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1. 发明申请

US20050161795A1 Room temperature metal direct bonding 有权
标题翻译：室温金属直接粘接
公开(公告)号：US20050161795A1
公开(公告)日：2005-07-28
申请号：US11085131
申请日：2005-03-22
申请人： Qin-Yi Tong , Paul Enquist , Anthony Rose
发明人： Qin-Yi Tong , Paul Enquist , Anthony Rose
IPC分类号： H01L21/60 , H01L21/98 , H01L23/02
CPC分类号： H01L21/76251 , B23K20/02 , H01L21/481 , H01L24/09 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/28 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/90 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13109 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/80801 , H01L2224/81011 , H01L2224/81013 , H01L2224/81014 , H01L2224/81136 , H01L2224/81143 , H01L2224/81193 , H01L2224/81208 , H01L2224/8121 , H01L2224/81801 , H01L2224/81815 , H01L2224/8183 , H01L2224/81894 , H01L2224/83095 , H01L2224/8319 , H01L2224/8334 , H01L2224/83801 , H01L2224/8383 , H01L2224/8384 , H01L2224/8385 , H01L2224/83894 , H01L2224/83895 , H01L2224/83907 , H01L2224/9202 , H01L2225/06513 , H01L2924/00013 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1532 , H01L2924/351 , Y10T29/49126 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/05644 , H01L2924/00014 , H01L2224/05664 , H01L2224/05669 , H01L2224/05124 , H01L2224/05147
摘要： A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
摘要翻译：一种粘结器件结构，包括具有第一组金属接合焊盘的第一衬底，优选地连接到器件或电路，并且具有与第一衬底上的金属焊盘相邻的第一非金属区域，第二衬底具有第二衬底一组金属接合焊盘与第一组金属焊盘对准，优选地连接到器件或电路，并且具有与第二衬底上的金属焊盘相邻的第二非金属区域，以及位于第二衬底之间的接触接合界面通过第一非金属区域与第二非金属区域的接触接合形成的第一和第二组金属接合焊盘。第一和第二基板中的至少一个可能弹性变形。

2. 发明申请

US20070232023A1 ROOM TEMPERATURE METAL DIRECT BONDING 有权
标题翻译：房间温度金属直接结合
公开(公告)号：US20070232023A1
公开(公告)日：2007-10-04
申请号：US11758386
申请日：2007-06-05
申请人： Qin-Yi Tong , Paul Enquist , Anthony Rose
发明人： Qin-Yi Tong , Paul Enquist , Anthony Rose
IPC分类号： H01L21/46
CPC分类号： H01L21/76251 , B23K20/02 , H01L21/481 , H01L24/09 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/28 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/90 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13109 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/80801 , H01L2224/81011 , H01L2224/81013 , H01L2224/81014 , H01L2224/81136 , H01L2224/81143 , H01L2224/81193 , H01L2224/81208 , H01L2224/8121 , H01L2224/81801 , H01L2224/81815 , H01L2224/8183 , H01L2224/81894 , H01L2224/83095 , H01L2224/8319 , H01L2224/8334 , H01L2224/83801 , H01L2224/8383 , H01L2224/8384 , H01L2224/8385 , H01L2224/83894 , H01L2224/83895 , H01L2224/83907 , H01L2224/9202 , H01L2225/06513 , H01L2924/00013 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1532 , H01L2924/351 , Y10T29/49126 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/05644 , H01L2924/00014 , H01L2224/05664 , H01L2224/05669 , H01L2224/05124 , H01L2224/05147
摘要： A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
摘要翻译：一种粘结器件结构，包括具有第一组金属接合焊盘的第一衬底，优选地连接到器件或电路，并且具有与第一衬底上的金属焊盘相邻的第一非金属区域，第二衬底具有第二衬底一组金属接合焊盘与第一组金属焊盘对准，优选地连接到器件或电路，并且具有与第二衬底上的金属焊盘相邻的第二非金属区域，以及位于第二衬底之间的接触接合界面通过第一非金属区域与第二非金属区域的接触接合形成的第一和第二组金属接合焊盘。第一和第二基板中的至少一个可能弹性变形。

3. 发明申请

US20080063878A1 Method for low temperature bonding and bonded structure 有权
公开(公告)号：US20080063878A1
公开(公告)日：2008-03-13
申请号：US11980415
申请日：2007-10-31
申请人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
发明人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
IPC分类号： H01L21/20 , B32B9/04
CPC分类号： H01L24/83 , H01L21/0206 , H01L21/2007 , H01L21/31105 , H01L21/31116 , H01L21/322 , H01L21/76251 , H01L24/26 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L27/085 , H01L29/06 , H01L29/16 , H01L2224/8301 , H01L2224/8303 , H01L2224/83031 , H01L2224/8309 , H01L2224/83099 , H01L2224/8319 , H01L2224/8385 , H01L2224/83894 , H01L2224/83896 , H01L2224/83948 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01084 , H01L2924/01093 , H01L2924/0132 , H01L2924/05442 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , Y10S148/012 , Y10S438/974 , Y10T156/10 , Y10T156/1043 , H01L2924/01014 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/3512 , H01L2924/00
摘要： A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

4. 发明申请

US20080053959A1 Method for low temperature bonding and bonded structure 有权
标题翻译：低温接合方法和接合结构
公开(公告)号：US20080053959A1
公开(公告)日：2008-03-06
申请号：US11980664
申请日：2007-10-31
申请人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
发明人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
IPC分类号： C23F1/00 , C03B29/00
CPC分类号： H01L24/83 , H01L21/0206 , H01L21/2007 , H01L21/31105 , H01L21/31116 , H01L21/322 , H01L21/76251 , H01L24/26 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L27/085 , H01L29/06 , H01L29/16 , H01L2224/8301 , H01L2224/8303 , H01L2224/83031 , H01L2224/8309 , H01L2224/83099 , H01L2224/8319 , H01L2224/8385 , H01L2224/83894 , H01L2224/83896 , H01L2224/83948 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01084 , H01L2924/01093 , H01L2924/0132 , H01L2924/05442 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , Y10S148/012 , Y10S438/974 , Y10T156/10 , Y10T156/1043 , H01L2924/01014 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/3512 , H01L2924/00
摘要： A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.
摘要翻译：在低温或室温下接合的方法包括通过清洗或蚀刻进行表面清洁和活化的步骤。一种蚀刻方法该方法还可以包括除去界面聚合的副产物，以防止反向聚合反应以允许诸如硅，氮化硅和SiO 2的材料的室温化学键合。要结合的表面被抛光到高度的平滑度和平坦度。 VSE可以使用反应离子蚀刻或湿蚀刻来稍微蚀刻被结合的表面。表面粗糙度和平面度不会降低，并且可以通过VSE工艺增强。蚀刻的表面可以在诸如氢氧化铵或氟化铵的溶液中冲洗以促进在表面上形成所需的粘结物质。

5. 发明申请

US20050079712A1 Method for low temperature bonding and bonded structure 有权
标题翻译：低温接合方法和接合结构
公开(公告)号：US20050079712A1
公开(公告)日：2005-04-14
申请号：US10913441
申请日：2004-08-09
申请人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
发明人： Qin-Yi Tong , Gaius Fountain , Paul Enquist
IPC分类号： H01L21/3065 , H01L21/02 , H01L21/20 , H01L21/58 , H01L21/30 , H01L21/302 , H01L21/46 , H01L21/461
CPC分类号： H01L24/83 , H01L21/0206 , H01L21/2007 , H01L21/31105 , H01L21/31116 , H01L21/322 , H01L21/76251 , H01L24/26 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L27/085 , H01L29/06 , H01L29/16 , H01L2224/8301 , H01L2224/8303 , H01L2224/83031 , H01L2224/8309 , H01L2224/83099 , H01L2224/8319 , H01L2224/8385 , H01L2224/83894 , H01L2224/83896 , H01L2224/83948 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01084 , H01L2924/01093 , H01L2924/0132 , H01L2924/05442 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , Y10S148/012 , Y10S438/974 , Y10T156/10 , Y10T156/1043 , H01L2924/01014 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/3512 , H01L2924/00
摘要： A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.
摘要翻译：在低温或室温下接合的方法包括通过清洗或蚀刻进行表面清洁和活化的步骤。一种蚀刻方法该方法还可以包括除去界面聚合的副产物以防止反向聚合反应，以允许诸如硅，氮化硅和SiO 2的材料的室温化学键合。要结合的表面被抛光到高度的平滑度和平坦度。 VSE可以使用反应离子蚀刻或湿蚀刻来稍微蚀刻被结合的表面。表面粗糙度和平面度不会降低，并且可以通过VSE工艺增强。蚀刻的表面可以在诸如氢氧化铵或氟化铵的溶液中冲洗以促进在表面上形成所需的粘结物质。

6. 发明申请

US20050009246A1 Wafer bonding hermetic encapsulation 有权
标题翻译：晶圆粘合气密封装
公开(公告)号：US20050009246A1
公开(公告)日：2005-01-13
申请号：US10913357
申请日：2004-08-09
申请人： Paul Enquist , Qin-Yi Tong , Gaius Fountain , Robert Markunas
发明人： Paul Enquist , Qin-Yi Tong , Gaius Fountain , Robert Markunas
IPC分类号： B81B7/00 , H01L21/50 , H01L23/10 , H01L21/44
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.
摘要翻译：一种用于提供电子设备的封装的方法，该电子设备获得构造成封闭电子设备的封装构件，准备用于非粘合剂直接接合的封装构件的表面，准备包括用于非粘合剂的电子设备的设备载体的表面直接结合，并将封装构件的制备表面粘合到装置载体的制备表面上以形成电子器件的封装。因此，包括具有包围电子设备的第一接合区域的器件载体的封装的电子器件包括具有至少一个防止接触电子器件与封装元件之间的防止接触的封装元件，并且具有第二接合区域装置载体的第一结合区域，并且包括在第一和第二接合区域之间形成的非粘合性直接结合，从而形成电子器件的封装。封装的电子器件可以是电子或光电器件。

7. 发明申请

US20070037379A1 3D IC method and device 有权
标题翻译： 3D IC方法和装置
公开(公告)号：US20070037379A1
公开(公告)日：2007-02-15
申请号：US11201321
申请日：2005-08-11
申请人： Paul Enquist , Gaius Fountain , Qin-Yi Tong
发明人： Paul Enquist , Gaius Fountain , Qin-Yi Tong
IPC分类号： H01L21/4763
CPC分类号： H01L21/76838 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L27/0688 , H01L2224/0401 , H01L2224/81121 , H01L2224/81201 , H01L2224/8123 , H01L2224/81801 , H01L2224/81894 , H01L2224/81931 , H01L2224/83894 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01055 , H01L2924/01059 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/19043 , H01L2924/3025 , H01L2224/81
摘要： A method of three-dimensionally integrating elements such as singulated die or wafers and an integrated structure having connected elements such as singulated dies or wafers. Either or both of the die and wafer may have semiconductor devices formed therein. A first element having a first contact structure is bonded to a second element having a second contact structure. First and second contact structures can be exposed at bonding and electrically interconnected as a result of the bonding. A via may be etched and filled after bonding to expose and form an electrical interconnect to interconnected first and second contact structures and provide electrical access to this interconnect from a surface. Alternatively, first and/or second contact structures are not exposed at bonding, and a via is etched and filled after bonding to electrically interconnect first and second contact structures and provide electrical access to interconnected first and second contact structure to a surface. Also, a device may be formed in a first substrate, the device being disposed in a device region of the first substrate and having a first contact structure. A via may be etched, or etched and filled, through the device region and into the first substrate before bonding and the first substrate thinned to expose the via, or filled via after bonding.
摘要翻译：三维集成元件如单片或晶片的方法以及具有诸如单模裸片或晶片的连接元件的集成结构。芯片和晶片中的任一个或两者可以具有形成在其中的半导体器件。具有第一接触结构的第一元件被结合到具有第二接触结构的第二元件。第一和第二接触结构可以在结合时暴露，并且由于接合而电连接。可以在接合之后蚀刻和填充通孔，以暴露并形成互连的第一和第二接触结构的电互连并提供从表面到该互连的电接入。或者，第一接触结构和/或第二接触结构在接合时不暴露，并且在接合之后蚀刻并填充通孔以将第一和第二接触结构电互连并且提供对互连的第一和第二接触结构到表面的电接触。此外，器件可以形成在第一衬底中，该器件设置在第一衬底的器件区域中并且具有第一接触结构。通孔可以在结合之前被蚀刻或蚀刻和填充穿过器件区域并进入第一衬底，并且第一衬底被稀释以暴露通孔，或者在结合之后填充通孔。

8. 发明授权

US08163373B2 Method of room temperature covalent bonding 有权
标题翻译：室温共价键的方法
公开(公告)号：US08163373B2
公开(公告)日：2012-04-24
申请号：US12954735
申请日：2010-11-26
申请人： Qin-Yi Tong
发明人： Qin-Yi Tong
IPC分类号： B32B18/00 , B32B33/00
CPC分类号： B32B7/04 , B32B2250/04 , B81C1/00357 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , H01L21/3105 , H01L21/76251 , H01L24/26 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/08059 , H01L2224/29186 , H01L2224/80896 , H01L2224/81894 , H01L2224/81895 , H01L2224/8319 , H01L2224/8385 , H01L2224/83894 , H01L2224/83896 , H01L2224/9202 , H01L2224/9212 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T428/24355 , Y10T428/24942 , Y10T428/31504 , Y10T428/31678 , H01L2924/3512 , H01L2924/00 , H01L2924/05442
摘要： A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH2 species. This may be accomplished by exposing the bonding layer to an NH4OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.
摘要翻译：接合方法包括使用具有氟化氧化物的接合层。可以通过暴露于含氟溶液，蒸汽或气体或通过注入将氟引入结合层。接合层也可以使用在其形成期间将氟引入层中的方法形成。接合层的表面用所需的物质，优选NH 2物质终止。这可以通过将结合层暴露于NH 4 OH溶液来实现。在室温下获得高粘结强度。该方法还可以包括将两个结合层结合在一起并产生在接合层之间的界面附近具有峰的氟分布。结合层之一可以包括彼此形成的两个氧化物层。氟浓度也可以在两个氧化物层之间的界面处具有第二个峰。

9. 发明申请

US20110041329A1 ROOM TEMPERATURE METAL DIRECT BONDING 有权
标题翻译：房间温度金属直接结合
公开(公告)号：US20110041329A1
公开(公告)日：2011-02-24
申请号：US12913385
申请日：2010-10-27
申请人： Qin-Yi Tong , Paul M. Enquist , Anthony Scot Rose
发明人： Qin-Yi Tong , Paul M. Enquist , Anthony Scot Rose
IPC分类号： H05K3/36
CPC分类号： H01L21/76251 , B23K20/02 , H01L21/481 , H01L24/09 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/28 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/90 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13109 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/80801 , H01L2224/81011 , H01L2224/81013 , H01L2224/81014 , H01L2224/81136 , H01L2224/81143 , H01L2224/81193 , H01L2224/81208 , H01L2224/8121 , H01L2224/81801 , H01L2224/81815 , H01L2224/8183 , H01L2224/81894 , H01L2224/83095 , H01L2224/8319 , H01L2224/8334 , H01L2224/83801 , H01L2224/8383 , H01L2224/8384 , H01L2224/8385 , H01L2224/83894 , H01L2224/83895 , H01L2224/83907 , H01L2224/9202 , H01L2225/06513 , H01L2924/00013 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1532 , H01L2924/351 , Y10T29/49126 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/05644 , H01L2924/00014 , H01L2224/05664 , H01L2224/05669 , H01L2224/05124 , H01L2224/05147
摘要： A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
摘要翻译：一种粘结器件结构，包括具有第一组金属接合焊盘的第一衬底，优选地连接到器件或电路，并且具有与第一衬底上的金属焊盘相邻的第一非金属区域，第二衬底具有第二衬底一组金属接合焊盘与第一组金属焊盘对准，优选地连接到器件或电路，并且具有与第二衬底上的金属焊盘相邻的第二非金属区域，以及位于第二衬底之间的接触接合界面通过第一非金属区域与第二非金属区域的接触接合形成的第一和第二组金属接合焊盘。第一和第二基板中的至少一个可能弹性变形。

10. 发明授权

US07622324B2 Wafer bonding hermetic encapsulation 有权
标题翻译：晶圆粘合气密封装
公开(公告)号：US07622324B2
公开(公告)日：2009-11-24
申请号：US10913357
申请日：2004-08-09
申请人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
发明人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.
摘要翻译：一种用于提供电子设备的封装的方法，该电子设备获得构造成封闭电子设备的封装构件，准备用于非粘合剂直接接合的封装构件的表面，准备包括用于非粘合剂的电子设备的设备载体的表面直接结合，并将封装构件的制备表面粘合到装置载体的制备表面上以形成电子器件的封装。因此，包括具有包围电子设备的第一接合区域的器件载体的封装的电子器件包括具有至少一个防止接触电子器件与封装元件之间的防止接触的封装元件，并且具有第二接合区域装置载体的第一结合区域，并且包括在第一和第二接合区域之间形成的非粘合性直接结合，从而形成电子器件的封装。封装的电子器件可以是电子或光电器件。

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