffic category and non-priority data traffic category based on current mapping of the EDCA function. Modifying current mapping of EDCA function based on priority data traffic category, non-priority data traffic category, and access category of each data structure of plurality of data structures.

9. 发明申请

US20230070312A1 METHOD AND APPARATUS FOR FILLING GAP USING ATOMIC LAYER DEPOSITION 有权
公开(公告)号：US20230070312A1
公开(公告)日：2023-03-09
申请号：US17740838
申请日：2022-05-10
申请人： Samsung Electronics Co., Ltd. , INCHEON NATIONAL UNIVERSITY RESEARCH & BUSINESS FOUNDATION
发明人： Eunhyoung CHO , Sunghee LEE , Jeongyub LEE , Han-Bo-Ram LEE
IPC分类号： C23C16/455 , H01L21/02 , C23C16/40
摘要： A method and an apparatus for filling a gap by using an atomic layer deposition (ALD) method are provided. The method includes forming a first reaction inhibition layer on a side wall of the gap; forming a first precursor layer by adsorbing a first reactant into a bottom of the gap and the side wall of the gap around the bottom of the gap; and forming a first atomic layer on the bottom of the gap and the side wall of the gap around the bottom of the gap by adsorbing a second reactant into the first precursor layer. The forming of the first reaction inhibition layer may include adsorbing a first reaction inhibitor into the side wall of the gap; and forming a second reaction inhibitor by removing a specific ligand from the first reaction inhibitor.

10. 发明申请

US20210297978A1 ELECTRONIC DEVICE AND METHOD FOR REGISTERING OWNERSHIP 有权
公开(公告)号：US20210297978A1
公开(公告)日：2021-09-23
申请号：US17258507
申请日：2019-07-11
申请人： Samsung Electronics Co., Ltd.
发明人： Sunghee LEE , Junhak LIM , Taehun LIM
IPC分类号： H04W60/00
摘要： An electronic device comprises: at least one communication circuit configured to provide communication with a first external electronic device or a second external electronic device; at least one processor operatively connected to the at least one communication circuit; and a memory including device registration request information and operatively connected to the at least one processor, wherein the memory may store instructions configured to cause, when executed, at least one processor to: transmit, to the first external electronic device, a device registration request including at least device registration request information for registering the electronic device to the second external electronic device when a first communication is connected with the first external electronic device through the at least one communication circuit; receive a response to the device registration request from the first external electronic device; receive, from the second external electronic device, device registration update information that is updated on the basis of the registration request of the electronic device, based on the response, when a second communication is connected with the second external electronic device through the at least one communication circuit; and store the received device registration update information in the memory.

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