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    • 1. 发明授权
    • Optoelectronic package having a transmission line between electrical components and optical components
    • 具有在电气部件和光学部件之间的传输线的光电封装
    • US07076123B2
    • 2006-07-11
    • US10209337
    • 2002-07-30
    • Peter E. KirkpatrickJean-Marc VerdiellCraig SchulzMarc EpitauxRickie C. Lake
    • Peter E. KirkpatrickJean-Marc VerdiellCraig SchulzMarc EpitauxRickie C. Lake
    • G02B6/12
    • G02B6/4201
    • Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.
    • 这里描述的是可以具有宽带宽射频(例如,9kHz和300GHz)接口之间的密封光纤封装,并且多层衬底提供了一个集成各种部件的平台,例如具有电子部件的集成电路, 光电子元件或光学元件。 在一个实施例中,衬底具有宽带宽可表面安装的接口,其可以是允许电信号从封装的外部传递到内部的单端或差分。 封装的内部包含一个“提升管”,用于将电信号从基板的平面带到靠近光轴的平面上。 该提升管包括实现高度变化的传输线。 传输线可以是单端或差分。 封装内还有一个“底座”,可以集成电/光/电光元件。