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    • 3. 发明授权
    • Process for producing a semiconductor device
    • 半导体装置的制造方法
    • US4343657A
    • 1982-08-10
    • US174134
    • 1980-07-31
    • Takashi ItoHajime IshikawaMasaichi Shinoda
    • Takashi ItoHajime IshikawaMasaichi Shinoda
    • H01L21/283H01L21/318H01L21/32H01L21/336H01L21/8242H01L27/10H01L27/108H01L29/78H01L21/22
    • H01L27/1085H01L21/3185H01L21/32H01L27/10805H01L29/66575H01L29/78
    • In the production of a semiconductor device including an MISFET or a one transistor-one capacitor-memory cell, the excellent oxidation resistance of a silicon nitride film formed by direct nitridation, as well as the great oxidation tendency of a covering layer made of, for example, polycrystalline silicon selectively formed on the silicon nitride film, are utilized so as to form various regions of the semiconductor device in self alignment and to prevent a short circuit between such regions.A process according to the present invention comprises the steps of: selectively covering a semiconductor substrate with a relatively thick field insulation film; forming, on the exposed part of the semiconductor substrate, a relatively thin nitride film by direct nitridation; and selectively forming a film of silicon or a metal silicide on the silicon nitride film. A capacitor made of the silicon nitride is formed between the silicon or silicide film and the semiconductor substrate. The capacitor may be one for storing information.
    • 在制造包括MISFET或一个晶体管一个电容器存储单元的半导体器件中,通过直接氮化形成的氮化硅膜的优异的抗氧化性,以及由 例如,选择性地形成在氮化硅膜上的多晶硅被利用,以便自对准地形成半导体器件的各个区域并防止这些区域之间的短路。 根据本发明的方法包括以下步骤:用相对较厚的场绝缘膜选择性地覆盖半导体衬底; 通过直接氮化在半导体衬底的暴露部分上形成相对较薄的氮化物膜; 并且在氮化硅膜上选择性地形成硅或金属硅化物的膜。 在硅或硅化物膜和半导体衬底之间形成由氮化硅制成的电容器。 电容器可以是用于存储信息的电容器。