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1. 发明申请

US20150155188A1 SUBSTRATE TREATING APPARATUS AND METHOD 审中-公开
标题翻译：基板处理装置和方法
公开(公告)号：US20150155188A1
公开(公告)日：2015-06-04
申请号：US14556380
申请日：2014-12-01
申请人： SEMES CO., LTD.
发明人： In-II Jung , Woo-Young Kim , Young il Lee , Boong Kim
IPC分类号： H01L21/67 , B08B7/00 , F26B21/10 , H01J37/32
CPC分类号： F26B21/10 , H01J37/32816 , H01J37/32825 , H01J37/32834 , H01J37/32935 , H01J37/3299 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a predetermined process is performed on a substrate, a pressure meter measuring a pressure within the process chamber, and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber. The controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure.
摘要翻译：提供了一种基板处理装置。基板处理装置包括处理室，其中在基板上执行预定处理，测量处理室内的压力的压力计以及从压力计接收测量的压力值的控制器以确定该过程的打开时间房间。当处理室中的压力达到预设打开压力的时间过去了设定状态时，控制器打开处理室。

2. 发明授权

US10197333B2 Method and apparatus for drying substrate 有权
公开(公告)号：US10197333B2
公开(公告)日：2019-02-05
申请号：US15152979
申请日：2016-05-12
申请人： Semes Co., Ltd.
发明人： Boong Kim , Min Sung Han , Joo Jib Park , Woo Young Kim
IPC分类号： F26B21/14 , F26B9/06 , F26B3/04 , F26B21/10 , F26B21/12 , H01L21/67 , H01L21/02
摘要： Disclosed is a substrate drying apparatus of substrate processing apparatus including a chamber that provides a space for processing a substrate, and a fluid supply unit that supplies a process fluid to the chamber, wherein the liquid supply unit includes a supply tank in which the fluid is stored, a supply line that connects the supply tank and the chamber, a branch line branched from a first point of the supply line and connected to a second point of the supply line, and a temperature control unit that adjusts the temperature of the fluid such that the temperatures of the fluids flowing through the supply line and the branch line between the first point and the second point are different.

3. 发明授权

US11443938B2 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US11443938B2
公开(公告)日：2022-09-13
申请号：US16159839
申请日：2018-10-15
申请人： SEMES CO., LTD.
发明人： Boong Kim , Joo Jib Park , Woo Young Kim
IPC分类号： H01L21/67 , H01L21/02 , B08B7/00 , B08B3/08
摘要： A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supplier that supplies a fluid for operating the plurality of cylinder units, and a deviation corrector that corrects an operation deviation between the plurality of cylinder units. The deviation corrector corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.

4. 发明授权

US09587880B2 Apparatus and method for drying substrate 有权
标题翻译：基材干燥装置及方法
公开(公告)号：US09587880B2
公开(公告)日：2017-03-07
申请号：US13905676
申请日：2013-05-30
申请人： SEMES CO., LTD.
发明人： Boong Kim , Ki Bong Kim , Gil Hun Song , Oh Jin Kwon
IPC分类号： F26B21/12 , F26B5/00 , H01L21/67
CPC分类号： F26B21/12 , F26B5/005 , H01L21/67017 , H01L21/67034
摘要： Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.
摘要翻译：提供了一种用于干燥基板的装置和方法。该装置包括壳体，基板支撑构件，流体供应构件和排出构件。壳体提供进行干燥处理的空间。衬底支撑构件设置在壳体中以支撑衬底。流体供给构件包括用于将超临界状态的处理流体供给到壳体的供给管线。排出构件包括用于从壳体排出工艺流体的排出管线。这里，供应管线包括用于以第一供应流量将工艺流体供应到壳体的第一供应管线和设置成以第二供应流量将工艺流体供应到壳体的第二供应管线。

5. 发明授权

US11735437B2 Apparatus and method for treating substrate 有权
公开(公告)号：US11735437B2
公开(公告)日：2023-08-22
申请号：US17132008
申请日：2020-12-23
申请人： SEMES CO., LTD.
发明人： Boong Kim , Oh Jin Kwon , Sungho Jang , Joo Jib Park
IPC分类号： H01L21/67 , F26B25/14 , H01L21/677 , H01L21/687
CPC分类号： H01L21/67028 , F26B25/14 , H01L21/6719 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/67126 , H01L21/67178 , H01L21/67748 , H01L21/6875
摘要： Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

6. 发明授权

US10529594B2 Apparatus and method for treating substrate 有权
公开(公告)号：US10529594B2
公开(公告)日：2020-01-07
申请号：US15793263
申请日：2017-10-25
申请人： SEMES CO., LTD.
发明人： Do-Youn Lim , Joonho Won , Kisang Eum , Boong Kim , Joo Jib Park
IPC分类号： F27B17/00 , H01L21/67 , F26B5/04 , H01L21/02
摘要： Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.

7. 发明申请

US20180102263A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开
公开(公告)号：US20180102263A1
公开(公告)日：2018-04-12
申请号：US15834512
申请日：2017-12-07
申请人： SEMES CO., LTD.
发明人： Boong Kim , Oh Jin Kwon , Sungho Jang , Joo Jib Park
IPC分类号： H01L21/67 , H01L21/687 , H01L21/677
CPC分类号： H01L21/67028 , F26B25/14 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/67126 , H01L21/67178 , H01L21/6719 , H01L21/67748 , H01L21/6875
摘要： Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

8. 发明授权

US09275852B2 Substrate treating apparatus and substrate treating method 有权
标题翻译：基板处理装置及基板处理方法
公开(公告)号：US09275852B2
公开(公告)日：2016-03-01
申请号：US13905754
申请日：2013-05-30
申请人： Semes Co., Ltd.
发明人： KiBong Kim , Boong Kim , Gil Hun Song , Oh Jin Kwon
IPC分类号： H01L21/00 , B08B3/04 , F26B5/00 , H01L21/02 , F26B21/14 , H01L21/67 , B08B7/00 , F26B21/12
CPC分类号： H01L21/02101 , B08B7/0021 , F26B21/12 , F26B21/14 , H01L21/67017 , H01L21/67034 , H01L21/67051
摘要： Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.
摘要翻译：提供了一种使用超临界流体处理基板的装置。基板处理装置包括壳体，设置在壳体内以支撑基板的支撑构件，超临界流体供应单元，超临界流体被储存在该超临界流体供应单元中，供应管将超临界流体供应单元连接到壳体以调节从超临界流体供给单元供给到壳体中的超临界流体和从供给管分支以排出残留在供给管中的超临界流体的通气管。打开或关闭排气管的切换阀设置在排气管中。

9. 发明授权

US11367635B2 Apparatus and method for treating substrate 有权
公开(公告)号：US11367635B2
公开(公告)日：2022-06-21
申请号：US16133043
申请日：2018-09-17
申请人： SEMES CO., LTD.
发明人： Sangmin Lee , Woo Young Kim , Joo Jib Park , Boong Kim
IPC分类号： H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
摘要： Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.

10. 发明申请

US20190096717A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开
公开(公告)号：US20190096717A1
公开(公告)日：2019-03-28
申请号：US16133043
申请日：2018-09-17
申请人： SEMES CO., LTD.
发明人： Sangmin Lee , Woo Young Kim , Joo Jib Park , Boong Kim
IPC分类号： H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
摘要： Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.

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