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    • 1. 发明授权
    • Method and apparatus for continuously galvanizing flat workpieces, and
especially printed circuit boards
    • 连续镀锌扁平工件,特别是印刷电路板的方法和装置
    • US4800001A
    • 1989-01-24
    • US8738
    • 1987-01-30
    • Rudi OttHeribert Reith
    • Rudi OttHeribert Reith
    • C25D5/06H05K3/24C25D7/00C25D17/12C25D17/28
    • H05K3/241C25D5/06
    • Printed circuit boards can be continuously electroplated by passing them through a pair of rollers (7) forming cathodic rollers, which are spring-pressed towards each other, the rollers being driven, for example at the circumferential speed of about 1/2 meter per minute. The rollers form a transport arrangement for the printed circuit board, while providing electrical connection to conductive tracks thereon. Closely downstream of the cathodic rollers are a pair of anodic rollers, made, for example, of titanium with a covering of platinum or iridium, over which a felt sleeve is placed, on which felt sleeve an electrolyte, including sulfuric acid and copper is sprayed. The anodic rollers, connected to a positive terminal, are spaced from the surface of the printed circuit board to leave a surface gap between the rollers and the printed circuit board of about 0.1 mm. Copper is electrolytically deposited, for example, at the current density of about 15 A/dm.sup.2, which is about six times of the density of immersion bath galvanizing, thus permitting deposition of about 32 micrometers copper in 10 minutes rather than 60 minutes in an immersion bath. A plurality of cathodic roller pairs (7) and anodic roller pairs (8) are combined in a single housing to form a module, for example of 10 pairs each, requiring for ten modules 7 meters of length of plane floor space for continuous processing.
    • 印刷电路板可以通过使它们通过形成阴极辊的一对辊(7)而连续电镀,所述辊形成阴极辊,所述辊彼此弹簧压紧,所述辊被驱动,例如以约1/2米/分钟的圆周速度 。 辊形成用于印刷电路板的输送装置,同时提供与其上的导电轨道的电连接。 阴极辊的紧密下游是一对阳极辊,例如由钛制成,具有铂或铱的覆盖物,在其上放置毡套,毛毡套上包括硫酸和铜的电解质被喷涂在其上 。 连接到正极端子的阳极辊与印刷电路板的表面间隔开,使辊和印刷电路板之间的表面间隙约为0.1mm。 铜以例如约15A / dm 2的电流密度进行电解沉积,约为浸浴镀锌密度的六倍,从而允许在10分钟内沉积约32微米的铜而不是60分钟沉积 浴。 多个阴极辊对(7)和阳极辊对(8)组合在单个壳体中以形成例如每对10对的模块,其需要十个模块,用于连续处理的7米长的平面占地空间。
    • 2. 发明授权
    • Method and apparatus for regeneration of a copper-containing etching
solution
    • 用于再生含铜蚀刻溶液的方法和装置
    • US4508599A
    • 1985-04-02
    • US575043
    • 1984-01-30
    • Rudi OttHeribert Reith
    • Rudi OttHeribert Reith
    • C23F1/46C25C5/02H05K3/06C25C1/12
    • C23F1/46C25C5/02
    • A method and apparatus for the regeneration of a copper-containing etching solution which contains copper (II) chloride as well as alkali chloride as a sequestering agent, wherein the cathode is operated at a current density of 40-400 A/dm.sup.2 and the anode is operated at a current density of 1-100 A/dm.sup.2. Copper forms at the cathode as a powdered slurry while chlorine forms at the anode which oxidizes copper (I) chloride to copper (II) chloride. With this method one can process etching solutions which contain not only copper but also base metals including zinc from etching brass or tombac, and obtain a powdered mixture of copper and base metal. The apparatus features a rotating disk-shaped cathode from whose outer face the metal powder is stripped by a scraper.
    • 一种用于再生包含氯化铜(II)以及碱金属氯化物作为隔离剂的含铜蚀刻溶液的方法和装置,其中阴极以40-400A / dm 2的电流密度操作,并且阳极 电流密度为1-100A / dm2。 铜在阴极形成为粉末浆料,同时在阳极形成氯,其将氯化铜(I)氧化为氯化铜(II)。 通过这种方法,可以处理不仅包含铜的蚀刻溶液,而且还可以包含从蚀刻黄铜或陶瓷制成的锌的贱金属,并获得铜和贱金属的粉末混合物。 该装置具有旋转的盘形阴极,其外表面上的金属粉末被刮刀剥离。