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    • 1. 发明授权
    • Electric induction heating, melting and stirring of materials non-electrically conductive in the solid state
    • 电感应加热,熔融和搅拌的材料在固态下不导电
    • US09370049B2
    • 2016-06-14
    • US11942341
    • 2007-11-19
    • Oleg S. FishmanJohn H. MortimerSatyen N. PrabhuMike Maochang Cao
    • Oleg S. FishmanJohn H. MortimerSatyen N. PrabhuMike Maochang Cao
    • H05B6/44H05B6/06H05B6/22
    • H05B6/067H05B2213/02
    • An apparatus and process are provided for controlling the heating and melting of a material that is non-electrically conductive in the solid state and is electrically conductive in the non-solid state. Power is selectively directed between coil sections surrounding different zones of the material in a susceptor vessel by changing the output frequency of the power supply to the coil sections. Coil sections are at least one active coil section, which is connected to the output of the power supply, and at least one passive coil section, which is not connected to the power supply, but is connected in parallel with a tuning capacitor so that the at least one passive coil section can be selectively operated at, or near, resonant frequency when the transition material in the vessel is molten. Depending upon the state of the transition material in the susceptor vessel, the frequency of the power applied to the active coil section can be changed to generate a magnetic field that selectively couples with the susceptor vessel, transition material in the vessel, and/or the passive coil section.
    • 提供了一种装置和方法,用于控制在固态中非导电材料的加热和熔化,并且在非固态状态下导电。 通过将电源的输出频率改变为线圈段,功率被选择性地引向绕在基座容器中的材料的不同区域的线圈段之间。 线圈部分是至少一个有源线圈部分,其连接到电源的输出端,以及至少一个无源线圈部分,其不连接到电源,但是与调谐电容器并联连接, 当容器中的过渡材料熔化时,至少一个无源线圈部分可以选择性地在共振频率处或接近谐振频率操作。 根据感受体容器中的过渡材料的状态,施加到有源线圈段的功率的频率可以改变,以产生选择性地与基座容器耦合的磁场,容器中的过渡材料和/或 无源线圈段。
    • 3. 发明授权
    • Compression clamping of semiconductor components
    • 半导体元件的压缩钳位
    • US08134835B2
    • 2012-03-13
    • US12019066
    • 2008-01-24
    • Oleg S. FishmanSatyen N. Prabhu
    • Oleg S. FishmanSatyen N. Prabhu
    • H05K7/20H01L23/02
    • H01L24/72H01L2924/01013H01L2924/01033H01L2924/01082H01L2924/13034Y10T24/44974Y10T29/41H01L2924/00
    • The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods. Upon final assembly of the clamping device the desired pressure force is achieved across the semiconductor devices and components by compression of the opposing jaws between the one or more semiconductor devices and associated semiconductor components until the clamp pressure indicator elements associated with each of the clamp pressure set point assemblies indicates the desired compression force has been applied.
    • 本发明涉及一种夹紧装置,用于通过平均分布在装置和相关部件的相对表面上的期望的压缩力来压缩夹持一个或多个半导体器件和相关联的半导体部件。 半导体器件和部件位于通过至少两个拉杆连接在一起的相对的夹爪之间,该拉杆压缩地加载相对的夹爪以向半导体器件和部件施加所需的压缩力。 所需的压缩力首先在独立夹紧压力设定点组件和第一钳口之间的均匀分布中实现,其中每个独立的夹紧压力设定点组件与一个拉杆相关联。 在夹紧装置的最终组装之后,通过在一个或多个半导体器件和相关联的半导体部件之间压缩相对的钳口,跨越半导体器件和部件实现期望的压力,直到夹紧压力指示器元件与每个夹紧压力组 点组件表示已经应用了所需的压缩力。
    • 6. 发明申请
    • COMPRESSION CLAMPING OF SEMICONDUCTOR COMPONENTS
    • 半导体元件的压缩钳位
    • US20080211157A1
    • 2008-09-04
    • US12019066
    • 2008-01-24
    • Oleg S. FishmanSatyen N. Prabhu
    • Oleg S. FishmanSatyen N. Prabhu
    • B25B1/06
    • H01L24/72H01L2924/01013H01L2924/01033H01L2924/01082H01L2924/13034Y10T24/44974Y10T29/41H01L2924/00
    • The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods. Upon final assembly of the clamping device the desired pressure force is achieved across the semiconductor devices and components by compression of the opposing jaws between the one or more semiconductor devices and associated semiconductor components until the clamp pressure indicator elements associated with each of the clamp pressure set point assemblies indicates the desired compression force has been applied.
    • 本发明涉及一种夹紧装置,用于通过平均分布在装置和相关部件的相对表面上的期望的压缩力来压缩夹持一个或多个半导体器件和相关联的半导体部件。 半导体器件和部件位于通过至少两个拉杆连接在一起的相对的夹爪之间,该拉杆压缩地加载相对的夹爪以向半导体器件和部件施加所需的压缩力。 所需的压缩力首先在独立夹紧压力设定点组件和第一钳口之间的均匀分布中实现,其中每个独立的夹紧压力设定点组件与一个拉杆相关联。 在夹紧装置的最终组装之后,通过在一个或多个半导体器件和相关联的半导体部件之间压缩相对的钳口,跨越半导体器件和部件实现期望的压力,直到夹紧压力指示器元件与每个夹紧压力组 点组件表示已经应用了所需的压缩力。