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    • 1. 发明申请
    • ELECTRONIC APPARATUS
    • 电子设备
    • US20140285074A1
    • 2014-09-25
    • US13933955
    • 2013-07-02
    • Panasonic Corporation
    • Takeshi MORI
    • H05K7/18H05K5/06
    • H05K7/18G06F1/16G06F1/1616H05K5/06
    • The frame 6 includes a top frame 6a, a reverse frame 6b, a right frame 6c, a left frame 6d, a front frame 6e, and a rear frame 6f which are separate components. The left frame 6d is moved in the direction of an arrow C to the front frame 6e and the rear frame 6f. Ribs provided at both end portions of the left frame 6d are inserted into ribs provided at end portions of the front frame 6e and the rear frame 6f. Similarly, the right frame 6c is also moved, and ribs are inserted into each other. In this manner, the four side frames are assembled. Then, the top frame 6a and the reverse frame 6b are assembled thereto. Since the ribs are inserted into each other as described above, the frame 6 is easily assembled and has excellent robustness.
    • 框架6包括作为分离部件的顶框架6a,反向框架6b,右框架6c,左框架6d,前框架6e和后框架6f。 左框架6d沿箭头C的方向移动到前框架6e和后框架6f。 设置在左框架6d的两端部的肋插入到设置在前框架6e和后框架6f的端部处的肋中。 类似地,右框架6c也被移动,并且将肋互相插入。 以这种方式,组装四个侧框架。 然后,顶部框架6a和反向框架6b组装在其上。 由于如上所述将肋插入到彼此中,所以框架6容易组装并且具有优异的鲁棒性。
    • 2. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20140055923A1
    • 2014-02-27
    • US13765457
    • 2013-02-12
    • PANASONIC CORPORATION
    • Takeshi MORIAkira IWAMOTOHitoshi NAKATANIShun SHIMAZAKI
    • H05K5/02H05K5/00
    • H05K5/0226G06F1/1616G06F1/162G06F1/1637G06F1/1681H05K5/0017
    • An electronic device 100 includes: a first casing 101; a second casing 102; a hinge mechanism 120 having an opening and closing axial-component 126 and an inverting axial-component 128; and a support assisting section 150. The support assisting section 150 includes: an axial-component 141 on an extended line of the opening and closing axial-component 126 in a normally opened position; and an axial-component receiving section 151 that supports the axial-component 141 on a wall surface of a recess 156 in the normally opened position. The recess 156 is open on at least one of a front side and a rear side in the axial-component receiving section 151. The second casing 102 is rotated about the inverting axial-component 128, and the axial-component 141 is moved into or out of the recess 156 through the side on which the recess 156 is open.
    • 电子设备100包括:第一壳体101; 第二壳体102; 具有开闭轴向部件126和反转轴向部件128的铰链机构120; 支撑辅助部分150包括:在处于常开位置的开闭轴向部件126的延伸线上的轴向部件141; 以及将轴向部件141支撑在常开位置的凹部156的壁面上的轴向部件容纳部151。 凹部156在轴向部件容纳部151中的前侧和后侧中的至少一个上敞开。第二壳体102围绕相反的轴向部件128旋转,并且轴向部件141移动到 从凹部156穿过凹部156打开的一侧。
    • 3. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20140055922A1
    • 2014-02-27
    • US13765450
    • 2013-02-12
    • PANASONIC CORPORATION
    • Takeshi MORIHitoshi NAKATANIShun SHIMAZAKIYuichiro TACHIBANAShuji YASUOKA
    • H05K5/02H05K5/00
    • H05K5/0217G06F1/162H05K5/0017
    • An electronic device 100 includes: a first casing 101; a second casing 102 that is connected to the first casing 101, and that has a display 103; a projecting component 152 that projects from a top side surface 101a of the first casing 101, and is positioned on the top side surface 101a of the first casing 101 at such a position as to abut against the display 103 when the electronic device 100 is closed; and a movable support section 170 configured to support the projecting component 152 so as to allow the projecting component 152 to move relative to the first casing 101 such that an amount of projection of the projecting component 152 from the top side surface 101a of the first casing 101 is reduced when the projecting component 152 is pushed by the display 103 in the case of the electronic device 100 being closed.
    • 电子设备100包括:第一壳体101; 连接到第一壳体101并具有显示器103的第二壳体102; 突出部件152,其从第一壳体101的顶侧表面101a突出,并且在电子设备100关闭时位于第一壳体101的顶侧表面101a的位置,以抵靠显示器103 ; 以及可移动支撑部170,其构造成支撑突出部件152,以允许突出部件152相对于第一壳体101移动,使得突出部件152从第一壳体的顶侧表面101a突出的量 在电子设备100关闭的情况下,当突出部件152被显示器103按下时,101被减小。
    • 8. 发明申请
    • ELECTRONIC APPARATUS AND BUFFER MATERIAL
    • 电子设备和缓冲材料
    • US20140063727A1
    • 2014-03-06
    • US13779243
    • 2013-02-27
    • PANASONIC CORPORATION
    • Akira IWAMOTOHitoshi NAKATANITakeshi MORIShun SHIMAZAKITakahiro TABATA
    • G11B33/08F16F13/04
    • G11B33/08F16F3/093F16F13/04F16F15/08F16F2228/14F16F2230/007
    • Mounted between bottom and top surfaces of a case are: second buffer materials and first buffer materials brought in surface contact with a bottom surface of a hard disk drive (HDD) via an insulating member, and upper buffer materials brought in surface contact with the opposite side of the HDD via the insulating member. When impact F2 is applied to the HDD, the second buffer materials contract from a thickness of T0 to T2, and the first buffer materials buckle. Buckling parts of the first buffer materials buckle when the second buffer materials contract to thickness T2, and can achieve impact-lessening independently from the second buffer materials. The second buffer materials contract singly from T0 to equal T1 to or more than T2, whereas the first buffer materials and second buffer materials both act at thickness T2 or beyond. Therefore, impact-lessening can be achieved in a broad range.
    • 安装在壳体的底表面和顶表面之间的是:第二缓冲材料和第一缓冲材料经由绝缘构件与硬盘驱动器(HDD)的底表面接触,并且上缓冲材料与相对的表面接触 通过绝缘构件的HDD侧。 当对HDD施加冲击F2时,第二缓冲材料从T0到T2的厚度收缩,并且第一缓冲材料扣紧。 第一缓冲材料的屈曲部分当第二缓冲材料承载到厚度T2时扣紧,并可以独立于第二缓冲材料实现冲击减轻。 第二缓冲材料从T0单独地合并为T1等于或大于T2,而第一缓冲材料和第二缓冲材料均以T2或更高的厚度起作用。 因此,可以在广泛的范围内实现减震。