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1. 发明授权

US11262498B2 Module with transmit optical subassembly and receive optical subassembly 有权
公开(公告)号：US11262498B2
公开(公告)日：2022-03-01
申请号：US16945569
申请日：2020-07-31
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Gerald Cois Byrd , Chia-Te Chou , Karlheinz Muth
IPC分类号： G02B6/12 , G02B6/42 , H01L25/16 , H04B10/25 , H04B10/40
摘要： An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

2. 发明授权

US11815748B2 Optoelectronic device 有权
公开(公告)号：US11815748B2
公开(公告)日：2023-11-14
申请号：US17540782
申请日：2021-12-02
申请人： ROCKLEY PHOTONICS LIMITED
发明人： James Dongyoon Oh , Hooman Abediasl , Gerald Cois Byrd , Karlheinz Muth , Yi Zhang , Aaron John Zilkie
IPC分类号： G02F1/01 , G02F1/035 , G02F1/295 , G02B6/10 , G02F1/025 , G02F1/015
CPC分类号： G02F1/025 , G02F1/0157 , G02F2201/063 , G02F2203/21
摘要： An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 μm away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.

3. 发明授权

US10365436B2 Copackaging of ASIC and silicon photonics 有权
公开(公告)号：US10365436B2
公开(公告)日：2019-07-30
申请号：US15862463
申请日：2018-01-04
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Gerald Cois Byrd , David Arlo Nelson , Javid Messian , Thomas Pierre Schrans
IPC分类号： G02B6/12 , G02B6/13 , G02B6/42 , G02B6/43 , F21V8/00 , G02B6/122 , H01S5/026 , G02B6/14 , H01S5/02
摘要： A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

4. 发明授权

US10317620B2 Interposer beam expander chip 有权
公开(公告)号：US10317620B2
公开(公告)日：2019-06-11
申请号：US14789489
申请日：2015-07-01
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Andrew George Rickman , Aaron Zilkie , Damiana Lerose , Gerald Cois Byrd
IPC分类号： G02B6/12 , G02B6/42 , G02B6/26 , G02B6/10 , G02B6/122 , G02B6/30
摘要： An interposer chip for coupling light between an array of fibers and an array of optical waveguides on a second photonic chip. The interposer chip has an array of V-grooves for aligning the ends of the fibers to corresponding ends of an array of optical waveguides on the interposer chip. Each optical waveguide has a taper with a first end and a second end, the first end being configured to support an optical mode that couples efficiently to the mode of an optical fiber. The taper reduces the vertical mode size, so that the mode supported by the second end of the taper may be efficiently coupled to a 3-micron thick optical waveguide on the second photonic chip. The interposer chip further has a hard stop having a flat surface parallel to the optical waveguides on the interposer chip, at the interface to the second chip. When the interposer chip is flipped and assembled with the second chip, the hard stop abuts against a mounting surface on the second chip, so that optical waveguides on the interposer chip are aligned, in the vertical direction, with optical waveguides on the second chip.

5. 发明授权

US11133225B2 Mode converter and method of fabricating thereof 有权
公开(公告)号：US11133225B2
公开(公告)日：2021-09-28
申请号：US16865255
申请日：2020-05-01
申请人： ROCKLEY PHOTONICS LIMITED
发明人： John Drake , Damiana Lerose , Henri Nykänen , Gerald Cois Byrd
IPC分类号： H01L21/8238 , G02B6/136 , G02B6/13 , H01L21/8258 , G02B6/12 , G02B6/30 , G02B6/42 , G02B6/122 , H01L21/762 , G02B6/132 , G02B6/134 , H01S5/02
摘要： An optical fiber adapter and method of fabricating the same from a wafer including a double silicon-on-insulator layer structure. The optical fiber adapter may include a mode converter, a trench, and a V-groove, the V-groove and the trench operating as passive alignment features for an optical fiber, in the transverse translational and rotational degrees of freedom, and in the longitudinal translational degree of freedom, respectively. The mode converter may include a buried tapered waveguide.

6. 发明授权

US10761262B2 Module with transmit and receive optical subassemblies with specific pic cooling architecture 有权
公开(公告)号：US10761262B2
公开(公告)日：2020-09-01
申请号：US16051237
申请日：2018-07-31
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Gerald Cois Byrd , Chia-Te Chou , Karlheinz Muth
IPC分类号： G02B6/12 , G02B6/42 , H01L25/16 , H04B10/25 , H04B10/40
摘要： An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

7. 发明申请

US20170003450A1 INTERPOSER BEAM EXPANDER CHIP 审中-公开
标题翻译： INTERPOSER BEAM EXPANDER芯片
公开(公告)号：US20170003450A1
公开(公告)日：2017-01-05
申请号：US14789489
申请日：2015-07-01
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Andrew George Rickman , Aaron Zilkie , Damiana Lerose , Gerald Cois Byrd
IPC分类号： G02B6/12 , G02B6/122
CPC分类号： G02B6/12004 , G02B6/12002 , G02B6/122 , G02B6/30
摘要： An interposer chip for coupling light between an array of fibers and an array of optical waveguides on a second photonic chip. The interposer chip has an array of V-grooves for aligning the ends of the fibers to corresponding ends of an array of optical waveguides on the interposer chip. Each optical waveguide has a taper with a first end and a second end, the first end being configured to support an optical mode that couples efficiently to the mode of an optical fiber. The taper reduces the vertical mode size, so that the mode supported by the second end of the taper may be efficiently coupled to a 3-micron thick optical waveguide on the second photonic chip. The interposer chip further has a hard stop having a flat surface parallel to the optical waveguides on the interposer chip, at the interface to the second chip. When the interposer chip is flipped and assembled with the second chip, the hard stop abuts against a mounting surface on the second chip, so that optical waveguides on the interposer chip are aligned, in the vertical direction, with optical waveguides on the second chip.
摘要翻译：一种用于在光纤阵列与第二光子芯片上的光波导阵列之间耦合光的插入器芯片。插入器芯片具有用于将光纤的端部对准到插入器芯片上的光波导阵列的相应端部的V形槽阵列。每个光波导具有具有第一端和第二端的锥形，第一端被配置为支持有效耦合到光纤的模式的光学模式。锥度减小了垂直模式尺寸，使得由锥形的第二端支撑的模式可有效地耦合到第二光子芯片上的3微米厚的光波导。插入器芯片还具有在与第二芯片的接口处具有平行于插入器芯片上的光波导的平坦表面的硬停止。当插入器芯片被翻转并与第二芯片组装时，硬停止件抵靠第二芯片上的安装表面，使得插入器芯片上的光波导在垂直方向上与第二芯片上的光波导对准。

8. 发明授权

US11209678B2 Optoelectronic device 有权
公开(公告)号：US11209678B2
公开(公告)日：2021-12-28
申请号：US16281035
申请日：2019-02-20
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Dong Yoon Oh , Hooman Abediasl , Gerald Cois Byrd , Karlheinz Muth , Yi Zhang , Aaron John Zilkie
IPC分类号： G02F1/035 , G02F1/01 , G02F1/295 , G02B6/10 , G02F1/025 , G02F1/015
摘要： An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 μm away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.

9. 发明授权

US10877217B2 Copackaging of asic and silicon photonics 有权
公开(公告)号：US10877217B2
公开(公告)日：2020-12-29
申请号：US16505674
申请日：2019-07-08
申请人： ROCKLEY PHOTONICS LIMITED
发明人： Gerald Cois Byrd , David Arlo Nelson , Javid Messian , Thomas Pierre Schrans , Chia-Te Chou , Karlheinz Muth
IPC分类号： G02B6/122 , H01L31/02 , H01L33/62 , G02B6/12
CPC分类号： G02B6/122 , H01L31/02002 , H01L33/62 , G02B2006/12085 , G02B2006/12111
摘要： A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

10. 发明申请

US20200258791A1 MODE CONVERTER AND METHOD OF FABRICATING THEREOF 审中-公开
公开(公告)号：US20200258791A1
公开(公告)日：2020-08-13
申请号：US16865255
申请日：2020-05-01
申请人： ROCKLEY PHOTONICS LIMITED
发明人： John Drake , Damiana Lerose , Henri Nykänen , Gerald Cois Byrd
IPC分类号： H01L21/8238 , G02B6/30 , H01L21/8258 , G02B6/13 , G02B6/136 , G02B6/12
摘要： An optical fiber adapter and method of fabricating the same from a wafer including a double silicon-on-insulator layer structure. The optical fiber adapter may include a mode converter, a trench, and a V-groove, the V-groove and the trench operating as passive alignment features for an optical fiber, in the transverse translational and rotational degrees of freedom, and in the longitudinal translational degree of freedom, respectively. The mode converter may include a buried tapered waveguide.

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