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    • 3. 发明申请
    • Thin-film transistor with vertical channel region
    • 具有垂直沟道区域的薄膜晶体管
    • US20060049461A1
    • 2006-03-09
    • US11261194
    • 2005-10-28
    • Paul SchueleApostolos Voutsas
    • Paul SchueleApostolos Voutsas
    • H01L27/12H01L21/84
    • H01L27/12H01L29/78624H01L29/78642H01L29/78648H01L29/78675
    • A vertical thin-film transistor (V-TFT) is provided along with a method for forming the V-TFT. The method comprises: providing a substrate made from a material such as Si, quartz, glass, or plastic; conformally depositing an insulating layer overlying the substrate; forming a gate, having sidewalls and a thickness, overlying a substrate insulation layer; forming a gate oxide layer overlying the gate sidewalls, and a gate insulation layer overlying the gate top surface; etching the exposed substrate insulation layer; forming a first source/drain region overlying the gate insulation layer; forming a second source/drain region overlying the substrate insulation layer, adjacent a first gate sidewall; and, forming a channel region overlying the first gate sidewall with a channel length about equal to the thickness of the gate, interposed between the first and second source/drain regions.
    • 提供垂直薄膜晶体管(V-TFT)以及用于形成V-TFT的方法。 该方法包括:提供由诸如Si,石英,玻璃或塑料的材料制成的衬底; 保形地沉积覆盖衬底的绝缘层; 形成具有覆盖衬底绝缘层的侧壁和厚度的栅极; 形成覆盖所述栅极侧壁的栅极氧化层,以及覆盖所述栅极顶表面的栅极绝缘层; 蚀刻暴露的基板绝缘层; 形成覆盖所述栅极绝缘层的第一源极/漏极区域; 在第一栅极侧壁附近形成覆盖衬底绝缘层的第二源极/漏极区域; 并且在第一和第二源极/漏极区域之间形成沟槽区域,该沟道区域覆盖具有大约等于栅极厚度的沟道长度的第一栅极侧壁。
    • 5. 发明申请
    • Digital-to-time converter
    • 数字时间转换器
    • US20070222493A1
    • 2007-09-27
    • US11439410
    • 2006-05-23
    • Themistokles AfentakisApostolos VoutsasPaul Schuele
    • Themistokles AfentakisApostolos VoutsasPaul Schuele
    • H03H11/26
    • H03K5/133H03K2005/00039H03K2005/00058
    • A digital-to-time converter (DTC) is provided, made from a plurality of series-connected cells. Each cell has an input interface to accept a signal, a control interface to accept a digital command, a delayed signal path, a minimum delay signal path, and an output interface. The signal path is selected in response to the command. The time delay associated with the delayed signal path of each cell can be varied, so that the plurality of series-connected cells is able to provide a large range of delay combinations. For example, if there are n series-connected cells, then the jth series-connected cell, where j varies from 1 to n, conducts the signal through 2j MOS gates in the delayed signal path. Assuming a digital control word with n bit places, the jth series-connected cell accepts the jth bit place of the control word to select a delay path.
    • 提供了由多个串联连接的单元制成的数字 - 时间转换器(DTC)。 每个单元具有接收信号的输入接口,接受数字命令的控制接口,延迟信号路径,最小延迟信号路径和输出接口。 响应命令选择信号路径。 可以改变与每个单元的延迟信号路径相关联的时间延迟,使得多个串联单元能够提供大范围的延迟组合。 例如,如果存在n个串联连接的单元,那么其中j从1变化到n的第j个串联单元通过延迟信号路径中的2个MOS栅极传导信号。 假设具有n位位置的数字控制字,第j个串联单元接受控制字的第j位,以选择延迟路径。
    • 6. 发明申请
    • Dual-gate thin-film transistor
    • 双栅极薄膜晶体管
    • US20060068532A1
    • 2006-03-30
    • US10953913
    • 2004-09-28
    • Paul SchueleApostolos Voutsas
    • Paul SchueleApostolos Voutsas
    • H01L21/84
    • G09G3/20G09G3/3208G09G3/3659G09G2300/08G09G2310/0262H01L29/78648
    • A dual-gate thin film transistor (DG-TFT) and associated fabrication method are provided. The method comprises: forming a first (back) gate in a first horizontal plane; forming source/drain (S/D) regions and an intervening channel region in a second horizontal plane, overlying the first plane; and, forming a second (top) gate in a third horizontal plane, overlying the second plane. The S/D regions and intervening channel region have a combined length, smaller than the length of the first gate. A substrate insulating layer is formed over the substrate, made from a material such as SiO2. A first gate insulation layer is formed over the first gate. Amorphous silicon (a-Si) is deposited over the first gate insulation layer and crystallized. The S/D and channel regions are formed from the crystallized Si layer. A second gate oxide layer is formed over the channel region.
    • 提供了双栅极薄膜晶体管(DG-TFT)和相关制造方法。 该方法包括:在第一水平面中形成第一(后)栅极; 在第一平面上形成源极/漏极(S / D)区域和在第二水平面中的中间沟道区域; 并且在第三水平面上形成覆盖第二平面的第二(顶部)门。 S / D区域和中间沟道区域具有小于第一栅极的长度的组合长度。 在衬底上形成衬底绝缘层,由诸如SiO 2的材料制成。 在第一栅极上形成第一栅极绝缘层。 非晶硅(a-Si)沉积在第一栅绝缘层上并结晶。 S / D和沟道区域由结晶的Si层形成。 在沟道区上形成第二栅氧化层。
    • 7. 发明申请
    • Adjacent planar and non-planar thin-film transistor
    • 相邻的平面和非平面薄膜晶体管
    • US20070228471A1
    • 2007-10-04
    • US11807075
    • 2007-05-25
    • Paul SchueleApostolos Voutsas
    • Paul SchueleApostolos Voutsas
    • H01L27/12
    • H01L27/12H01L29/78624H01L29/78642H01L29/78648H01L29/78675
    • A method is provided for concurrently forming MP-TFTs and P-TFTs. Generally, the method comprises: forming a P-TFT having source/drain (S/D) regions, an intervening channel region, and a gate, all in a first horizontal plane; and simultaneously forming a MP-TFT having a first gate in the first horizontal plane and at least one S/D region in a second horizontal plane, overlying the first horizontal plane. The vertical TFT (V-TFT) is an MP-TFT having vertical first gate sidewalls and a vertical channel region overlying a gate sidewall. The dual-gate TFT (DG-TFT) is an MP-TFT having a bottom gate, first and second S/D regions with top surfaces, an intervening channel region with a top surface, and a second, top gate with a bottom surface, all in a second horizontal plane, overlying the first horizontal plane.
    • 提供了用于同时形成MP-TFT和P-TFT的方法。 通常,该方法包括:在第一水平面中形成具有源极/漏极(S / D)区域,中间沟道区域和栅极的P-TFT; 同时在第一水平面上形成具有第一栅极的MP-TFT和位于第一水平面上的第二水平面中的至少一个S / D区域。 垂直TFT(V-TFT)是具有垂直的第一栅极侧壁和覆盖栅极侧壁的垂直沟道区的MP-TFT。 双栅极TFT(DG-TFT)是具有底栅,具有顶表面的第一和第二S / D区,具有顶表面的中间沟道区和具有底表面的第二顶栅的MP-TFT 都在第二个水平面上,覆盖着第一个水平面。
    • 8. 发明申请
    • Sidewall gate thin-film transistor
    • 侧壁栅极薄膜晶体管
    • US20060246637A1
    • 2006-11-02
    • US11479221
    • 2006-06-30
    • Apostolos VoutsasPaul Schuele
    • Apostolos VoutsasPaul Schuele
    • H01L21/84H01L21/00
    • H01L27/1251H01L27/1214H01L29/6675H01L29/78642
    • A sidewall gate thin-film transistor (TFT) and associated fabrication method are provided. The method provides a substrate with a surface and forms a surface-normal feature. The surface-normal feature is normal with respect to the substrate surface, with a sidewall made from an electrical insulator. An active silicon (Si) layer is formed overlying the surface-normal feature, with a channel overlying the surface-normal feature sidewall. A gate insulator overlies the channel, and a sidewall gate overlies the gate insulator. More specifically, the gate insulator is formed from conformally depositing an electrical insulator layer overlying the active Si layer. The gate electrode layer is conformally deposited overlying the gate insulator layer and anisotropically etched, leaving a gate electrode sidewall adjacent to the gate insulator layer overlying the channel.
    • 提供了侧壁栅极薄膜晶体管(TFT)和相关的制造方法。 该方法提供具有表面的基底并形成表面法线特征。 表面法线特征相对于基底表面是正常的,具有由电绝缘体制成的侧壁。 形成覆盖表面法线特征的活性硅(Si)层,覆盖表面法线特征侧壁的沟道。 栅极绝缘体覆盖沟道,并且侧壁栅极覆盖栅极绝缘体。 更具体地说,栅极绝缘体通过共形沉积覆盖有源Si层的电绝缘体层形成。 栅极电极层被共形沉积在栅极绝缘体层上并各向异性蚀刻,留下与栅极绝缘体层相邻的栅电极侧壁。
    • 10. 发明申请
    • Simultaneous planar and non-planar thin-film transistor processes
    • 同时平面和非平面薄膜晶体管工艺
    • US20050239238A1
    • 2005-10-27
    • US10985587
    • 2004-11-09
    • Paul SchueleApostolos Voutsas
    • Paul SchueleApostolos Voutsas
    • H01L29/10H01L29/76H01L29/786
    • H01L27/12H01L29/78624H01L29/78642H01L29/78648H01L29/78675
    • A method is provided for concurrently forming MP-TFTs and P-TFTs. Generally, the method comprises: forming a P-TFT having source/drain (S/D) regions, an intervening channel region, and a gate, all in a first horizontal plane; and simultaneously forming a MP-TFT having a first gate in the first horizontal plane and at least one S/D region in a second horizontal plane, overlying the first horizontal plane. The vertical TFT (V-TFT) is an MP-TFT having vertical first gate sidewalls and a vertical channel region overlying a gate sidewall. The dual-gate TFT (DG-TFT) is an MP-TFT having a bottom gate, first and second S/D regions with top surfaces, an intervening channel region with a top surface, and a second, top gate with a bottom surface, all in a second horizontal plane, overlying the first horizontal plane.
    • 提供了用于同时形成MP-TFT和P-TFT的方法。 通常,该方法包括:在第一水平面中形成具有源极/漏极(S / D)区域,中间沟道区域和栅极的P-TFT; 同时在第一水平面上形成具有第一栅极的MP-TFT和位于第一水平面上的第二水平面中的至少一个S / D区域。 垂直TFT(V-TFT)是具有垂直的第一栅极侧壁和覆盖栅极侧壁的垂直沟道区的MP-TFT。 双栅极TFT(DG-TFT)是具有底栅,具有顶表面的第一和第二S / D区,具有顶表面的中间沟道区和具有底表面的第二顶栅的MP-TFT 都在第二个水平面上,覆盖着第一个水平面。