会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • METHODS OF ELECTRICAL SIGNALING IN AN ION ENERGY ANALYZER
    • 离子能量分析仪中电子信号的方法
    • US20120248322A1
    • 2012-10-04
    • US13433078
    • 2012-03-28
    • Merritt FunkLee ChenBarton LaneJianping ZhaoRadha Sundararajan
    • Merritt FunkLee ChenBarton LaneJianping ZhaoRadha Sundararajan
    • G01T1/185
    • H01J37/32935H01J49/488H05H1/0081Y10T29/49002
    • A method of generating a signal representing with an ion energy analyzer for use in determining an ion energy distribution of a plasma. The ion energy analyzer, used for determining an ion energy distribution of a plasma, includes a first grid and a second grid that is spaced away from and electrically isolated from the first grid. The first grid forms a first surface of the ion energy analyzer and is positioned to be exposed to the plasma. The first grid includes a first plurality of openings, which are dimensioned to be less than a Debye length for the plasma. A voltage source and an ion current meter are operably coupled to the second grid, the latter of which is configured to measure an ion flux onto the ion collector and to transmit a signal that represents the measured ion flux. The method includes selectively and variably biasing the second grid relative to the first grid.
    • 一种产生用离子能分析仪表示的信号的方法,用于确定等离子体的离子能量分布。 用于确定等离子体的离子能量分布的离子能量分析器包括与第一格栅隔开并与之隔离的第一格栅和第二栅格。 第一栅格形成离子能量分析器的第一表面并定位成暴露于等离子体。 第一栅格包括第一多个开口,其尺寸被设计成小于等离子体的德拜长度。 电压源和离子电流计可操作地耦合到第二栅极,第二栅极被配置为测量离子收集器上的离子通量并传输表示所测量的离子通量的信号。 该方法包括相对于第一格栅选择性地和可变地偏置第二格栅。
    • 7. 发明授权
    • Methods of electrical signaling in an ion energy analyzer
    • 离子能量分析仪中电信号的方法
    • US09087677B2
    • 2015-07-21
    • US13433078
    • 2012-03-28
    • Merritt FunkLee ChenBarton LaneJianping ZhaoRadha Sundararajan
    • Merritt FunkLee ChenBarton LaneJianping ZhaoRadha Sundararajan
    • H01J3/14H01J37/32H01J49/48H05H1/00
    • H01J37/32935H01J49/488H05H1/0081Y10T29/49002
    • A method of generating a signal representing with an ion energy analyzer for use in determining an ion energy distribution of a plasma. The ion energy analyzer, used for determining an ion energy distribution of a plasma, includes a first grid and a second grid that is spaced away from and electrically isolated from the first grid. The first grid forms a first surface of the ion energy analyzer and is positioned to be exposed to the plasma. The first grid includes a first plurality of openings, which are dimensioned to be less than a Debye length for the plasma. A voltage source and an ion current meter are operably coupled to the second grid, the latter of which is configured to measure an ion flux onto the ion collector and to transmit a signal that represents the measured ion flux. The method includes selectively and variably biasing the second grid relative to the first grid.
    • 一种产生用离子能量分析仪表示的用于确定等离子体的离子能量分布的信号的方法。 用于确定等离子体的离子能量分布的离子能量分析器包括与第一格栅隔开并与之隔离的第一格栅和第二栅格。 第一栅格形成离子能量分析器的第一表面并定位成暴露于等离子体。 第一栅格包括第一多个开口,其尺寸被设计成小于等离子体的德拜长度。 电压源和离子电流计可操作地耦合到第二栅极,第二栅极被配置为测量离子收集器上的离子通量并传输表示所测量的离子通量的信号。 该方法包括相对于第一格栅选择性地和可变地偏置第二格栅。
    • 10. 发明授权
    • Dynamic temperature backside gas control for improved within-substrate process uniformity
    • 动态温度背面气体控制,可提高基板内工艺的均匀性
    • US07674636B2
    • 2010-03-09
    • US11684818
    • 2007-03-12
    • Radha SundararajanLee ChenMerritt Funk
    • Radha SundararajanLee ChenMerritt Funk
    • H01L21/66
    • H01L22/20
    • A method and apparatus are provided to control the radial or non-radial temperature distribution across a substrate during processing to compensate for non-uniform effects, including radial and angular non-uniformities arising from system variations, or process variations, or both. The temperature is controlled, preferably dynamically, by flowing backside gas differently across different areas on a wafer supporting chuck to vary heat conduction across the wafer. Backside gas flow, of helium, for example, is dynamically varied across the chuck to control the uniformity of processing of the wafer. Ports in the support are grouped, and gas to or from the groups is separately controlled by different valves responsive to a controller that controls gas pressure in each of the areas to spatially and preferably dynamically control wafer temperature to compensate for system and process non-uniformities.
    • 提供了一种方法和装置,以在处理期间控制衬底上的径向或非径向温度分布,以补偿不均匀的影响,包括由系统变化产生的径向和角度不均匀性或过程变化,或两者。 优选动态地控制温度,通过在晶片支撑卡盘上的不同区域上不同地流动背面气体来改变晶片上的热传导。 例如,氦的背侧气体流动在卡盘之间动态变化以控制晶片的处理的均匀性。 支撑中的端口被分组,并且来自组的气体由响应于控制器的不同阀单独控制,所述控制器在空间上控制每个区域中的气体压力,并且优选地动态地控制晶片温度以补偿系统和过程的不均匀性 。