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1. 发明授权

US06786408B2 Coin-type IC car reader/writer 失效
标题翻译：硬币型IC汽车读写器
公开(公告)号：US06786408B2
公开(公告)日：2004-09-07
申请号：US09894415
申请日：2001-06-28
申请人： Ryoji Yamagishi , Shigeyuki Murai
发明人： Ryoji Yamagishi , Shigeyuki Murai
IPC分类号： G06K708
CPC分类号： G07D5/02 , G06K7/0008 , G06K19/047 , G06K19/0723 , G07F1/02 , G07F1/06 , G07F7/0866
摘要： A coin-type IC card reader/writer comprises a coin-type IC card distributing unit provided in a coin-type IC card guide path, for performing the processing of reading data from the coin-type IC card and writing data to the coin-type IC card while temporarily stopping the rolling movement of the coin-type IC card, and, based on results of the processing, distributing the coin-type IC card to another coin-type IC card guide path disposed separately from the first-mentioned coin-type IC card guide path.
摘要翻译：硬币型IC卡读写器包括设置在硬币型IC卡引导路径中的硬币型IC卡分配单元，用于执行从硬币型IC卡读取数据的处理，并向硬币型IC卡引导路径写入数据。在暂时停止硬币型IC卡的滚动运动的同时，将IC卡插入IC卡，并且根据处理结果，将硬币型IC卡分配到与首先提到的硬币分开设置的另一硬币型IC卡引导路径型IC卡引导路径。

2. 发明申请

US20050179106A1 Schottky barrier diode 审中-公开
标题翻译：肖特基势垒二极管
公开(公告)号：US20050179106A1
公开(公告)日：2005-08-18
申请号：US11103598
申请日：2005-04-12
申请人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
发明人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
IPC分类号： H01L21/329 , H01L29/872 , H01L27/095
CPC分类号： H01L29/66143 , H01L29/872
摘要： A Schottky barrier diode has a Schottky electrode formed on an operation region of a GaAs substrate and an ohmic electrode surrounding the Schottky electrode. The ohmic electrode is disposed directly on an impurity-implanted region formed on the substrate. A nitride film insulates the ohmic electrode from a wiring layer connected to the Schottky electrode crossing over the ohmic electrode. The planar configuration of this device does not include the conventional polyimide layer, and thus has a better high frequency characteristics than conventional devices.
摘要翻译：肖特基势垒二极管在GaAs衬底的工作区域和围绕肖特基电极的欧姆电极上形成肖特基电极。欧姆电极直接设置在形成在基板上的杂质注入区域上。氮化膜将欧姆电极与穿过欧姆电极的肖特基电极连接的布线层绝缘。该器件的平面结构不包括传统的聚酰亚胺层，因此具有比常规器件更好的高频特性。

3. 发明授权

US06777277B2 Manufacturing method of Schottky barrier diode 有权
标题翻译：肖特基势垒二极管的制造方法
公开(公告)号：US06777277B2
公开(公告)日：2004-08-17
申请号：US10205605
申请日：2002-07-26
申请人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
发明人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
IPC分类号： H01L21338
CPC分类号： H01L29/66143 , H01L24/05 , H01L29/872 , H01L2224/04042 , H01L2224/45144 , H01L2224/4847 , H01L2924/14 , H01L2924/00
摘要： A Schottky barrier diode has a Schottky contact region formed in an n epitaxial layer disposed on a GaAs substrate and an ohmic electrode surrounding the Schottky contact region. The ohmic electrode is disposed directly on an impurity-implanted region formed on the substrate. An insulating region is formed through the n epitaxial layer so that an anode bonding pad is isolated form other elements of the device at a cathode voltage. The planar configuration of this device does not include the conventional polyimide layer, and thus has a better high frequency characteristics than conventional devices.
摘要翻译：肖特基势垒二极管具有形成在设置在GaAs衬底上的n外延层中的肖特基接触区域和围绕肖特基接触区域的欧姆电极。欧姆电极直接设置在形成在基板上的杂质注入区域上。通过n外延层形成绝缘区域，使得阳极接合焊盘在阴极电压下与器件的其它元件隔离。该器件的平面结构不包括传统的聚酰亚胺层，因此具有比常规器件更好的高频特性。

4. 发明授权

US06617660B2 Field effect transistor semiconductor and method for manufacturing the same 失效
标题翻译：场效应晶体管半导体及其制造方法
公开(公告)号：US06617660B2
公开(公告)日：2003-09-09
申请号：US09391507
申请日：1999-09-08
申请人： Shigeyuki Murai , Emi Fujii , Shigeharu Matsushita , Hisaaki Tominaga
发明人： Shigeyuki Murai , Emi Fujii , Shigeharu Matsushita , Hisaaki Tominaga
IPC分类号： H01L29095
CPC分类号： H01L29/66871 , H01L21/28587 , H01L29/42316 , H01L29/812
摘要： This invention has an objective to provide a field effect transistor semiconductor which has great adhesiveness between a gate metal and an insulating film defining a gate electrode end and to improve production yield thereof. The field effect transistor semiconductor of this invention comprises a source/drain electrode 6 positioned in a predetermined position in a GaAs substrate 1, a channel region provided in the GaAs substrate 1 and between the source/drain electrodes 6, a gate electrode 11 which is in schottky contact with a part of a channel region and is positioned between the source/drain electrodes 6, and an insulating film 7 which electrically insulates a surface of the GaAs substrate and the gate electrode 11 at both side surfaces of the gate electrode 11. The gate electrode 11 covers a part of the insulating film 7 and the surface of the GaAs substrate serving as the channel region, and a bottom metallic layer 8 contained in the gate electrode 11 is covered with a second metallic layer 9 which is highly adhesive to the insulating film 7.
摘要翻译：本发明的目的是提供一种场效应晶体管半导体，其在栅极金属和限定栅电极端的绝缘膜之间具有很大的粘合性，并提高其生产成品率。本发明的场效应晶体管半导体包括源极/漏极 6位于GaAs衬底1中的预定位置，设置在GaAs衬底1中并在源/漏电极6之间的沟道区，与沟道区的一部分肖特基接触并位于源极/漏极6以及绝缘膜7，其将栅极电极11的两个侧表面处的GaAs衬底的表面和栅极电极11电绝缘。栅电极11覆盖绝缘膜7的一部分，并且作为沟道区的GaAs衬底的表面和包含在栅极11中的底部金属层8被第二个元件覆盖与绝缘膜7高度粘合的层9。

5. 发明授权

US06787871B2 Integrated schottky barrier diode and manufacturing method thereof 有权
标题翻译：集成肖特基势垒二极管及其制造方法
公开(公告)号：US06787871B2
公开(公告)日：2004-09-07
申请号：US10283331
申请日：2002-10-30
申请人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
发明人： Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
IPC分类号： H01L27095
CPC分类号： H01L27/0814 , H01L24/05 , H01L27/0605 , H01L29/66143 , H01L29/872 , H01L2224/04042 , H01L2224/45144 , H01L2224/48463 , H01L2924/12032 , H01L2924/14 , H01L2924/00
摘要： An integrated Schottky barrier diode chip includes a compound semiconductor substrate, a plurality of Schottky barrier diodes formed on the substrate and an insulating region formed on the substrate by an on implantation. The insulating region electrically separates a portion of a diode at a cathode voltage from a portion of the diode at an anode voltage. Because of the absence of a polyimide layer and trench structures, this planar device configuration results in simpler manufacturing method and improved device characteristics.
摘要翻译：集成肖特基势垒二极管芯片包括化合物半导体衬底，形成在衬底上的多个肖特基势垒二极管和通过在衬底形成在衬底上的绝缘区域。绝缘区域在阳极电压下将二极管的阴极电压的一部分与二极管的一部分电隔离。由于不存在聚酰亚胺层和沟槽结构，所以该平面器件配置导致更简单的制造方法和改进的器件特性。

6. 发明授权

US06627967B2 Schottky barrier diode 有权
公开(公告)号：US06627967B2
公开(公告)日：2003-09-30
申请号：US10205608
申请日：2002-07-26
申请人： Tetsuro Asano , Katsuaki Onada , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
发明人： Tetsuro Asano , Katsuaki Onada , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
IPC分类号： H01L27095
CPC分类号： H01L29/66143 , H01L24/05 , H01L29/872 , H01L2224/04042 , H01L2224/45144 , H01L2224/4847 , H01L2924/14 , H01L2924/00
摘要： A Schottky barrier diode has a Schottky contact region formed in an n epitaxial layer disposed on a GaAs substrate and an ohmic electrode surrounding the Schottky contact region. The ohmic electrode is disposed directly on an impurity-implanted region formed on the substrate. An insulating region is formed through the n epitaxial layer so that an anode bonding pad is isolated form other elements of the device at a cathode voltage. The planar configuration of this device does not include the conventional polyimide layer, and thus has a better high frequency characteristics than conventional devices.

7. 发明授权

US07399999B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07399999B2
公开(公告)日：2008-07-15
申请号：US10958640
申请日：2004-10-06
申请人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
发明人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
IPC分类号： H01L29/06
CPC分类号： H01L29/7397 , H01L29/0619
摘要： In a conventional semiconductor device, there was a problem that, in a guard ring region, a shape of a depletion layer is distorted and stable withstand voltage characteristics cannot be obtained. In a semiconductor device of the present invention, a thermal oxide film in an actual operation region and a thermal oxide film in a guard ring region are formed in the same process. Thereafter, the thermal oxide film is once removed and is formed again. Thus, a film thickness of the thermal oxide film on the upper surface of the guard ring region is set to, for example, about 8000 to 10000 Å. Accordingly, a CVD oxide film including moving ions is formed in a position distant from a surface of an epitaxial layer. Consequently, distortion of a depletion layer, which is influenced by the moving ions, is suppressed and desired withstand voltage characteristics can be maintained.
摘要翻译：在传统的半导体器件中，存在在保护环区域中耗尽层的形状变形而不能得到稳定的耐电压特性的问题。在本发明的半导体装置中，以相同的工序形成实际工作区域中的热氧化膜和防护环区域的热氧化膜。此后，热氧化膜被一次除去并再次形成。因此，保护环区域的上表面上的热氧化膜的膜厚设定为例如约8000〜10000。因此，包含移动离子的CVD氧化膜形成在远离外延层的表面的位置。因此，受到移动离子影响的耗尽层的失真被抑制，并且可以保持期望的耐受电压特性。

8. 发明申请

US20050116283A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20050116283A1
公开(公告)日：2005-06-02
申请号：US10968354
申请日：2004-10-20
申请人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
发明人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
IPC分类号： H01L21/28 , H01L29/417 , H01L29/423 , H01L29/49 , H01L29/76 , H01L29/78 , H01L29/80
CPC分类号： H01L29/7828 , H01L29/41741 , H01L29/4236 , H01L29/4238 , H01L29/4916
摘要： In conventional semiconductor devices, there observed a problem that cells on the devices may not function uniformly because of voltage drop in a main wiring layer due to a uniform and narrow width of the main wiring layer through which a main current flows. In a semiconductor device of the present invention, a width of one end of a main wire for carrying the main current is formed wider than a width of another end of the main wire. An overall width of the main wire is formed so as to be gradually narrowed from the one end to the another end. In this way, it is possible to reduce a difference in drive voltages between a cell located in the vicinity of an electrode pad for carrying the main current and a cell located in a remote position. Resultantly, it is possible to suppress a voltage drop in the main wire and to achieve uniform operations of cells in an element.
摘要翻译：在传统的半导体器件中，由于主电流流过的主布线层的宽度均匀而窄，主要布线层中的电压下降，存在器件的电池不能均匀地发挥作用的问题。在本发明的半导体器件中，用于承载主电流的主线的一端的宽度形成为比主线的另一端的宽度宽。主线的总宽度形成为从一端到另一端逐渐变窄。以这种方式，可以减小位于用于承载主电流的电极焊盘附近的电池与位于远程位置的电池之间的驱动电压的差异。因此，可以抑制主线中的电压降，并实现元件中的电池的均匀操作。

9. 发明授权

US5528509A Method of designing a high-frequency circuit 失效
标题翻译：高频电路设计方法
公开(公告)号：US5528509A
公开(公告)日：1996-06-18
申请号：US214821
申请日：1994-03-17
申请人： Tetsuro Sawai , Shigeyuki Murai , Tsutomu Yamaguchi , Yasoo Harada
发明人： Tetsuro Sawai , Shigeyuki Murai , Tsutomu Yamaguchi , Yasoo Harada
IPC分类号： H03F1/02 , G06F17/50 , H03G3/00 , H03F3/16
CPC分类号： G06F17/5063
摘要： The S-parameters of a transistor are measured at a plurality of bias points, and using a tentatively decided load resistance value, the S-parameters on the load curve are examined, based on which the power gain and input/output power characteristics are obtained to determine the optimum load. Then, by using a linear simulator, input and output circuits are designed so that the optimum load can be realized.
摘要翻译：在多个偏置点测量晶体管的S参数，并且使用暂时确定的负载电阻值，检查负载曲线上的S参数，基于该参数获得功率增益和输入/输出功率特性以确定最佳负载。然后，通过使用线性模拟器，设计输入和输出电路，以便实现最佳负载。

10. 发明申请

US20050133814A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20050133814A1
公开(公告)日：2005-06-23
申请号：US10958640
申请日：2004-10-06
申请人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
发明人： Tetsuya Yoshida , Tetsuya Okada , Hiroaki Saito , Shigeyuki Murai , Kikuo Okada
IPC分类号： H01L29/70 , H01L29/06 , H01L29/73 , H01L29/739 , H01L29/78 , H01L29/80 , H01L29/423
CPC分类号： H01L29/7397 , H01L29/0619
摘要： In a conventional semiconductor device, there was a problem that, in a guard ring region, a shape of a depletion layer is distorted and stable withstand voltage characteristics cannot be obtained. In a semiconductor device of the present invention, a thermal oxide film in an actual operation region and a thermal oxide film in a guard ring region are formed in the same process. Thereafter, the thermal oxide film is once removed and is formed again. Thus, a film thickness of the thermal oxide film on the upper surface of the guard ring region is set to, for example, about 8000 to 10000 Å. Accordingly, a CVD oxide film including moving ions is formed in a position distant from a surface of an epitaxial layer. Consequently, distortion of a depletion layer, which is influenced by the moving ions, is suppressed and desired withstand voltage characteristics can be maintained.
摘要翻译：在传统的半导体器件中，存在在保护环区域中耗尽层的形状变形而不能得到稳定的耐电压特性的问题。在本发明的半导体装置中，以相同的工序形成实际工作区域中的热氧化膜和防护环区域的热氧化膜。此后，热氧化膜被一次除去并再次形成。因此，保护环区域的上表面上的热氧化膜的膜厚设定为例如约8000〜10000。因此，包含移动离子的CVD氧化膜形成在远离外延层的表面的位置。因此，受到移动离子影响的耗尽层的失真被抑制，并且可以保持期望的耐受电压特性。

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