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    • 3. 发明授权
    • Power semiconductor component and process for its manufacture
    • 功率半导体元件及其制造工艺
    • US4596999A
    • 1986-06-24
    • US592280
    • 1984-03-22
    • Jens GobrechtPeter RoggwillerRoland SittigJan Voboril
    • Jens GobrechtPeter RoggwillerRoland SittigJan Voboril
    • H01L29/74H01L29/739H01L29/744H01L29/80H01L29/06
    • H01L29/744H01L29/7392
    • A power semiconductor component having a component of this type is presented which has at least three consecutive layers and possessing a high current capacity and small power losses. For contacting the first two layers, the component has first and second metallized contact planes, which impress a step-like structure onto a first surface of the component. The steps have a height of between 10 and 20 .mu.m and a width of between 20 and 300 .mu.m. The ratio between the surface area of the first contact plane and the surface area of the second contact plane is between 1 and 4. The first layer is heavily doped and has a maximum thickness of 8 .mu.m, and the second layer is lightly doped and has a maximum thickness of 40 .mu.m. The invention further includes a process for manufacturing the component, wherein the surface structure according to the invention is produced essentially by a reactive ion-etching process with a single aluminum mask.
    • 提出了具有这种类型的部件的功率半导体部件,其具有至少三个连续的层并且具有高电流容量和小的功率损耗。 为了接触前两层,该部件具有第一和第二金属化接触平面,其将阶梯状结构压印在部件的第一表面上。 这些台阶的高度在10到20微米之间,宽度在20到300微米之间。 第一接触面的表面积和第二接触面的表面积之间的比率在1和4之间。第一层是重掺杂的,最大厚度为8μm,第二层是轻掺杂的, 最大厚度为40亩。 本发明还包括一种制造该部件的方法,其中根据本发明的表面结构基本上由具有单个铝掩模的反应离子蚀刻工艺制备。
    • 6. 发明授权
    • Semiconductor device having a blocking capability in only one direction
    • 具有在一个方向上具有阻挡能力的半导体器件
    • US4642669A
    • 1987-02-10
    • US679359
    • 1984-12-07
    • Peter RoggwillerRoland Sittig
    • Peter RoggwillerRoland Sittig
    • H01L29/06H01L29/36H01L29/74H01L29/861H01L29/34
    • H01L29/36H01L29/0661H01L29/7432H01L29/861
    • For improving the dynamic characteristics of semiconductor components required to absorb high reverse voltages only in one polarity (diodes, reverse-conducting thyristors and asymmetric thyristors), in many cases structures having an n base consisting of two layers are used. In order to improve the reverse-voltage capability, it is proposed, in a semiconductor component having at least one pn.sup.- n sequence of layers, to select the thickness (S) and the doping of an n stop layer (4) in such a way that the following applies: ##EQU1## where e=elementary charge, .epsilon.=dielectric constant of the semiconductor, N.sub.D =donor concentration, X=path coordinate, 0.8.ltoreq.k.ltoreq.1.0 and E.sub.n =field strength at the n.sup.- n junction. The effect of this measure is that the geometric conditions of the edge chamfering are less stringent. The edge can also be shaped by means of conventional etching processes.
    • 为了改善仅在一个极性(二极管,反向导通晶闸管和不对称晶闸管)吸收高反向电压所需的半导体元件的动态特性,在许多情况下使用具有由两层组成的n基极的结构。 为了提高反向电压能力,提出在具有至少一个pn-n层序列的半导体部件中,选择厚度(S)和n停止层(4)的掺杂 以下适用的方式:其中e =基本电荷,ε=半导体的介电常数,ND =供体浓度,X =路径坐标,0.8
    • 7. 发明授权
    • PN-junction with guard ring
    • PN-JUNCTION WITH GUARD RING
    • US5093693A
    • 1992-03-03
    • US647207
    • 1991-01-28
    • Christian C. AbbasPeter RoggwillerJan Voboril
    • Christian C. AbbasPeter RoggwillerJan Voboril
    • H01L29/744H01L21/266H01L21/329H01L29/06H01L29/74H01L29/749H01L29/861
    • H01L29/0615H01L21/266H01L29/0619H01L29/8611
    • In a semiconductor component, a pn junction which emerges at a main surface (2) of a semiconductor substrate (1) at the edge of a highly doped zone (3) is formed by a laterally bounded, highly doped zone (3) extending inwards from a main surface (2) of the semiconductor substrate (1) and by a lightly doped zone surrounding the highly doped zone. The edge of the highly doped zone (3) is formed by a guard zone (6b) whose doping density gradually decreases in a direction parallel to the main surface (2) from the highly doped zone (3) towards the pn junction. Any surface breakdown of the pn junction is prevented by the fact that the guard zone (6b) has a maximum penetration depth near the highly doped zone (3) and that the maximum penetration depth of the guard zone (6b) is greater than the penetration depth of the adjacent highly doped zone (3). The guard zone (6b) has a maximum doping density which does not appreciably exceed 10.sup.15 cm.sup.-3, a width which is comparable with a thickness of the slightly doped zone and a maximum penetration depth which is between 40 .mu.m and 80 .mu.m. The doping density of the guard zone (6b) decreases approximately linearly or stepwise in a direction parallel to the main surface (2).
    • 在半导体部件中,在高掺杂区域(3)的边缘处出现在半导体衬底(1)的主表面(2)处的pn结通过向内延伸的横向有界的高掺杂区域(3)形成 从半导体衬底(1)的主表面(2)和围绕高掺杂区的轻掺杂区域。 高掺杂区域(3)的边缘由保护区(6b)形成,其保护区(6b)的掺杂密度在从高掺杂区(3)朝向pn结平行于主表面(2)的方向上逐渐减小。 由于保护区(6b)在高掺杂区(3)附近具有最大穿透深度,并且防护区(6b)的最大穿透深度大于穿透深度的事实,防止了pn结的任何表面击穿 相邻的高掺杂区(3)的深度。 保护区(6b)具有不超过1015cm-3的最大掺杂密度,与稍微掺杂区的厚度相当的宽度和介于40μm到80μm之间的最大穿透深度。 保护区(6b)的掺杂密度在平行于主表面(2)的方向上大致直线或逐步地减小。
    • 9. 发明授权
    • Gate turn-off thyristor and method of producing same
    • 闸极截流晶闸管及其制造方法
    • US4910573A
    • 1990-03-20
    • US177489
    • 1988-04-04
    • Peter Roggwiller
    • Peter Roggwiller
    • H01L29/08H01L29/36H01L29/74H01L29/744
    • H01L29/744H01L29/0839H01L29/36
    • A gate turn-off thyristor (GTO) having a semi-conductor substrate (1) with at least one p-conducting anode layer (4), one n-type base layer (6), one p-type base layer (7) which is in electrical contact with a gate, and one n-conducting cathode layer (8) has a cathode layer (8) with a highly doped zone (10) acting as n.sup.+ emitter and a lightly doped zone (9). The highly doped zone (10) adjoins the surface of the semi-conductor substrate (1) and has a doping density which is at least an order of magnitude higher than that of the p-type base layer (7). The lightly doped zone (9) is situated between a pn junction J.sub.1, produced by the p-type base layer (7) and the cathode layer (8), and the highly doped zone (10) of the cathode layer (8). In a preferred embodiment of the invention, the highly doped zone (10) is so structured that the lightly doped zone (9) extends, in a GTO with mesa structure, from the pn junction J.sub.1 to the surface of the semi-conductor substrate (1) in a central strip (5) of the cathode fingers (2). A method for producing GTO's according to the invention is furthermore specified.
    • 一种具有至少一个p导电阳极层(4),一个n型基极层(6),一个p型基极层(7)的半导体衬底(1)的栅极截止晶闸管(GTO) 其与栅极电接触,并且一个n导电阴极层(8)具有阴极层(8),其具有用作n +发射极的高掺杂区(10)和轻掺杂区(9)。 高掺杂区域(10)与半导体衬底(1)的表面相邻并且具有比p型基底层(7)的掺杂密度高至少一个数量级的掺杂密度。 轻掺杂区域(9)位于由p型基极层(7)和阴极层(8)产生的pn结J1和阴极层(8)的高掺杂区域(10)之间。 在本发明的优选实施例中,高掺杂区(10)的结构使得轻掺杂区(9)在具有台面结构的GTO中从pn结J1延伸到半导体衬底的表面 1)在阴极指(2)的中心条(5)中。 进一步说明本发明的GTO的制造方法。