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1. 外观设计

USD671369S1 Plate 有权
标题翻译：盘子
公开(公告)号：USD671369S1
公开(公告)日：2012-11-27
申请号：US29407940
申请日：2011-12-05
申请人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno
设计人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno

2. 外观设计

USD667696S1 Plate 有权
公开(公告)号：USD667696S1
公开(公告)日：2012-09-25
申请号：US29407944
申请日：2011-12-05
申请人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno
设计人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno

3. 外观设计

USD668117S1 Plate 有权
公开(公告)号：USD668117S1
公开(公告)日：2012-10-02
申请号：US29407941
申请日：2011-12-05
申请人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno
设计人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno

4. 外观设计

USD667695S1 Plate 有权
公开(公告)号：USD667695S1
公开(公告)日：2012-09-25
申请号：US29407938
申请日：2011-12-05
申请人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno
设计人： Nobutaka Shimizu , Koji Hanya , Ryoichi Kanno

5. 发明授权

US08932700B2 Panel 有权
标题翻译：面板
公开(公告)号：US08932700B2
公开(公告)日：2015-01-13
申请号：US13521714
申请日：2011-01-13
申请人： Nobutaka Shimizu , Koji Hanya
发明人： Nobutaka Shimizu , Koji Hanya
IPC分类号： B32B1/00 , E04C2/32
CPC分类号： E04C2/326 , E04C2/32 , Y10T428/24479 , Y10T428/24628 , Y10T428/24661 , Y10T428/24669 , Y10T428/24678
摘要： A panel which includes, among protrusions protruding from a predetermined reference surface, flat sections being flush with the reference surface, and recesses being recessed from the reference surface, the protrusions, and the flat sections or recesses, wherein; when the panel includes the flat sections, the entire periphery of each of the protrusions is surrounded by the flat sections, and the entire periphery of each of the flat sections is surrounded by the protrusions, while when the panel includes the recesses, the entire periphery of each of the protrusions is surrounded by the recesses, and the entire periphery of each of the recesses is surrounded by the protrusions.
摘要翻译：其特征在于，在从规定的基准面突出的突起之间包括与所述基准面齐平的平坦部以及从所述基准面凹陷的凹部，所述突起和所述平坦部或凹部，当面板包括平坦部分时，每个突起的整个周边被平坦部分包围，并且每个平坦部分的整个周边被突起包围，而当面板包括凹部时，整个周边每个突起被凹部包围，并且每个凹部的整个周边被突起包围。

6. 发明申请

US20120295065A1 PANEL 有权
标题翻译：面板
公开(公告)号：US20120295065A1
公开(公告)日：2012-11-22
申请号：US13521714
申请日：2011-01-13
申请人： Nobutaka Shimizu , Koji Hanya
发明人： Nobutaka Shimizu , Koji Hanya
IPC分类号： B32B3/30
CPC分类号： E04C2/326 , E04C2/32 , Y10T428/24479 , Y10T428/24628 , Y10T428/24661 , Y10T428/24669 , Y10T428/24678
摘要： A panel which includes, among protrusions protruding from a predetermined reference surface, flat sections being flush with the reference surface, and recesses being recessed from the reference surface, the protrusions, and the flat sections or recesses, wherein; when the panel includes the flat sections, the entire periphery of each of the protrusions is surrounded by the flat sections, and the entire periphery of each of the flat sections is surrounded by the protrusions, while when the panel includes the recesses, the entire periphery of each of the protrusions is surrounded by the recesses, and the entire periphery of each of the recesses is surrounded by the protrusions.
摘要翻译：其特征在于，在从规定的基准面突出的突起之间包括与所述基准面齐平的平坦部以及从所述基准面凹陷的凹部，所述突起和所述平坦部或凹部，当面板包括平坦部分时，每个突起的整个周边被平坦部分包围，并且每个平坦部分的整个周边被突起包围，而当面板包括凹部时，整个周边每个突起被凹部包围，并且每个凹部的整个周边被突起包围。

7. 发明授权

US09069886B2 Home medical apparatus 有权
标题翻译：家用医疗器械
公开(公告)号：US09069886B2
公开(公告)日：2015-06-30
申请号：US13240393
申请日：2011-09-22
申请人： Nobutaka Shimizu , Suguru Saotome , Takumi Shioya
发明人： Nobutaka Shimizu , Suguru Saotome , Takumi Shioya
IPC分类号： A61M1/00 , G06F3/00 , G06F19/00 , A61M5/142 , A61M1/28
CPC分类号： G06F19/323 , A61M1/28 , A61M5/14244 , A61M2005/14272 , A61M2205/12 , A61M2205/502 , G06F19/00 , G16H10/65
摘要： A home medical apparatus can give explanations corresponding to the levels of proficiency in operation when explaining to a patient about operation procedures. A home medical apparatus according to this invention includes a selection unit which selects an explanation mode corresponding to the level of proficiency in operation, a storage unit which stores a plurality of display windows classified to the respective explanation modes upon associating them with each other between adjacent levels, and a display control unit which displays the display windows classified to the selected explanation mode in a predetermined order. When a detailed explanation button is pressed, the display control unit makes transition to a display window classified to an explanation mode one level lower than the current explanation mode.
摘要翻译：当向患者解释操作程序时，家庭医疗设备可以对应于操作熟练程度的解释。根据本发明的家用医疗设备包括：选择单元，其选择与操作能力水平相对应的说明模式;存储单元，存储在相邻的解释模式之间相关联的多个显示窗口电平和显示控制单元，其以预定顺序显示分类为所选择的说明模式的显示窗口。当按下详细说明按钮时，显示控制单元转换到分类为比当前说明模式低一级的说明模式的显示窗口。

8. 发明授权

US07754534B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07754534B2
公开(公告)日：2010-07-13
申请号：US12081723
申请日：2008-04-21
申请人： Nobukatsu Saito , Masaharu Minamizawa , Yoshiyuki Yoneda , Nobutaka Shimizu , Kazuyuki Imamura , Atsushi Kikuchi , Tadahiro Okamoto , Eiji Watanabe
发明人： Nobukatsu Saito , Masaharu Minamizawa , Yoshiyuki Yoneda , Nobutaka Shimizu , Kazuyuki Imamura , Atsushi Kikuchi , Tadahiro Okamoto , Eiji Watanabe
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , H01L21/4857 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49822 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2224/05001 , H01L2224/05008 , H01L2224/05023 , H01L2224/05024 , H01L2224/05571 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/75315 , H01L2224/75755 , H01L2224/7598 , H01L2224/81005 , H01L2224/83005 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.
摘要翻译：提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件，半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口通过可剥离树脂层或通过除去可剥离树脂层。

9. 发明授权

US5081067A Ceramic package type semiconductor device and method of assembling the same 失效
标题翻译：陶瓷封装型半导体器件及其组装方法
公开(公告)号：US5081067A
公开(公告)日：1992-01-14
申请号：US698030
申请日：1991-05-10
申请人： Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
发明人： Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
IPC分类号： H01L23/04 , H01L23/057 , H01L23/367 , H01L23/498
CPC分类号： H01L23/04 , H01L23/057 , H01L23/367 , H01L23/49827 , H01L2924/0002 , H01L2924/01079 , H01L2924/15312 , Y10T29/49144
摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

10. 发明授权

US5055914A Ceramic package type semiconductor device and method of assembling the same 失效
标题翻译：陶瓷封装型半导体器件及其组装方法
公开(公告)号：US5055914A
公开(公告)日：1991-10-08
申请号：US477404
申请日：1990-02-09
申请人： Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
发明人： Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
IPC分类号： H01L23/04 , H01L23/057 , H01L23/367 , H01L23/498
CPC分类号： H01L23/04 , H01L23/057 , H01L23/367 , H01L23/49827 , H01L2924/0002 , H01L2924/01079 , H01L2924/15312 , Y10T29/49144
摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring pattern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

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