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    • 5. 发明授权
    • Variable size capture pads for multilayer ceramic substrates and
connectors therefor
    • 用于多层陶瓷基板的可变尺寸捕获垫及其连接器
    • US5315485A
    • 1994-05-24
    • US953564
    • 1992-09-29
    • Paul A. MagillNicholas G. KoopmanGlenn A. Rinne
    • Paul A. MagillNicholas G. KoopmanGlenn A. Rinne
    • H01L23/538H05K1/11
    • H01L23/5383H01L2924/0002
    • Capture pads of variable size are provided on the face of a multilayer ceramic substrate, to accommodate the actual shrinkage tolerance of the substrate at each capture pad position. For example, assuming a minimum shrinkage reference point is at the center of the substrate face, the capture pad size is relatively large adjacent the edges of the substrate face and relatively small adjacent the center of the substrate face. By sizing each capture pad based on the maximum positional variation at the particular capture pad position, higher contact density is obtainable than with known uniform size capture pads. The variable size capture pads may also be used at one or more rows of capture pads located along one or more edges of the substrate, for electrical connection to an edge connector. For example, assuming a minimum shrinkage reference point at the center of the row, the capture pads are relatively large adjacent the ends of the row of capture pads and are relatively small adjacent the center of the row. Edge connectors with variable spacing of edge connector contacts are also provided. Capacitive ground plane coupling to the variable size capture pads is made uniform by providing a uniform size ground plane region adjacent each capture pad, with the uniform size being smaller than the smallest capture pad. A high density microelectronic substrate is thereby obtained without degrading the performance of the substrate.
    • 在多层陶瓷基板的表面上设置可变尺寸的捕获垫,以适应每个捕获垫位置处的基板的实际收缩公差。 例如,假设最小收缩参考点位于基板面的中心,捕获垫尺寸在基板面的边缘附近相对较大,并且邻近基板面的中心相对较小。 通过基于特定捕获垫位置处的最大位置变化来调整每个捕获垫的尺寸,可获得比已知的均匀尺寸捕获垫更高的接触密度。 可变尺寸捕获垫还可以用于沿着衬底的一个或多个边缘定位的一行或多行捕获垫,用于电连接到边缘连接器。 例如,假设在行的中心处的最小收缩参考点,捕获垫相邻于捕获垫行的端部相对较大并且在行的中心附近相对较小。 还提供了具有可变间距的边缘连接器触点的边缘连接器。 通过提供与每个捕获垫相邻的均匀尺寸的接地平面区域,与可变尺寸捕获垫耦合的电容式接地平面是均匀的,其均匀尺寸小于最小捕获垫。 由此获得高密度微电子衬底而不降低衬底的性能。
    • 6. 发明授权
    • Electrical connector including variably spaced connector contacts
    • 电连接器包括可变间隔的连接器触点
    • US5412537A
    • 1995-05-02
    • US202348
    • 1994-02-28
    • Paul A. MagillNicholas G. KoopmanGlenn A. Rinne
    • Paul A. MagillNicholas G. KoopmanGlenn A. Rinne
    • H01L23/538H05K1/02
    • H01L23/5383H01L2924/0002
    • An electrical connector includes a housing and a row of connector contacts coupled to the housing. The row of connector contacts has a predetermined center-to-center spacing between adjacent contacts, with the predetermined center-to-center spacing being relatively large relatively far from an imaginary reference point in the row of connector contacts, and being relatively small relatively near the imaginary reference point in the row of connector contacts. The imaginary reference point is preferably at the center of the row of contacts, and the center-to-center contact spacing preferably progressively increases from the center of the row to the ends of the row. The size of the connector contacts may also progressively increase as well. The electrical connector is preferably adapted for use with a multilayer ceramic substrate which includes a row of capture pads of the same predetermined center-to-center spacing at the edge thereof. The variable center-to-center spacing ensures electrical connection to a conductor filled via in the multilayer ceramic substrate notwithstanding variability and location of the respective via due to shrinkage of the substrate during fabrication thereof.
    • 电连接器包括壳体和连接到壳体的一排连接器触头。 连接器触点列在相邻触点之间具有预定的中心到中心的间隔,其中预定的中心到中心的间隔相对于相对远离连接器触点列中的虚拟参考点相对较大,并且相对较小 连接器触点行中的虚拟参考点。 虚拟参考点优选地位于触点列的中心,并且中心到中心的接触间隔优选地从行的中心到行的端部逐渐增加。 连接器触头的尺寸也可以逐渐增加。 电连接器优选适于与多层陶瓷基板一起使用,该多层陶瓷基板在其边缘处包括一排具有相同预定中心间距的捕获垫。 尽管在其制造期间由于基板的收缩而导致相应通孔的变化和位置,但是可变的中心到中心间隔确保了与多层陶瓷基板中的经填充的导体的电连接。
    • 9. 发明授权
    • Fluxless soldering sample pretreating system
    • 无焊锡样品预处理系统
    • US5499754A
    • 1996-03-19
    • US339770
    • 1994-11-15
    • Stephen M. BobbioNicholas G. KoopmanSundeep Nangalia
    • Stephen M. BobbioNicholas G. KoopmanSundeep Nangalia
    • B23K1/20B23K35/38H05K3/34C23F1/02B23K3/08
    • B23K35/38B23K1/20B23K2201/36H05K3/3489
    • A fluxless soldering sample pretreating system includes a sample chamber having an opening therein and a sample holder. A sample chamber extension extends outwardly from the opening to define a passageway from the sample chamber extension, through the opening, and into the sample chamber. A fluorine-containing gas is supplied into the sample chamber extension. Am energy source such as a microwave oven surrounds the sample chamber extension. The microwave oven produces microwave energy in the sample chamber extension to form a plasma therein and dissociate the fluorine-containing gas into atomic fluorine. A perforated aluminum plate extends transversely across the passageway and blocks the plasma from traversing the passageway from the sample chamber extension into the sample chamber, while allowing the atomic fluorine to traverse the passageway from the sample chamber extension into the sample holder. A second chamber extension, gas supply and microwave oven may be added to improve uniformity for large samples.
    • 无助焊剂样品预处理系统包括其中具有开口的样品室和样品保持器。 样品室延伸部从开口向外延伸以限定从样品室延伸部穿过开口并进入样品室的通道。 向样品室延伸部供给含氟气体。 诸如微波炉的能量源围绕样品室延伸。 微波炉在样品室延伸部中产生微波能量,在其中形成等离子体,并将含氟气体解离为原子氟。 穿孔铝板横向延伸穿过通道,并阻止等离子体横穿从样品室延伸部进入样品室的通道,同时允许原子氟穿过从样品室延伸部分进入样品架的通道。 可以添加第二室延伸,气体供应和微波炉以改善大样品的均匀性。